JP2013140870A5 - - Google Patents
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- Publication number
- JP2013140870A5 JP2013140870A5 JP2012000335A JP2012000335A JP2013140870A5 JP 2013140870 A5 JP2013140870 A5 JP 2013140870A5 JP 2012000335 A JP2012000335 A JP 2012000335A JP 2012000335 A JP2012000335 A JP 2012000335A JP 2013140870 A5 JP2013140870 A5 JP 2013140870A5
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- power
- control
- semiconductor device
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 238000007789 sealing Methods 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000335A JP5800716B2 (ja) | 2012-01-05 | 2012-01-05 | 電力用半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000335A JP5800716B2 (ja) | 2012-01-05 | 2012-01-05 | 電力用半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013140870A JP2013140870A (ja) | 2013-07-18 |
| JP2013140870A5 true JP2013140870A5 (enExample) | 2014-01-09 |
| JP5800716B2 JP5800716B2 (ja) | 2015-10-28 |
Family
ID=49038075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000335A Active JP5800716B2 (ja) | 2012-01-05 | 2012-01-05 | 電力用半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5800716B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6274986B2 (ja) * | 2014-06-26 | 2018-02-07 | 三菱電機株式会社 | パワー半導体モジュールおよびその製造方法 |
| JP6269573B2 (ja) | 2015-05-18 | 2018-01-31 | 株式会社デンソー | 半導体装置 |
| JP7785945B2 (ja) * | 2022-07-15 | 2025-12-15 | Ａｓｔｅｍｏ株式会社 | 半導体装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07226422A (ja) * | 1994-02-14 | 1995-08-22 | Sumitomo Electric Ind Ltd | 電子部品パッケージ |
| JP3080049B2 (ja) * | 1997-11-17 | 2000-08-21 | 日本電気株式会社 | 集積回路チップの実装構造および方法 |
| JP3674333B2 (ja) * | 1998-09-11 | 2005-07-20 | 株式会社日立製作所 | パワー半導体モジュール並びにそれを用いた電動機駆動システム |
| JP2003100924A (ja) * | 2001-09-21 | 2003-04-04 | Kyocera Corp | 半導体装置 |
| JP2004172211A (ja) * | 2002-11-18 | 2004-06-17 | Yaskawa Electric Corp | パワーモジュール |
| JP4022758B2 (ja) * | 2003-03-31 | 2007-12-19 | 株式会社デンソー | 半導体装置 |
| TWI226110B (en) * | 2004-03-17 | 2005-01-01 | Cyntec Co Ltd | Package with stacked substrates |
| JP2008066026A (ja) * | 2006-09-05 | 2008-03-21 | Fuji Electric Holdings Co Ltd | 有機ｅｌディスプレイパネルの製造方法 |
| JP5193777B2 (ja) * | 2008-09-26 | 2013-05-08 | 株式会社東芝 | パワー半導体モジュールとそれを用いたインバータシステム |
| JP2011044452A (ja) * | 2009-08-19 | 2011-03-03 | Denso Corp | 電子装置およびその製造方法 |
-
2012
- 2012-01-05 JP JP2012000335A patent/JP5800716B2/ja active Active
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