JP6187991B2 - 医療的位置および方向追跡で使用するためのセンサアセンブリ - Google Patents

医療的位置および方向追跡で使用するためのセンサアセンブリ Download PDF

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Publication number
JP6187991B2
JP6187991B2 JP2015520207A JP2015520207A JP6187991B2 JP 6187991 B2 JP6187991 B2 JP 6187991B2 JP 2015520207 A JP2015520207 A JP 2015520207A JP 2015520207 A JP2015520207 A JP 2015520207A JP 6187991 B2 JP6187991 B2 JP 6187991B2
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JP
Japan
Prior art keywords
layer
sensor assembly
thickness
solderable
orientation
Prior art date
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Expired - Fee Related
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JP2015520207A
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English (en)
Japanese (ja)
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JP2015523145A (ja
JP2015523145A5 (enExample
Inventor
ナガールカール、カウストゥバ・ラヴィンドラ
グローツマン，ダニエル・エデュアルド
ヒューバー，ウィリアム・ハリンジャー
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General Electric Co
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General Electric Co
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Publication of JP2015523145A5 publication Critical patent/JP2015523145A5/ja
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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/06—Devices, other than using radiation, for detecting or locating foreign bodies ; Determining position of diagnostic devices within or on the body of the patient
    • A61B5/061—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body
    • A61B5/062—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body using magnetic field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
    • G01R33/0035—Calibration of single magnetic sensors, e.g. integrated calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0094—Sensor arrays
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0223—Magnetic field sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/1624—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting between the body and an opposite side of the item with respect to the body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Human Computer Interaction (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Prostheses (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Surgical Instruments (AREA)
  • Endoscopes (AREA)
  • Measuring Magnetic Variables (AREA)
JP2015520207A 2012-06-29 2013-05-30 医療的位置および方向追跡で使用するためのセンサアセンブリ Expired - Fee Related JP6187991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/538,573 2012-06-29
US13/538,573 US8618795B1 (en) 2012-06-29 2012-06-29 Sensor assembly for use in medical position and orientation tracking
PCT/US2013/043356 WO2014003960A1 (en) 2012-06-29 2013-05-30 Sensor assembly for use in medical position and orientation tracking

Publications (3)

Publication Number Publication Date
JP2015523145A JP2015523145A (ja) 2015-08-13
JP2015523145A5 JP2015523145A5 (enExample) 2016-07-14
JP6187991B2 true JP6187991B2 (ja) 2017-08-30

Family

ID=48670780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015520207A Expired - Fee Related JP6187991B2 (ja) 2012-06-29 2013-05-30 医療的位置および方向追跡で使用するためのセンサアセンブリ

Country Status (5)

Country Link
US (1) US8618795B1 (enExample)
JP (1) JP6187991B2 (enExample)
CN (1) CN104411267A (enExample)
DE (1) DE112013003183T5 (enExample)
WO (1) WO2014003960A1 (enExample)

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US9638820B2 (en) * 2014-03-03 2017-05-02 Biosense Webster (Israel) Ltd. Calibration jig for a flat location pad
US10588541B2 (en) 2014-07-15 2020-03-17 General Electric Company Magnetic tracker system and method for use for surgical navigation
US10076267B2 (en) 2014-10-03 2018-09-18 General Electric Company Methods and systems for improved navigation
US10727122B2 (en) 2014-12-08 2020-07-28 International Business Machines Corporation Self-aligned via interconnect structures
US10426555B2 (en) * 2015-06-03 2019-10-01 Covidien Lp Medical instrument with sensor for use in a system and method for electromagnetic navigation
US9995600B2 (en) 2015-09-01 2018-06-12 General Electric Company Multi-axis magneto-resistance sensor package
WO2018144993A1 (en) * 2017-02-06 2018-08-09 Boston Scientific Scimed Inc. Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits
WO2019010361A1 (en) * 2017-07-06 2019-01-10 University Of Houston System BIOSENSOR FOR DETECTING A SINGLE MAGNETIC LABEL
JP6997918B2 (ja) 2017-12-03 2022-01-18 エンヴィジョン メディカル リミテッド 電磁センサ付き栄養チューブ
EP3712630B1 (en) * 2019-03-20 2021-04-28 LEM International SA Magnetic field sensor
KR20220036952A (ko) * 2019-07-12 2022-03-23 뉴럴링크 코포레이션 박막 전극 어레이 및 집적 회로를 위한 샌드위치 어셈블리 방식
JP7138261B1 (ja) * 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置

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US5558091A (en) * 1993-10-06 1996-09-24 Biosense, Inc. Magnetic determination of position and orientation
US6090498A (en) * 1996-12-27 2000-07-18 Tdk Corporation Magnetoresistance effect element and magnetoresistance device
JP3820300B2 (ja) * 1997-04-17 2006-09-13 日本電産サンキョー株式会社 磁気検出装置の製造方法
US6268662B1 (en) 1998-10-14 2001-07-31 Texas Instruments Incorporated Wire bonded flip-chip assembly of semiconductor devices
JP3651433B2 (ja) * 2001-09-28 2005-05-25 株式会社村田製作所 磁気センサ
US7309647B1 (en) * 2003-03-05 2007-12-18 Altera Corporation Method of mounting an electroless nickel immersion gold flip chip package
US6995957B2 (en) * 2003-03-18 2006-02-07 Hitachi Global Storage Technologies Netherland B.V. Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield
KR100604334B1 (ko) * 2003-11-25 2006-08-08 (주)케이나인 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법
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Also Published As

Publication number Publication date
US20140005517A1 (en) 2014-01-02
CN104411267A (zh) 2015-03-11
JP2015523145A (ja) 2015-08-13
DE112013003183T5 (de) 2015-03-19
US8618795B1 (en) 2013-12-31
WO2014003960A1 (en) 2014-01-03

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