CN104411267A - 供医疗位置和取向跟踪中使用的传感器组合件 - Google Patents
供医疗位置和取向跟踪中使用的传感器组合件 Download PDFInfo
- Publication number
- CN104411267A CN104411267A CN201380034558.5A CN201380034558A CN104411267A CN 104411267 A CN104411267 A CN 104411267A CN 201380034558 A CN201380034558 A CN 201380034558A CN 104411267 A CN104411267 A CN 104411267A
- Authority
- CN
- China
- Prior art keywords
- molectron
- orientation sensors
- chip
- contact pad
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 17
- 239000007943 implant Substances 0.000 claims description 16
- 238000005260 corrosion Methods 0.000 claims description 11
- 230000004888 barrier function Effects 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000010992 reflux Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000002318 adhesion promoter Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003491 array Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 210000003709 heart valve Anatomy 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 238000001356 surgical procedure Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 54
- 230000008569 process Effects 0.000 description 24
- 238000001465 metallisation Methods 0.000 description 21
- 238000000151 deposition Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000002792 vascular Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/06—Devices, other than using radiation, for detecting or locating foreign bodies ; Determining position of diagnostic devices within or on the body of the patient
- A61B5/061—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body
- A61B5/062—Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body using magnetic field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
- G01R33/0035—Calibration of single magnetic sensors, e.g. integrated calibration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0094—Sensor arrays
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0223—Magnetic field sensors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/04—Arrangements of multiple sensors of the same type
- A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/1624—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting between the body and an opposite side of the item with respect to the body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Heart & Thoracic Surgery (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Biomedical Technology (AREA)
- Human Computer Interaction (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Biophysics (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Prostheses (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Surgical Instruments (AREA)
- Endoscopes (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/538,573 US8618795B1 (en) | 2012-06-29 | 2012-06-29 | Sensor assembly for use in medical position and orientation tracking |
| US13/538573 | 2012-06-29 | ||
| PCT/US2013/043356 WO2014003960A1 (en) | 2012-06-29 | 2013-05-30 | Sensor assembly for use in medical position and orientation tracking |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411267A true CN104411267A (zh) | 2015-03-11 |
Family
ID=48670780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380034558.5A Pending CN104411267A (zh) | 2012-06-29 | 2013-05-30 | 供医疗位置和取向跟踪中使用的传感器组合件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8618795B1 (enExample) |
| JP (1) | JP6187991B2 (enExample) |
| CN (1) | CN104411267A (enExample) |
| DE (1) | DE112013003183T5 (enExample) |
| WO (1) | WO2014003960A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106482755A (zh) * | 2015-09-01 | 2017-03-08 | 通用电气公司 | 多轴磁阻传感器封装 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9638820B2 (en) * | 2014-03-03 | 2017-05-02 | Biosense Webster (Israel) Ltd. | Calibration jig for a flat location pad |
| US10588541B2 (en) | 2014-07-15 | 2020-03-17 | General Electric Company | Magnetic tracker system and method for use for surgical navigation |
| US10076267B2 (en) | 2014-10-03 | 2018-09-18 | General Electric Company | Methods and systems for improved navigation |
| US10727122B2 (en) | 2014-12-08 | 2020-07-28 | International Business Machines Corporation | Self-aligned via interconnect structures |
| US10426555B2 (en) * | 2015-06-03 | 2019-10-01 | Covidien Lp | Medical instrument with sensor for use in a system and method for electromagnetic navigation |
| WO2018144993A1 (en) * | 2017-02-06 | 2018-08-09 | Boston Scientific Scimed Inc. | Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits |
| US11821818B2 (en) | 2017-07-06 | 2023-11-21 | University Of Houston System | Biosensor for detecting a single magnetic label |
| JP6997918B2 (ja) | 2017-12-03 | 2022-01-18 | エンヴィジョン メディカル リミテッド | 電磁センサ付き栄養チューブ |
| EP3712630B1 (en) * | 2019-03-20 | 2021-04-28 | LEM International SA | Magnetic field sensor |
| JP2022541146A (ja) * | 2019-07-12 | 2022-09-22 | ニューラリンク コーポレーション | プリント回路基板（ｐｃｂ）が両面において薄膜電極アレイと複数の集積回路（ｉｃ）とで挟まれて配置される部品、および製造方法 |
| JP7138261B1 (ja) * | 2022-06-30 | 2022-09-15 | 旭化成エレクトロニクス株式会社 | 半導体パッケージ、及び駆動装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090127718A1 (en) * | 2007-11-15 | 2009-05-21 | Chen Singjang | Flip chip wafer, flip chip die and manufacturing processes thereof |
| US20100130853A1 (en) * | 2008-11-25 | 2010-05-27 | General Electric Company | System for tracking object |
| CN101869509A (zh) * | 2010-07-12 | 2010-10-27 | 大连医科大学 | 桡动脉穿刺定位装置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5558091A (en) * | 1993-10-06 | 1996-09-24 | Biosense, Inc. | Magnetic determination of position and orientation |
| US6090498A (en) * | 1996-12-27 | 2000-07-18 | Tdk Corporation | Magnetoresistance effect element and magnetoresistance device |
| JP3820300B2 (ja) * | 1997-04-17 | 2006-09-13 | 日本電産サンキョー株式会社 | 磁気検出装置の製造方法 |
| JP2000311915A (ja) | 1998-10-14 | 2000-11-07 | Texas Instr Inc <Ti> | 半導体デバイス及びボンディング方法 |
| JP3651433B2 (ja) * | 2001-09-28 | 2005-05-25 | 株式会社村田製作所 | 磁気センサ |
| US7309647B1 (en) * | 2003-03-05 | 2007-12-18 | Altera Corporation | Method of mounting an electroless nickel immersion gold flip chip package |
| US6995957B2 (en) * | 2003-03-18 | 2006-02-07 | Hitachi Global Storage Technologies Netherland B.V. | Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield |
| KR100604334B1 (ko) * | 2003-11-25 | 2006-08-08 | (주)케이나인 | 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법 |
| US7273803B2 (en) * | 2003-12-01 | 2007-09-25 | International Business Machines Corporation | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure |
| US7271586B2 (en) * | 2003-12-04 | 2007-09-18 | Honeywell International Inc. | Single package design for 3-axis magnetic sensor |
| US20060145715A1 (en) * | 2005-01-06 | 2006-07-06 | Salmon Peter C | Wafer level test head |
| US20080002460A1 (en) * | 2006-03-01 | 2008-01-03 | Tessera, Inc. | Structure and method of making lidded chips |
| US7451651B2 (en) | 2006-12-11 | 2008-11-18 | General Electric Company | Modular sensor assembly and methods of fabricating the same |
| CA2685080A1 (en) | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
| US20100099250A1 (en) * | 2008-10-21 | 2010-04-22 | Samsung Electronics Co., Ltd. | Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers |
| US9642555B2 (en) * | 2008-11-20 | 2017-05-09 | Medtronic, Inc. | Subcutaneous lead guidance |
| US8283921B2 (en) | 2008-11-26 | 2012-10-09 | General Electric Company | Magnetoresistance sensors for position and orientation determination |
| JP2010161136A (ja) * | 2009-01-07 | 2010-07-22 | Panasonic Corp | 半導体装置及びその製造方法 |
| US20100249571A1 (en) | 2009-03-31 | 2010-09-30 | General Electric Company | Surgical navigation system with wireless magnetoresistance tracking sensors |
| AU2009344197A1 (en) | 2009-04-08 | 2011-12-01 | Saluda Medical Pty Limited | Bonded hermetic feed through for an active implantable medical device |
| US8173446B2 (en) | 2009-12-21 | 2012-05-08 | General Electric Company | Method of producing an integrated micromagnet sensor assembly |
| US20110186980A1 (en) | 2010-02-03 | 2011-08-04 | Rfmarq, Inc. | Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages |
| TWM397597U (en) * | 2010-04-15 | 2011-02-01 | Di-Quan Hu | Package structure of integrated circuit |
-
2012
- 2012-06-29 US US13/538,573 patent/US8618795B1/en active Active
-
2013
- 2013-05-30 JP JP2015520207A patent/JP6187991B2/ja not_active Expired - Fee Related
- 2013-05-30 DE DE112013003183.3T patent/DE112013003183T5/de not_active Withdrawn
- 2013-05-30 WO PCT/US2013/043356 patent/WO2014003960A1/en not_active Ceased
- 2013-05-30 CN CN201380034558.5A patent/CN104411267A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090127718A1 (en) * | 2007-11-15 | 2009-05-21 | Chen Singjang | Flip chip wafer, flip chip die and manufacturing processes thereof |
| US20100130853A1 (en) * | 2008-11-25 | 2010-05-27 | General Electric Company | System for tracking object |
| CN101869509A (zh) * | 2010-07-12 | 2010-10-27 | 大连医科大学 | 桡动脉穿刺定位装置 |
Non-Patent Citations (1)
| Title |
|---|
| RICHARD K.ULRICH ET AL: "《高级电子封装》", 30 April 2010 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106482755A (zh) * | 2015-09-01 | 2017-03-08 | 通用电气公司 | 多轴磁阻传感器封装 |
| CN106482755B (zh) * | 2015-09-01 | 2021-03-09 | 通用电气公司 | 多轴磁阻传感器封装 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140005517A1 (en) | 2014-01-02 |
| JP2015523145A (ja) | 2015-08-13 |
| US8618795B1 (en) | 2013-12-31 |
| DE112013003183T5 (de) | 2015-03-19 |
| JP6187991B2 (ja) | 2017-08-30 |
| WO2014003960A1 (en) | 2014-01-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |