JP2017139433A5 - - Google Patents

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Publication number
JP2017139433A5
JP2017139433A5 JP2016021288A JP2016021288A JP2017139433A5 JP 2017139433 A5 JP2017139433 A5 JP 2017139433A5 JP 2016021288 A JP2016021288 A JP 2016021288A JP 2016021288 A JP2016021288 A JP 2016021288A JP 2017139433 A5 JP2017139433 A5 JP 2017139433A5
Authority
JP
Japan
Prior art keywords
substrate
electrode
hole
surface side
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016021288A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017139433A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016021288A priority Critical patent/JP2017139433A/ja
Priority claimed from JP2016021288A external-priority patent/JP2017139433A/ja
Priority to TW106103724A priority patent/TWI738712B/zh
Priority to PCT/JP2017/003892 priority patent/WO2017135395A1/ja
Priority to US16/075,898 priority patent/US10755996B2/en
Priority to TW110128560A priority patent/TWI772135B/zh
Publication of JP2017139433A publication Critical patent/JP2017139433A/ja
Publication of JP2017139433A5 publication Critical patent/JP2017139433A5/ja
Pending legal-status Critical Current

Links

JP2016021288A 2016-02-05 2016-02-05 貫通電極基板及びその製造方法 Pending JP2017139433A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016021288A JP2017139433A (ja) 2016-02-05 2016-02-05 貫通電極基板及びその製造方法
TW106103724A TWI738712B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法
PCT/JP2017/003892 WO2017135395A1 (ja) 2016-02-05 2017-02-03 貫通電極基板及びその製造方法
US16/075,898 US10755996B2 (en) 2016-02-05 2017-02-03 Through electrode substrate and manufacturing method thereof
TW110128560A TWI772135B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016021288A JP2017139433A (ja) 2016-02-05 2016-02-05 貫通電極基板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018000807A Division JP2018061063A (ja) 2018-01-05 2018-01-05 貫通電極基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2017139433A JP2017139433A (ja) 2017-08-10
JP2017139433A5 true JP2017139433A5 (enExample) 2017-09-21

Family

ID=59499693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016021288A Pending JP2017139433A (ja) 2016-02-05 2016-02-05 貫通電極基板及びその製造方法

Country Status (4)

Country Link
US (1) US10755996B2 (enExample)
JP (1) JP2017139433A (enExample)
TW (2) TWI738712B (enExample)
WO (1) WO2017135395A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173728B2 (ja) 2017-10-26 2022-11-16 日東電工株式会社 撮像素子実装基板
CN110708880A (zh) * 2019-09-11 2020-01-17 广东工业大学 一种在石英玻璃上制备复杂电路图案的方法
EP4351286A4 (en) 2021-08-17 2024-11-20 Samsung Electronics Co., Ltd. INTERPOSER AND ELECTRONIC DEVICE THEREFOR
US20230088392A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Thermally conductive sleeves around tgvs for improved heat dissipation in glass core substrates or glass interposers
WO2024111208A1 (ja) * 2022-11-24 2024-05-30 株式会社フジクラ 配線板の製造方法、及び、配線板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160601A (ja) 1999-12-02 2001-06-12 Ngk Spark Plug Co Ltd 多層配線基板
JP2001217508A (ja) * 2000-01-31 2001-08-10 Toshiba Corp プリント基板
JP4001786B2 (ja) * 2002-06-27 2007-10-31 日本特殊陶業株式会社 配線基板の製造方法
KR100487256B1 (ko) * 2002-10-31 2005-05-03 엘지.필립스 엘시디 주식회사 폴리 실리콘 박막 트랜지스터 제조방법
KR100883769B1 (ko) * 2002-11-08 2009-02-18 엘지디스플레이 주식회사 액정표시장치용 어레이기판 제조방법
WO2006059589A1 (ja) * 2004-11-30 2006-06-08 Kyushu Institute Of Technology パッケージングされた積層型半導体装置及びその製造方法
JP2006202819A (ja) * 2005-01-18 2006-08-03 Shinko Electric Ind Co Ltd 多層配線板の製造方法
JP4735767B2 (ja) 2008-10-16 2011-07-27 大日本印刷株式会社 貫通電極基板及び半導体装置
JP5619372B2 (ja) 2009-04-16 2014-11-05 大日本印刷株式会社 撮像素子モジュール
JP2013165265A (ja) * 2012-01-13 2013-08-22 Zycube:Kk 貫通／埋込電極構造及びその製造方法
JP6013960B2 (ja) 2013-03-28 2016-10-25 京セラ株式会社 配線基板
JP6255744B2 (ja) * 2013-06-28 2018-01-10 ヤマハ株式会社 楽曲表示装置および楽曲表示方法
JP6361179B2 (ja) * 2014-03-10 2018-07-25 大日本印刷株式会社 配線板、配線板の製造方法
JP5811220B2 (ja) 2014-03-28 2015-11-11 株式会社ニコン 撮像モジュール
JP2015207580A (ja) * 2014-04-17 2015-11-19 凸版印刷株式会社 配線基板およびその製造方法
JP2015211147A (ja) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 配線基板
KR102635858B1 (ko) * 2017-01-05 2024-02-15 삼성전자주식회사 이미지 센서

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