JP2015516693A5 - - Google Patents

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Publication number
JP2015516693A5
JP2015516693A5 JP2015512167A JP2015512167A JP2015516693A5 JP 2015516693 A5 JP2015516693 A5 JP 2015516693A5 JP 2015512167 A JP2015512167 A JP 2015512167A JP 2015512167 A JP2015512167 A JP 2015512167A JP 2015516693 A5 JP2015516693 A5 JP 2015516693A5
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JP
Japan
Prior art keywords
cavity
module
substrate
contact
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015512167A
Other languages
English (en)
Japanese (ja)
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JP2015516693A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/IB2013/053749 external-priority patent/WO2013171636A1/en
Publication of JP2015516693A publication Critical patent/JP2015516693A/ja
Publication of JP2015516693A5 publication Critical patent/JP2015516693A5/ja
Pending legal-status Critical Current

Links

JP2015512167A 2012-05-17 2013-05-09 電子集積のための３次元モジュール Pending JP2015516693A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261648098P 2012-05-17 2012-05-17
US61/648,098 2012-05-17
US201261654888P 2012-06-03 2012-06-03
US61/654,888 2012-06-03
US201261670616P 2012-07-12 2012-07-12
US61/670,616 2012-07-12
PCT/IB2013/053749 WO2013171636A1 (en) 2012-05-17 2013-05-09 Three-dimensional modules for electronic integration

Publications (2)

Publication Number Publication Date
JP2015516693A JP2015516693A (ja) 2015-06-11
JP2015516693A5 true JP2015516693A5 (enExample) 2016-05-19

Family

ID=49583222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015512167A Pending JP2015516693A (ja) 2012-05-17 2013-05-09 電子集積のための３次元モジュール

Country Status (6)

Country Link
US (2) US20150131248A1 (enExample)
EP (1) EP2850649A4 (enExample)
JP (1) JP2015516693A (enExample)
CN (1) CN104285278A (enExample)
TW (1) TW201411800A (enExample)
WO (1) WO2013171636A1 (enExample)

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WO2016109696A1 (en) * 2015-01-02 2016-07-07 Voxei8, Inc. Electrical communication with 3d-printed objects
US10406801B2 (en) 2015-08-21 2019-09-10 Voxel8, Inc. Calibration and alignment of 3D printing deposition heads
WO2017069709A1 (en) * 2015-10-23 2017-04-27 Heptagon Micro Optics Pte. Ltd. Electrical-contact assemblies
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US11469190B2 (en) 2016-03-15 2022-10-11 Intel Corporation Parasitic-aware integrated substrate balanced filter and apparatus to achieve transmission zeros
US20170283247A1 (en) * 2016-04-04 2017-10-05 Infineon Technologies Ag Semiconductor device including a mems die
US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
WO2018004686A1 (en) * 2016-07-01 2018-01-04 Intel Corporation Device, method and system for providing recessed interconnect structures of a substrate
TWI612861B (zh) * 2016-09-02 2018-01-21 先豐通訊股份有限公司 晶片埋入式電路板結構及其製造方法
WO2018123414A1 (ja) * 2016-12-28 2018-07-05 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
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KR102421521B1 (ko) * 2018-01-31 2022-07-15 삼성전자주식회사 적층 구조의 커넥터를 포함하는 전자 장치
CN108962846B (zh) * 2018-07-27 2020-10-16 北京新雷能科技股份有限公司 一种厚膜混合集成电路的封装结构及其制作方法
CN110943050B (zh) * 2018-09-21 2023-08-15 中兴通讯股份有限公司 一种封装结构及堆叠式封装结构
MY202999A (en) * 2018-10-17 2024-06-01 Intel Corp Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates
US11588009B2 (en) * 2018-12-12 2023-02-21 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device
CN109887886B (zh) * 2019-04-10 2024-07-23 中国电子科技集团公司第十三研究所 信号连接用三维垂直互联结构及方法
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
CN110676224A (zh) * 2019-11-12 2020-01-10 河北新华北集成电路有限公司 放大器芯片封装结构及制作方法
US12474290B2 (en) 2019-11-20 2025-11-18 Analog Devices International Unlimited Company Electrochemical device
CN111785691B (zh) * 2020-05-13 2022-03-11 中国电子科技集团公司第五十五研究所 一种射频微系统三维封装外壳结构以及制作方法
JP2022138735A (ja) * 2021-03-10 2022-09-26 三安ジャパンテクノロジー株式会社 弾性波デバイス、その弾性波デバイスを備えるモジュール、およびその弾性波デバイスの製造方法
CN114497018A (zh) * 2022-01-24 2022-05-13 西安微电子技术研究所 一种多腔体图像采集处理微系统模块及制作方法
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