JP2015106663A5 - - Google Patents

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Publication number
JP2015106663A5
JP2015106663A5 JP2013248597A JP2013248597A JP2015106663A5 JP 2015106663 A5 JP2015106663 A5 JP 2015106663A5 JP 2013248597 A JP2013248597 A JP 2013248597A JP 2013248597 A JP2013248597 A JP 2013248597A JP 2015106663 A5 JP2015106663 A5 JP 2015106663A5
Authority
JP
Japan
Prior art keywords
wiring board
via hole
terminal
tool
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013248597A
Other languages
English (en)
Japanese (ja)
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JP2015106663A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013248597A priority Critical patent/JP2015106663A/ja
Priority claimed from JP2013248597A external-priority patent/JP2015106663A/ja
Priority to US14/555,293 priority patent/US20150156885A1/en
Publication of JP2015106663A publication Critical patent/JP2015106663A/ja
Publication of JP2015106663A5 publication Critical patent/JP2015106663A5/ja
Pending legal-status Critical Current

Links

JP2013248597A 2013-11-29 2013-11-29 配線基板の接続方法、および配線基板の実装構造 Pending JP2015106663A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013248597A JP2015106663A (ja) 2013-11-29 2013-11-29 配線基板の接続方法、および配線基板の実装構造
US14/555,293 US20150156885A1 (en) 2013-11-29 2014-11-26 Method for manufacturing an electric device by connecting a wiring board to an object and electric device including a board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248597A JP2015106663A (ja) 2013-11-29 2013-11-29 配線基板の接続方法、および配線基板の実装構造

Publications (2)

Publication Number Publication Date
JP2015106663A JP2015106663A (ja) 2015-06-08
JP2015106663A5 true JP2015106663A5 (enExample) 2017-01-12

Family

ID=53266508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013248597A Pending JP2015106663A (ja) 2013-11-29 2013-11-29 配線基板の接続方法、および配線基板の実装構造

Country Status (2)

Country Link
US (1) US20150156885A1 (enExample)
JP (1) JP2015106663A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6237738B2 (ja) * 2015-09-17 2017-11-29 富士通オプティカルコンポーネンツ株式会社 光通信装置、光モジュール、及び、接続方法
JP7416435B2 (ja) * 2018-12-26 2024-01-17 住友電工デバイス・イノベーション株式会社 光半導体装置
JP7224921B2 (ja) * 2019-01-09 2023-02-20 日本ルメンタム株式会社 光モジュール及び光モジュールの製造方法
US12464647B2 (en) * 2020-12-24 2025-11-04 Sk Hynix Nand Product Solutions Corp. Triangular board assembly for solid state drive

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3722729A1 (de) * 1987-07-09 1989-01-19 Productech Gmbh Geheizter stempel
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
US4972989A (en) * 1989-10-30 1990-11-27 Motorola, Inc. Through the lead soldering
JPH0645398A (ja) * 1992-07-27 1994-02-18 Ricoh Co Ltd 印刷回路基板の接続構造およびその接続検査装置および印刷回路基板の接続ヘッド
JPH06302931A (ja) * 1993-04-12 1994-10-28 Sharp Corp プリント基板
US5490786A (en) * 1994-03-25 1996-02-13 Itt Corporation Termination of contact tails to PC board
JPH09245856A (ja) * 1996-03-05 1997-09-19 Toyota Motor Corp フラットケーブル及びフラットケーブルの接合構造
JPH10294544A (ja) * 1997-04-18 1998-11-04 Mitsubishi Electric Corp フレキシブル配線基板並びにその接続方法及び接続状態検査方法並びにその検査装置及び接続装置
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
US7754979B2 (en) * 1999-09-20 2010-07-13 Teka Interconnections Systems, Inc. Solder-bearing wafer for use in soldering operations
DE10392500B4 (de) * 2002-04-01 2010-02-25 Nas Interplex, Inc. Lottragendes Bauteil und Verfahren zum Halten einer Lotmasse darauf
EP1424156A1 (en) * 2002-11-29 2004-06-02 Leica Geosystems AG Process for soldering miniaturized components onto a base plate
US6982191B2 (en) * 2003-09-19 2006-01-03 Micron Technology, Inc. Methods relating to forming interconnects and resulting assemblies
JP2006173515A (ja) * 2004-12-20 2006-06-29 Seiko Epson Corp ボンディングツール、接続装置、半導体装置及びその製造方法
US7718927B2 (en) * 2005-03-15 2010-05-18 Medconx, Inc. Micro solder pot
DE502005003336D1 (de) * 2005-07-27 2008-04-30 Leica Geosystems Ag Verfahren zur hochpräzisen Befestigung eines miniaturisierten Bauteils auf einer Trägerplatte
JP4982198B2 (ja) * 2007-01-30 2012-07-25 新科實業有限公司 半田ノズル及びこれを備えた半田付け装置
JP2010283259A (ja) * 2009-06-08 2010-12-16 Sumitomo Electric System Solutions Co Ltd 配線板の接合方法
US9751146B2 (en) * 2009-09-24 2017-09-05 Senju Metal Industry Co., Ltd. Nozzle for heating device, heating device, and nozzle for cooling device
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP5794577B2 (ja) * 2011-10-21 2015-10-14 株式会社アマダミヤチ ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造
JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板

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