CN104411267A - 供医疗位置和取向跟踪中使用的传感器组合件 - Google Patents

供医疗位置和取向跟踪中使用的传感器组合件 Download PDF

Info

Publication number
CN104411267A
CN104411267A CN201380034558.5A CN201380034558A CN104411267A CN 104411267 A CN104411267 A CN 104411267A CN 201380034558 A CN201380034558 A CN 201380034558A CN 104411267 A CN104411267 A CN 104411267A
Authority
CN
China
Prior art keywords
sensor assembly
contact pads
orientation
chip
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380034558.5A
Other languages
English (en)
Chinese (zh)
Inventor
K.R.纳加卡
D.E.格罗什曼
W.H.休伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN104411267A publication Critical patent/CN104411267A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/06Devices, other than using radiation, for detecting or locating foreign bodies ; Determining position of diagnostic devices within or on the body of the patient
    • A61B5/061Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body
    • A61B5/062Determining position of a probe within the body employing means separate from the probe, e.g. sensing internal probe position employing impedance electrodes on the surface of the body using magnetic field
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/0023Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
    • G01R33/0035Calibration of single magnetic sensors, e.g. integrated calibration
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/0094Sensor arrays
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0223Magnetic field sensors
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04Arrangements of multiple sensors of the same type
    • A61B2562/046Arrangements of multiple sensors of the same type in a matrix array
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528Semiconductor component

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Human Computer Interaction (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Prostheses (AREA)
  • Surgical Instruments (AREA)
  • Endoscopes (AREA)
  • Measuring Magnetic Variables (AREA)
CN201380034558.5A 2012-06-29 2013-05-30 供医疗位置和取向跟踪中使用的传感器组合件 Pending CN104411267A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/538,573 US8618795B1 (en) 2012-06-29 2012-06-29 Sensor assembly for use in medical position and orientation tracking
US13/538573 2012-06-29
PCT/US2013/043356 WO2014003960A1 (en) 2012-06-29 2013-05-30 Sensor assembly for use in medical position and orientation tracking

Publications (1)

Publication Number Publication Date
CN104411267A true CN104411267A (zh) 2015-03-11

Family

ID=48670780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380034558.5A Pending CN104411267A (zh) 2012-06-29 2013-05-30 供医疗位置和取向跟踪中使用的传感器组合件

Country Status (5)

Country Link
US (1) US8618795B1 (enExample)
JP (1) JP6187991B2 (enExample)
CN (1) CN104411267A (enExample)
DE (1) DE112013003183T5 (enExample)
WO (1) WO2014003960A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106482755A (zh) * 2015-09-01 2017-03-08 通用电气公司 多轴磁阻传感器封装

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9638820B2 (en) * 2014-03-03 2017-05-02 Biosense Webster (Israel) Ltd. Calibration jig for a flat location pad
US10588541B2 (en) 2014-07-15 2020-03-17 General Electric Company Magnetic tracker system and method for use for surgical navigation
US10076267B2 (en) 2014-10-03 2018-09-18 General Electric Company Methods and systems for improved navigation
US10727122B2 (en) 2014-12-08 2020-07-28 International Business Machines Corporation Self-aligned via interconnect structures
US10426555B2 (en) * 2015-06-03 2019-10-01 Covidien Lp Medical instrument with sensor for use in a system and method for electromagnetic navigation
US20180220926A1 (en) * 2017-02-06 2018-08-09 Boston Scientific Scimed Inc. Electromagnetic navigation system with magneto-resistive sensors and application-specific integrated circuits
US11821818B2 (en) 2017-07-06 2023-11-21 University Of Houston System Biosensor for detecting a single magnetic label
JP6997918B2 (ja) 2017-12-03 2022-01-18 エンヴィジョン メディカル リミテッド 電磁センサ付き栄養チューブ
EP3712630B1 (en) * 2019-03-20 2021-04-28 LEM International SA Magnetic field sensor
JP2022541146A (ja) * 2019-07-12 2022-09-22 ニューラリンク コーポレーション プリント回路基板(pcb)が両面において薄膜電極アレイと複数の集積回路(ic)とで挟まれて配置される部品、および製造方法
JP7138261B1 (ja) 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090127718A1 (en) * 2007-11-15 2009-05-21 Chen Singjang Flip chip wafer, flip chip die and manufacturing processes thereof
US20100130853A1 (en) * 2008-11-25 2010-05-27 General Electric Company System for tracking object
CN101869509A (zh) * 2010-07-12 2010-10-27 大连医科大学 桡动脉穿刺定位装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5558091A (en) * 1993-10-06 1996-09-24 Biosense, Inc. Magnetic determination of position and orientation
US6090498A (en) * 1996-12-27 2000-07-18 Tdk Corporation Magnetoresistance effect element and magnetoresistance device
JP3820300B2 (ja) * 1997-04-17 2006-09-13 日本電産サンキョー株式会社 磁気検出装置の製造方法
US6268662B1 (en) 1998-10-14 2001-07-31 Texas Instruments Incorporated Wire bonded flip-chip assembly of semiconductor devices
JP3651433B2 (ja) * 2001-09-28 2005-05-25 株式会社村田製作所 磁気センサ
US7309647B1 (en) * 2003-03-05 2007-12-18 Altera Corporation Method of mounting an electroless nickel immersion gold flip chip package
US6995957B2 (en) * 2003-03-18 2006-02-07 Hitachi Global Storage Technologies Netherland B.V. Magnetoresistive sensor having a high resistance soft magnetic layer between sensor stack and shield
KR100604334B1 (ko) * 2003-11-25 2006-08-08 (주)케이나인 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법
US7273803B2 (en) * 2003-12-01 2007-09-25 International Business Machines Corporation Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
US7271586B2 (en) * 2003-12-04 2007-09-18 Honeywell International Inc. Single package design for 3-axis magnetic sensor
US20060145715A1 (en) * 2005-01-06 2006-07-06 Salmon Peter C Wafer level test head
US20080029879A1 (en) * 2006-03-01 2008-02-07 Tessera, Inc. Structure and method of making lidded chips
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
WO2008133943A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
US20100099250A1 (en) * 2008-10-21 2010-04-22 Samsung Electronics Co., Ltd. Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers
US9642555B2 (en) * 2008-11-20 2017-05-09 Medtronic, Inc. Subcutaneous lead guidance
US8283921B2 (en) 2008-11-26 2012-10-09 General Electric Company Magnetoresistance sensors for position and orientation determination
JP2010161136A (ja) * 2009-01-07 2010-07-22 Panasonic Corp 半導体装置及びその製造方法
US20100249571A1 (en) 2009-03-31 2010-09-30 General Electric Company Surgical navigation system with wireless magnetoresistance tracking sensors
AU2009344197A1 (en) 2009-04-08 2011-12-01 Saluda Medical Pty Limited Bonded hermetic feed through for an active implantable medical device
US8173446B2 (en) 2009-12-21 2012-05-08 General Electric Company Method of producing an integrated micromagnet sensor assembly
US20110186980A1 (en) 2010-02-03 2011-08-04 Rfmarq, Inc. Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages
TWM397597U (en) * 2010-04-15 2011-02-01 Di-Quan Hu Package structure of integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090127718A1 (en) * 2007-11-15 2009-05-21 Chen Singjang Flip chip wafer, flip chip die and manufacturing processes thereof
US20100130853A1 (en) * 2008-11-25 2010-05-27 General Electric Company System for tracking object
CN101869509A (zh) * 2010-07-12 2010-10-27 大连医科大学 桡动脉穿刺定位装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RICHARD K.ULRICH ET AL: "《高级电子封装》", 30 April 2010 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106482755A (zh) * 2015-09-01 2017-03-08 通用电气公司 多轴磁阻传感器封装
CN106482755B (zh) * 2015-09-01 2021-03-09 通用电气公司 多轴磁阻传感器封装

Also Published As

Publication number Publication date
US8618795B1 (en) 2013-12-31
JP6187991B2 (ja) 2017-08-30
WO2014003960A1 (en) 2014-01-03
US20140005517A1 (en) 2014-01-02
JP2015523145A (ja) 2015-08-13
DE112013003183T5 (de) 2015-03-19

Similar Documents

Publication Publication Date Title
US8618795B1 (en) Sensor assembly for use in medical position and orientation tracking
Kim et al. Integrated wireless neural interface based on the Utah electrode array
US7163830B2 (en) Method for temporarily engaging electronic component for test
US7706887B2 (en) Method for integrating pre-fabricated chip structures into functional electronic systems
US6998717B2 (en) Multi-dice chip scale semiconductor components
US20070007983A1 (en) Semiconductor wafer tester
US20010011907A1 (en) Test interconnect for bumped semiconductor components and method of fabrication
TWI556377B (zh) 具有微型彈簧接觸件之中介層及其結構
TWI533775B (zh) 具有訂製層之佈線基材
US20170290521A1 (en) Neural-interface probe and methods of packaging the same
US7271611B2 (en) Method for testing semiconductor components using bonded electrical connections
CN1329970C (zh) 半导体器件的制造方法
US20060145715A1 (en) Wafer level test head
US20080096379A1 (en) Flip chip metallization method and devices
US20130324863A1 (en) Guide wire arrangement, strip arrangement and methods of forming the same
Damalerio et al. Ultra slim packaging and assembly method for 360-μm diameter guide wires
Hamidullah et al. MEMS Tri-axial Tactile Sensor packaging using polymer fleible cable for sensorised guide wire application
US7335591B2 (en) Method for forming three-dimensional structures on a substrate
JP4392201B2 (ja) 電子装置とその製造方法
JP4938346B2 (ja) 半導体装置およびその製造方法
Chen et al. High-Throughput Flexible Electrode Packaging for Brain-Computer Interface Chips
US20210386376A1 (en) Electric component of an interventional medical device
Daquan et al. Newly developed integration method for biomedical implants using flexible polymer cable
CN101836121A (zh) 制造用于检查电子装置的检查设备的方法
Ling et al. Integration of low profile neural probe array with flexible polyimide cable

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20150311