JP6209288B2 - 撮像装置の小型化 - Google Patents
撮像装置の小型化 Download PDFInfo
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- JP6209288B2 JP6209288B2 JP2016552641A JP2016552641A JP6209288B2 JP 6209288 B2 JP6209288 B2 JP 6209288B2 JP 2016552641 A JP2016552641 A JP 2016552641A JP 2016552641 A JP2016552641 A JP 2016552641A JP 6209288 B2 JP6209288 B2 JP 6209288B2
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- 238000003384 imaging method Methods 0.000 title description 72
- 239000004065 semiconductor Substances 0.000 claims description 109
- 239000011521 glass Substances 0.000 claims description 55
- 230000001681 protective effect Effects 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 54
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 230000002093 peripheral effect Effects 0.000 claims description 38
- 238000007789 sealing Methods 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 19
- 230000037431 insertion Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 27
- 238000005452 bending Methods 0.000 description 11
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
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- 238000005286 illumination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001727 in vivo Methods 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
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- 230000007797 corrosion Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
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- Power Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Optics & Photonics (AREA)
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- General Health & Medical Sciences (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
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- Public Health (AREA)
- Biophysics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Astronomy & Astrophysics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Endoscopes (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
図1は、本発明の実施の形態にかかる内視鏡システムの全体構成を模式的に示す図である。図1に示すように、内視鏡システム1は、内視鏡装置2と、ユニバーサルコード3と、コネクタ部5と、プロセッサ(制御装置)6と、表示装置7と、光源装置8とを備える。
図8は、本発明の実施の形態2にかかる撮像ユニットの部分断面図である。図8は、本発明の実施の形態2にかかる撮像ユニットの保護ガラス49と半導体チップ44Bの接続部の断面図を示している。図9は、図8の撮像ユニットで使用する半導体チップの平面図である。
図11は、本発明の実施の形態3にかかる撮像ユニットの部分断面図である。図11は、本発明の実施の形態3にかかる撮像ユニットの保護ガラス49と半導体チップ44の接続部の断面図を示している。
図12Aは、本発明の実施の形態4にかかる撮像ユニットの部分断面図である。図12Bは、本発明の実施の形態4にかかる撮像ユニットの正面図である。図12Aは、本発明の実施の形態4にかかる撮像ユニットの保護ガラス49と半導体チップ44Eの接続部の断面図を示している。
図13は、本発明の実施の形態5にかかる撮像ユニットで使用する半導体チップの平面図である。図14は、本発明の実施の形態5にかかる撮像ユニットの部分断面図であり、保護ガラスと半導体チップの接続部の断面図を示している。
2 内視鏡装置
3 ユニバーサルコード
3A 先端部
3B 湾曲部
3C 可撓管部
4 操作部
4a 処置具挿入口
5 コネクタ部
6 プロセッサ
7 表示装置
8 光源装置
35 撮像装置
40、40A、40B、40C、40D、40E、40F 撮像ユニット
41 先端部本体
41a 接着剤
42 被覆管
43 レンズユニット
43a−1〜43a−4 対物レンズ
43b レンズホルダ
44、44B、44E、44F 半導体チップ
44a 受光部
44b 周辺回路部
44c 電極パッド
44d ガードリング
44e メタルドット
44f 貫通電極
44g 裏面電極
44h バンプ
44i ダミー電極
44k 半導体基板
44m 絶縁層
45 フレキシブルプリント基板
45a インナーリード
46 封止樹脂
47 電気ケーブル束
48 信号ケーブル
49 保護ガラス
50 熱収縮チューブ
51 接着樹脂
52 補強部材
53 撮像素子ホルダ
54a、54b 封止樹脂
54c 接着層
55〜57 電子部品
81 湾曲管
82 湾曲ワイヤ
Claims (2)
- 撮像素子が形成された半導体チップと、前記撮像素子上に接着層を介して接着された保護ガラスと、前記半導体チップと接続されたフレキシブルプリント基板と、前記保護ガラスを内周に嵌め込んで保持する撮像素子ホルダと、を有する撮像ユニットを挿入部の先端部に備え、
前記半導体チップは、
光を光電変換して画像信号を生成する受光部と、
前記受光部から画像信号を受信するとともに、前記受光部へ駆動信号を送信する周辺回路部と、
電極パッドと、
前記受光部、前記周辺回路部および前記電極パッドの周囲を取り囲むガードリングと、
前記ガードリングの外周に形成された複数のメタルドットと、を備え、
前記電極パッドには、前記フレキシブルプリント基板のインナーリードがバンプを介して接続され、
前記保護ガラスは、前記受光部と前記周辺回路部とを覆い、前記ガードリングと前記メタルドットの一部を覆うように前記接着層により前記半導体チップへ接着され、
前記保護ガラスにより覆われていない前記インナーリード、前記バンプ、および前記電極パッド上には封止樹脂が充填され、前記保護ガラスの側面と接着され、
前記メタルドットは、前記ガードリングの外周から前記半導体チップと前記保護ガラスとの接続端部にまで全体にわたって等間隔に形成されていることを特徴とする内視鏡装置。 - 前記ガードリングおよび前記メタルドットは、それぞれ前記受光部が形成された半導体基板上に積層された複数の絶縁部材に形成されたダミービアおよびダミーパッドからなり、
複数の前記絶縁部材はLow−k膜であることを特徴とする請求項1に記載の内視鏡装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048711 | 2015-03-11 | ||
JP2015048711 | 2015-03-11 | ||
PCT/JP2015/081480 WO2016143195A1 (ja) | 2015-03-11 | 2015-11-09 | 撮像装置の小型化 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016143195A1 JPWO2016143195A1 (ja) | 2017-04-27 |
JP6209288B2 true JP6209288B2 (ja) | 2017-10-04 |
Family
ID=56880104
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Application Number | Title | Priority Date | Filing Date |
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JP2016552641A Active JP6209288B2 (ja) | 2015-03-11 | 2015-11-09 | 撮像装置の小型化 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170360284A1 (ja) |
EP (1) | EP3270418A4 (ja) |
JP (1) | JP6209288B2 (ja) |
CN (1) | CN107408561A (ja) |
WO (1) | WO2016143195A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11710757B2 (en) | 2020-08-13 | 2023-07-25 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094843A (ja) * | 1999-09-20 | 2001-04-06 | Olympus Optical Co Ltd | 撮像装置 |
JP2004153015A (ja) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP4222979B2 (ja) * | 2004-07-28 | 2009-02-12 | Necエレクトロニクス株式会社 | 半導体装置 |
JP2008270232A (ja) * | 2005-07-08 | 2008-11-06 | Renesas Technology Corp | 半導体装置 |
JP2009064839A (ja) * | 2007-09-04 | 2009-03-26 | Panasonic Corp | 光学デバイス及びその製造方法 |
KR100866619B1 (ko) * | 2007-09-28 | 2008-11-03 | 삼성전기주식회사 | 웨이퍼 레벨의 이미지센서 모듈 및 그 제조방법, 그리고카메라 모듈 |
JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
JP5721981B2 (ja) * | 2010-09-10 | 2015-05-20 | オリンパス株式会社 | 撮像ユニットおよび撮像ユニットを具備する内視鏡 |
WO2014174994A1 (ja) * | 2013-04-26 | 2014-10-30 | オリンパス株式会社 | 撮像装置 |
JP6270335B2 (ja) * | 2013-04-26 | 2018-01-31 | オリンパス株式会社 | 撮像装置 |
-
2015
- 2015-11-09 EP EP15884679.0A patent/EP3270418A4/en not_active Withdrawn
- 2015-11-09 CN CN201580077584.5A patent/CN107408561A/zh active Pending
- 2015-11-09 WO PCT/JP2015/081480 patent/WO2016143195A1/ja active Application Filing
- 2015-11-09 JP JP2016552641A patent/JP6209288B2/ja active Active
-
2017
- 2017-09-05 US US15/695,194 patent/US20170360284A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11710757B2 (en) | 2020-08-13 | 2023-07-25 | Samsung Electronics Co., Ltd. | Semiconductor package and method of fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
CN107408561A (zh) | 2017-11-28 |
JPWO2016143195A1 (ja) | 2017-04-27 |
EP3270418A1 (en) | 2018-01-17 |
EP3270418A4 (en) | 2018-12-26 |
US20170360284A1 (en) | 2017-12-21 |
WO2016143195A1 (ja) | 2016-09-15 |
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