JP2013131592A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013131592A5 JP2013131592A5 JP2011279295A JP2011279295A JP2013131592A5 JP 2013131592 A5 JP2013131592 A5 JP 2013131592A5 JP 2011279295 A JP2011279295 A JP 2011279295A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2013131592 A5 JP2013131592 A5 JP 2013131592A5
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- joint surface
- conductive portion
- semiconductor device
- main conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000000463 material Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 229910000765 intermetallic Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011279295A JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011279295A JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013131592A JP2013131592A (ja) | 2013-07-04 |
| JP2013131592A5 true JP2013131592A5 (enExample) | 2014-01-09 |
Family
ID=48908934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011279295A Pending JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013131592A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6143687B2 (ja) * | 2014-02-18 | 2017-06-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102014115319A1 (de) * | 2014-10-21 | 2016-04-21 | Osram Opto Semiconductors Gmbh | Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung |
| WO2016159070A1 (ja) * | 2015-04-03 | 2016-10-06 | 三菱電機株式会社 | 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材 |
| EP3787011A4 (en) * | 2018-04-27 | 2022-06-08 | Nitto Denko Corporation | SEMICONDUCTOR DEVICE MANUFACTURING PROCESS |
| JP7524559B2 (ja) | 2020-03-13 | 2024-07-30 | 富士電機株式会社 | 配線構造及び半導体モジュール |
| JP7657529B2 (ja) | 2021-11-16 | 2025-04-07 | 三菱電機株式会社 | 半導体装置 |
| CN118974923A (zh) * | 2022-03-30 | 2024-11-15 | 罗姆股份有限公司 | 半导体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742967U (ja) * | 1993-12-28 | 1995-08-11 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP5665729B2 (ja) * | 2011-12-27 | 2015-02-04 | 三菱電機株式会社 | 電力用半導体装置 |
-
2011
- 2011-12-21 JP JP2011279295A patent/JP2013131592A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013131592A5 (enExample) | ||
| JP2011524647A5 (enExample) | ||
| JP2013546199A5 (enExample) | ||
| JP2014512694A5 (enExample) | ||
| EA201390096A1 (ru) | Стекло с электрическим присоединительным элементом | |
| JP2017022407A5 (enExample) | ||
| JP2015516693A5 (enExample) | ||
| JP2014514766A5 (enExample) | ||
| WO2012143784A8 (en) | Semiconductor device and manufacturing method thereof | |
| JP2014099547A5 (enExample) | ||
| JP2011009514A5 (enExample) | ||
| JP2009027039A5 (enExample) | ||
| JP2013544445A5 (enExample) | ||
| JP2011003715A5 (enExample) | ||
| CN105723508B (zh) | 半导体模块 | |
| US9491873B2 (en) | Element housing package, component for semiconductor device, and semiconductor device | |
| JP2015523145A5 (enExample) | ||
| JP2010287710A5 (ja) | 半導体装置の製造方法 | |
| CN104137286B (zh) | 压电振动部件以及便携终端 | |
| JP2009191185A5 (enExample) | ||
| JP2015056412A5 (ja) | 電力用半導体装置の製造方法、電力用半導体装置および電力変換装置 | |
| JP2014007039A5 (enExample) | ||
| JP2007329431A (ja) | 圧電型エキサイタ | |
| JP2015106663A5 (enExample) | ||
| JPWO2017188253A1 (ja) | 電子部品搭載用基板、電子装置および電子モジュール |