JP2011505072A5 - - Google Patents

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Publication number
JP2011505072A5
JP2011505072A5 JP2010535211A JP2010535211A JP2011505072A5 JP 2011505072 A5 JP2011505072 A5 JP 2011505072A5 JP 2010535211 A JP2010535211 A JP 2010535211A JP 2010535211 A JP2010535211 A JP 2010535211A JP 2011505072 A5 JP2011505072 A5 JP 2011505072A5
Authority
JP
Japan
Prior art keywords
connection
assembly
chip
semiconductor chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010535211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011505072A (ja
Filing date
Publication date
Priority claimed from DE102008021618A external-priority patent/DE102008021618A1/de
Application filed filed Critical
Publication of JP2011505072A publication Critical patent/JP2011505072A/ja
Publication of JP2011505072A5 publication Critical patent/JP2011505072A5/ja
Pending legal-status Critical Current

Links

JP2010535211A 2007-11-28 2008-11-21 チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法 Pending JP2011505072A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007057242 2007-11-28
DE102008021618A DE102008021618A1 (de) 2007-11-28 2008-04-30 Chipanordnung, Anschlussanordnung, LED sowie Verfahren zur Herstellung einer Chipanordnung
PCT/DE2008/001931 WO2009067996A2 (de) 2007-11-28 2008-11-21 Chipanordnung, anschlussanordnung, led sowie verfahren zur herstellung einer chipanordnung

Publications (2)

Publication Number Publication Date
JP2011505072A JP2011505072A (ja) 2011-02-17
JP2011505072A5 true JP2011505072A5 (enExample) 2011-10-20

Family

ID=40586002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010535211A Pending JP2011505072A (ja) 2007-11-28 2008-11-21 チップアセンブリ、接続アセンブリ、ｌｅｄ、およびチップアセンブリの製造方法

Country Status (8)

Country Link
US (1) US20100314635A1 (enExample)
EP (1) EP2225785B1 (enExample)
JP (1) JP2011505072A (enExample)
KR (1) KR20100105632A (enExample)
CN (1) CN101878544A (enExample)
DE (1) DE102008021618A1 (enExample)
TW (1) TWI484656B (enExample)
WO (1) WO2009067996A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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TWI405307B (zh) * 2009-09-18 2013-08-11 聯詠科技股份有限公司 晶片封裝及其製程
DE102010046790A1 (de) * 2010-09-28 2012-03-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
DE102012201616A1 (de) * 2012-02-03 2013-08-08 Tridonic Jennersdorf Gmbh Kunststoffträger für LED-Chips zur Verwendung in LED-Modulen und LED-Ketten
EP2642538A1 (en) 2012-03-22 2013-09-25 Koninklijke Philips N.V. 3D LED structures
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
US9576935B2 (en) * 2014-04-16 2017-02-21 Infineon Technologies Ag Method for fabricating a semiconductor package and semiconductor package
US9865528B2 (en) * 2015-12-11 2018-01-09 Ubotic Company Limited High power and high frequency plastic pre-molded cavity package
JP6110528B2 (ja) * 2016-02-03 2017-04-05 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール
KR102746562B1 (ko) 2019-03-22 2024-12-24 삼성전자주식회사 발광 소자 패키지

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JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
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DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
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