TWI772135B - 貫通電極基板及其製造方法 - Google Patents

貫通電極基板及其製造方法 Download PDF

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Publication number
TWI772135B
TWI772135B TW110128560A TW110128560A TWI772135B TW I772135 B TWI772135 B TW I772135B TW 110128560 A TW110128560 A TW 110128560A TW 110128560 A TW110128560 A TW 110128560A TW I772135 B TWI772135 B TW I772135B
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TW
Taiwan
Prior art keywords
substrate
hole
electrode portion
electrode
holes
Prior art date
Application number
TW110128560A
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English (en)
Chinese (zh)
Other versions
TW202147530A (zh
Inventor
前川慎志
馬渡宏
Original Assignee
日商大日本印刷股份有限公司
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Publication of TW202147530A publication Critical patent/TW202147530A/zh
Application granted granted Critical
Publication of TWI772135B publication Critical patent/TWI772135B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/823—Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW110128560A 2016-02-05 2017-02-03 貫通電極基板及其製造方法 TWI772135B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016021288A JP2017139433A (ja) 2016-02-05 2016-02-05 貫通電極基板及びその製造方法
JP2016-021288 2016-02-05

Publications (2)

Publication Number Publication Date
TW202147530A TW202147530A (zh) 2021-12-16
TWI772135B true TWI772135B (zh) 2022-07-21

Family

ID=59499693

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110128560A TWI772135B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法
TW106103724A TWI738712B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106103724A TWI738712B (zh) 2016-02-05 2017-02-03 貫通電極基板及其製造方法

Country Status (4)

Country Link
US (1) US10755996B2 (enExample)
JP (1) JP2017139433A (enExample)
TW (2) TWI772135B (enExample)
WO (1) WO2017135395A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173728B2 (ja) * 2017-10-26 2022-11-16 日東電工株式会社 撮像素子実装基板
CN110708880A (zh) * 2019-09-11 2020-01-17 广东工业大学 一种在石英玻璃上制备复杂电路图案的方法
EP4351286A4 (en) 2021-08-17 2024-11-20 Samsung Electronics Co., Ltd. INTERPOSER AND ELECTRONIC DEVICE THEREFOR
US20230088392A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Thermally conductive sleeves around tgvs for improved heat dissipation in glass core substrates or glass interposers
JP2026001247A (ja) * 2022-11-24 2026-01-07 株式会社フジクラ 配線板の製造方法、及び、配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211147A (ja) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 配線基板

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JP2001160601A (ja) 1999-12-02 2001-06-12 Ngk Spark Plug Co Ltd 多層配線基板
JP2001217508A (ja) * 2000-01-31 2001-08-10 Toshiba Corp プリント基板
JP4001786B2 (ja) * 2002-06-27 2007-10-31 日本特殊陶業株式会社 配線基板の製造方法
KR100487256B1 (ko) * 2002-10-31 2005-05-03 엘지.필립스 엘시디 주식회사 폴리 실리콘 박막 트랜지스터 제조방법
KR100883769B1 (ko) * 2002-11-08 2009-02-18 엘지디스플레이 주식회사 액정표시장치용 어레이기판 제조방법
JP4783906B2 (ja) * 2004-11-30 2011-09-28 国立大学法人九州工業大学 パッケージングされた積層型半導体装置及びその製造方法
JP2006202819A (ja) * 2005-01-18 2006-08-03 Shinko Electric Ind Co Ltd 多層配線板の製造方法
JP4735767B2 (ja) 2008-10-16 2011-07-27 大日本印刷株式会社 貫通電極基板及び半導体装置
JP5619372B2 (ja) 2009-04-16 2014-11-05 大日本印刷株式会社 撮像素子モジュール
JP2013165265A (ja) * 2012-01-13 2013-08-22 Zycube:Kk 貫通／埋込電極構造及びその製造方法
JP6013960B2 (ja) 2013-03-28 2016-10-25 京セラ株式会社 配線基板
JP6255744B2 (ja) * 2013-06-28 2018-01-10 ヤマハ株式会社 楽曲表示装置および楽曲表示方法
JP6361179B2 (ja) * 2014-03-10 2018-07-25 大日本印刷株式会社 配線板、配線板の製造方法
JP5811220B2 (ja) 2014-03-28 2015-11-11 株式会社ニコン 撮像モジュール
JP2015207580A (ja) * 2014-04-17 2015-11-19 凸版印刷株式会社 配線基板およびその製造方法
KR102635858B1 (ko) * 2017-01-05 2024-02-15 삼성전자주식회사 이미지 센서

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2015211147A (ja) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 配線基板

Also Published As

Publication number Publication date
WO2017135395A1 (ja) 2017-08-10
US10755996B2 (en) 2020-08-25
US20190080977A1 (en) 2019-03-14
TWI738712B (zh) 2021-09-11
TW202147530A (zh) 2021-12-16
JP2017139433A (ja) 2017-08-10
TW201742196A (zh) 2017-12-01

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