JPWO2018105391A1 - 電子回路ユニット、撮像ユニットおよび内視鏡 - Google Patents
電子回路ユニット、撮像ユニットおよび内視鏡 Download PDFInfo
- Publication number
- JPWO2018105391A1 JPWO2018105391A1 JP2018519995A JP2018519995A JPWO2018105391A1 JP WO2018105391 A1 JPWO2018105391 A1 JP WO2018105391A1 JP 2018519995 A JP2018519995 A JP 2018519995A JP 2018519995 A JP2018519995 A JP 2018519995A JP WO2018105391 A1 JPWO2018105391 A1 JP WO2018105391A1
- Authority
- JP
- Japan
- Prior art keywords
- metal tube
- core wire
- electronic circuit
- circuit unit
- connection land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 91
- 229910052751 metal Inorganic materials 0.000 claims abstract description 91
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000009792 diffusion process Methods 0.000 claims abstract description 5
- 230000003287 optical effect Effects 0.000 claims description 34
- 238000005304 joining Methods 0.000 claims description 26
- 238000003780 insertion Methods 0.000 claims description 20
- 230000037431 insertion Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000004904 shortening Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 15
- 238000005452 bending Methods 0.000 description 13
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000007373 indentation Methods 0.000 description 7
- 239000006059 cover glass Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001727 in vivo Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
- A61B1/051—Details of CCD assembly
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/0011—Manufacturing of endoscope parts
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00114—Electrical cables in or with an endoscope
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
- A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2476—Non-optical details, e.g. housings, mountings, supports
- G02B23/2484—Arrangements in relation to a camera or imaging device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/0009—Details relating to the conductive cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
- H01B7/20—Metal tubes, e.g. lead sheaths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/12—Connectors or connections adapted for particular applications for medicine and surgery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Surgery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Radiology & Medical Imaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Public Health (AREA)
- General Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Animal Behavior & Ethology (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Astronomy & Astrophysics (AREA)
- Manufacturing & Machinery (AREA)
- Endoscopes (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Abstract
Description
図1は、本発明の実施の形態にかかる内視鏡システムの全体構成を模式的に示す図である。図1に示すように、内視鏡システム1は、内視鏡2と、ユニバーサルコード6と、コネクタ7と、光源装置9と、プロセッサ(制御装置)10と、表示装置13とを備える。
図8は、本発明の実施の形態2にかかる撮像ユニット140の斜視図である。図9は、図8の撮像ユニット140の分解斜視図である。図10は、接続ランドへ132の信号ケーブル148の接合を説明する側面図である。
図13は、本発明の実施の形態3にかかる撮像ユニット140Bの側面図である。
2 内視鏡
4 挿入部
5 操作部
6 ユニバーサルコード
7 コネクタ
9 光源装置
10 プロセッサ
13 表示装置
17 処置具挿入口
31 先端部
32 湾曲部
33 可撓管部
35 撮像装置
40、40A、40B、140、140B、140C 撮像ユニット
41 先端部本体
41a、54b 接着剤
42 被覆管
43 レンズユニット
43a−1〜43a−4 対物レンズ
43b レンズホルダ
44、111 撮像素子
45 回路基板
46 積層基板
47 電気ケーブル束
48、148 信号ケーブル
48a、148a 芯線
48b、148b 外皮
48c、148c 金属管
48d、148d 圧痕
49、112 カバーガラス
50 熱収縮チューブ
51 接着樹脂
52 補強部材
53 撮像素子ホルダ
55〜58 電子部品
61、62、63、132、132c、133 接続ランド
81 湾曲管
82 湾曲ワイヤ
110 半導体パッケージ
120 第1の回路基板
130 第2の回路基板
149 同軸ケーブル
149a 芯線
149b 内部絶縁体
149c、149g 金属管
149d、149h 圧痕
149e 外皮
149f シールド
Claims (12)
- 細線を撚り合せた芯線を外皮で被覆してなり、一端の前記外皮が除去されて前記芯線が露出するケーブルと、
筒状をなし、孔部に露出した前記芯線が挿入されている金属管と、
前記芯線を接続する接続ランドを有する基板と、
を備え、露出した前記芯線は、前記接続ランドに前記金属管を介して拡散接合または超音波接合により接続されていることを特徴とする電子回路ユニット。 - 前記金属管は、前記接続ランドの表面を構成する材料と同一の材料からなることを特徴とする請求項1に記載の電子回路ユニット。
- 前記金属管は、前記芯線の材料より硬度が小さい材料からなることを特徴とする請求項1に記載の電子回路ユニット。
- 前記金属管は円筒状をなすことを特徴とする請求項1に記載の電子回路ユニット。
- 前記金属管の材料は金からなり、メッキ法により形成されていることを特徴とする請求項1に記載の電子回路ユニット。
- 前記接続ランドに溝が形成されていることを特徴とする請求項1に記載の電子回路ユニット。
- 光を受光して光電変換を行うことにより電気信号を生成する撮像素子と、
請求項1に記載の電子回路ユニットと、
を備えることを特徴とする撮像ユニット。 - 前記撮像素子の光軸方向に前記撮像素子から延出するフレキシブルプリント基板をさらに有し、
前記電子回路ユニットを構成する基板は、前記フレキシブルプリント基板の表面に形成された積層基板であって、該積層基板には電子部品が実装され、
前記電子回路ユニットおよび前記電子部品は、前記撮像素子の光軸方向の投影面内に位置することを特徴とする請求項7に記載の撮像ユニット。 - 前記撮像素子の裏面側に形成されたセンサ電極に第1の電極パッドにより接続され、電子部品が実装される回路基板をさらに有し、
前記電子回路ユニットを構成する基板は、前記回路基板の裏面側に形成される第2の電極パッドに接続される異形基板であって、
前記電子回路ユニットは、前記撮像素子の光軸方向の投影面内に位置することを特徴とする請求項7に記載の撮像ユニット。 - 前記撮像素子の裏面側に形成されたセンサ電極に第1の電極パッドにより接続される回路基板をさらに有し、
前記電子回路ユニットを構成する基板は、前記回路基板の裏面側に形成される第2の電極パッドに接続されるフレキシブルプリント基板であって、該フレキシブルプリント基板には電子部品が実装され、
前記電子回路ユニットおよび前記電子部品は、前記撮像素子の光軸方向の投影面内に位置することを特徴とする請求項7に記載の撮像ユニット。 - 請求項7に記載の撮像ユニットが先端に設けられた挿入部を備えたことを特徴とする内視鏡。
- ケーブルと、基板の接続ランドとを電気的および機械的に接続した電子回路ユニットの接続方法において、
前記ケーブルの一端の被覆を除去し、細線を撚り合せた芯線を露出する工程と、
露出した前記芯線に金属管を被せる工程と、
前記接続ランド上に前記金属管を被せた芯線を載置し、前記金属管上を押圧しながら、拡散接合または超音波接合により、前記接続ランドと前記金属管、および前記金属管と前記芯線とを接合する工程と、
を含むことを特徴とする電子回路ユニットの接続方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016235802 | 2016-12-05 | ||
JP2016235802 | 2016-12-05 | ||
PCT/JP2017/041903 WO2018105391A1 (ja) | 2016-12-05 | 2017-11-21 | 電子回路ユニット、撮像ユニット、内視鏡および電子回路ユニットの接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018105391A1 true JPWO2018105391A1 (ja) | 2018-12-13 |
JP6464321B2 JP6464321B2 (ja) | 2019-02-06 |
Family
ID=62490898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018519995A Active JP6464321B2 (ja) | 2016-12-05 | 2017-11-21 | 電子回路ユニット、撮像ユニットおよび内視鏡 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10653306B2 (ja) |
JP (1) | JP6464321B2 (ja) |
CN (1) | CN109788892B (ja) |
DE (1) | DE112017006139T5 (ja) |
WO (1) | WO2018105391A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6742358B2 (ja) * | 2018-04-04 | 2020-08-19 | 株式会社フジクラ | 撮像ユニット |
JP6643396B2 (ja) * | 2018-05-09 | 2020-02-12 | 株式会社フジクラ | 立体配線基板、撮像ユニット |
CN111714074A (zh) * | 2019-03-21 | 2020-09-29 | 艾沙技术有限公司 | 内视镜装置的结构 |
JP6792661B2 (ja) * | 2019-03-27 | 2020-11-25 | Hoya株式会社 | 撮像モジュール及び内視鏡 |
JP7015413B2 (ja) | 2019-08-28 | 2022-02-02 | 住友理工株式会社 | 静電型トランスデューサおよびその製造方法 |
JP7066098B1 (ja) | 2020-11-30 | 2022-05-13 | 住友理工株式会社 | 静電型トランスデューサ |
JP7302627B2 (ja) | 2021-06-11 | 2023-07-04 | 株式会社プロテリアル | 電線接続構造、電線接続方法、医療器具、及び医療器具の製造方法 |
JP2023109615A (ja) | 2022-01-27 | 2023-08-08 | 住友理工株式会社 | 静電型トランスデューサ |
WO2023233524A1 (ja) * | 2022-05-31 | 2023-12-07 | オリンパスメディカルシステムズ株式会社 | 撮像ユニット,内視鏡 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003017531A (ja) * | 2001-07-02 | 2003-01-17 | Toshiba Corp | 半導体装置 |
JP3163214U (ja) * | 2010-05-17 | 2010-10-07 | 富士電機システムズ株式会社 | 半導体装置 |
JP2011188375A (ja) * | 2010-03-10 | 2011-09-22 | Olympus Corp | 撮像装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04235475A (ja) * | 1991-01-10 | 1992-08-24 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH0982447A (ja) * | 1995-09-12 | 1997-03-28 | Sumitomo Wiring Syst Ltd | 電線接続方法 |
JP2000199863A (ja) * | 1999-01-07 | 2000-07-18 | Sony Corp | 固体撮像装置 |
JP2003320911A (ja) * | 2002-04-26 | 2003-11-11 | Sumitomo Electric Ind Ltd | 車載制御システム、制御装置、及び中継装置 |
JP4422391B2 (ja) | 2002-08-07 | 2010-02-24 | 矢崎総業株式会社 | 電線と端子の接続方法 |
CN100532095C (zh) * | 2004-10-08 | 2009-08-26 | 贝尔直升机泰克斯特龙公司 | 超声波处理层叠件的设备和方法 |
JP2006298084A (ja) * | 2005-04-19 | 2006-11-02 | Auto Network Gijutsu Kenkyusho:Kk | ワイヤハーネスへの電子制御ユニット取付構造 |
JP2007305314A (ja) * | 2006-05-08 | 2007-11-22 | Hitachi Cable Ltd | 接続端子付きケーブルとその製造方法、並びに接続端子とケーブルとの超音波溶接方法および超音波溶接機 |
JP2011222311A (ja) * | 2010-04-09 | 2011-11-04 | Yazaki Corp | 電線接続方法及びワイヤハーネス |
JP2012074330A (ja) * | 2010-09-30 | 2012-04-12 | Hitachi Ltd | 超電導線材の製造方法、および超電導線材 |
JP2012089288A (ja) * | 2010-10-18 | 2012-05-10 | Olympus Corp | ケーブル接続構造、内視鏡装置およびケーブル接続方法 |
EP2561796B1 (en) * | 2011-03-15 | 2016-01-06 | Olympus Corporation | Electronic endoscope and endoscope system |
JP2013125267A (ja) * | 2011-12-16 | 2013-06-24 | Sekisui Chem Co Ltd | 圧着式フェルール |
WO2014192386A1 (ja) * | 2013-05-27 | 2014-12-04 | オリンパスメディカルシステムズ株式会社 | 内視鏡 |
JP6307227B2 (ja) * | 2013-06-28 | 2018-04-04 | オリンパス株式会社 | 撮像ユニットおよび内視鏡装置 |
JP5767414B2 (ja) * | 2013-08-05 | 2015-08-19 | オリンパス株式会社 | 内視鏡用撮像ユニット |
JP6210797B2 (ja) | 2013-08-26 | 2017-10-11 | オリンパス株式会社 | 内視鏡 |
JP5806343B2 (ja) * | 2014-01-16 | 2015-11-10 | ソニー・オリンパスメディカルソリューションズ株式会社 | 光電複合モジュール、カメラヘッド、及び内視鏡装置 |
JP6261486B2 (ja) * | 2014-10-23 | 2018-01-17 | オリンパス株式会社 | 実装構造体、撮像モジュールおよび内視鏡装置 |
EP3231350A4 (en) * | 2014-12-08 | 2018-08-01 | Olympus Corporation | Imaging unit, imaging module, and endoscope system |
KR101782035B1 (ko) * | 2015-05-18 | 2017-09-28 | 태양쓰리시 주식회사 | 초극세 케이블 및 이의 제조 방법 |
WO2017122335A1 (ja) * | 2016-01-14 | 2017-07-20 | オリンパス株式会社 | 撮像装置、内視鏡および撮像装置の製造方法 |
-
2017
- 2017-11-21 DE DE112017006139.3T patent/DE112017006139T5/de not_active Withdrawn
- 2017-11-21 CN CN201780059228.XA patent/CN109788892B/zh active Active
- 2017-11-21 WO PCT/JP2017/041903 patent/WO2018105391A1/ja active Application Filing
- 2017-11-21 JP JP2018519995A patent/JP6464321B2/ja active Active
-
2019
- 2019-03-20 US US16/358,938 patent/US10653306B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003017531A (ja) * | 2001-07-02 | 2003-01-17 | Toshiba Corp | 半導体装置 |
JP2011188375A (ja) * | 2010-03-10 | 2011-09-22 | Olympus Corp | 撮像装置 |
JP3163214U (ja) * | 2010-05-17 | 2010-10-07 | 富士電機システムズ株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN109788892B (zh) | 2021-10-12 |
US10653306B2 (en) | 2020-05-19 |
US20190216304A1 (en) | 2019-07-18 |
JP6464321B2 (ja) | 2019-02-06 |
CN109788892A (zh) | 2019-05-21 |
DE112017006139T5 (de) | 2019-08-22 |
WO2018105391A1 (ja) | 2018-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6464321B2 (ja) | 電子回路ユニット、撮像ユニットおよび内視鏡 | |
US10574866B2 (en) | Imaging unit and endoscope apparatus | |
JP5964003B1 (ja) | 撮像ユニット、撮像モジュールおよび内視鏡システム | |
JP6358806B2 (ja) | ケーブル実装構造体、ケーブル接続構造体、内視鏡装置 | |
US20160209637A1 (en) | Imaging module and endoscope apparatus | |
JP5973761B2 (ja) | ケーブル接続構造 | |
CN109068967B (zh) | 电子电路单元、摄像单元、摄像模块以及内窥镜 | |
JP6570657B2 (ja) | 撮像装置、内視鏡および撮像装置の製造方法 | |
US10617285B2 (en) | Imaging module with multi-layer substrate and endoscope apparatus | |
US10734355B2 (en) | Electronic circuit board, laminated board, and method of manufacturing electronic circuit board | |
JP2012089288A (ja) | ケーブル接続構造、内視鏡装置およびケーブル接続方法 | |
JP6537508B2 (ja) | ケーブル接続構造および内視鏡装置 | |
JP6099541B2 (ja) | 内視鏡及び内視鏡の製造方法 | |
JP6487094B2 (ja) | ケーブル実装構造体、ケーブル接続構造体、内視鏡装置およびケーブル実装構造体の製造方法 | |
JP6132963B2 (ja) | ケーブル接続構造、超音波探触子および超音波内視鏡システム | |
JP6209288B2 (ja) | 撮像装置の小型化 | |
WO2017115441A1 (ja) | 実装構造体、撮像装置および内視鏡 | |
CN115363511A (zh) | 内窥镜摄像装置及内窥镜 | |
JP2015080633A (ja) | 電気ユニット及び電気ユニットを用いた内視鏡装置 | |
JPH0961730A (ja) | 撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180824 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181026 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181218 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190107 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6464321 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |