JP2005332982A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2005332982A
JP2005332982A JP2004150048A JP2004150048A JP2005332982A JP 2005332982 A JP2005332982 A JP 2005332982A JP 2004150048 A JP2004150048 A JP 2004150048A JP 2004150048 A JP2004150048 A JP 2004150048A JP 2005332982 A JP2005332982 A JP 2005332982A
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JP
Japan
Prior art keywords
semiconductor
semiconductor wafer
main surface
manufacturing
chip
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Pending
Application number
JP2004150048A
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English (en)
Japanese (ja)
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JP2005332982A5 (enExample
Inventor
Shunei Uematsu
俊英 植松
Chuichi Miyazaki
忠一 宮崎
Yoshiyuki Abe
由之 阿部
Minoru Kimura
稔 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004150048A priority Critical patent/JP2005332982A/ja
Priority to TW094111539A priority patent/TW200539338A/zh
Priority to CN2005100666009A priority patent/CN100407379C/zh
Priority to US11/119,930 priority patent/US20050260829A1/en
Priority to KR1020050041861A priority patent/KR20060048012A/ko
Publication of JP2005332982A publication Critical patent/JP2005332982A/ja
Publication of JP2005332982A5 publication Critical patent/JP2005332982A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2004150048A 2004-05-20 2004-05-20 半導体装置の製造方法 Pending JP2005332982A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004150048A JP2005332982A (ja) 2004-05-20 2004-05-20 半導体装置の製造方法
TW094111539A TW200539338A (en) 2004-05-20 2005-04-12 A manufacturing method of a semiconductor device
CN2005100666009A CN100407379C (zh) 2004-05-20 2005-04-28 半导体器件的制造方法
US11/119,930 US20050260829A1 (en) 2004-05-20 2005-05-03 Manufacturing method of a semiconductor device
KR1020050041861A KR20060048012A (ko) 2004-05-20 2005-05-19 반도체장치의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004150048A JP2005332982A (ja) 2004-05-20 2004-05-20 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005332982A true JP2005332982A (ja) 2005-12-02
JP2005332982A5 JP2005332982A5 (enExample) 2007-07-05

Family

ID=35375733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004150048A Pending JP2005332982A (ja) 2004-05-20 2004-05-20 半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20050260829A1 (enExample)
JP (1) JP2005332982A (enExample)
KR (1) KR20060048012A (enExample)
CN (1) CN100407379C (enExample)
TW (1) TW200539338A (enExample)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071992A (ja) * 2006-09-15 2008-03-27 Mitsubishi Electric Corp 半導体装置の製造方法、半導体ウエハおよび半導体装置
JP2008098348A (ja) * 2006-10-11 2008-04-24 Yamaha Corp 半導体チップの検査方法
JP2010525561A (ja) * 2007-04-17 2010-07-22 アイメック 基板の薄層化方法
JP2010177277A (ja) * 2009-01-27 2010-08-12 Tokyo Seimitsu Co Ltd レーザーダイシング方法及びレーザーダイシング装置
JP2011165932A (ja) * 2010-02-10 2011-08-25 Disco Abrasive Syst Ltd 裏面撮像テーブルユニット
US8224062B2 (en) 2006-08-14 2012-07-17 Yamaha Corporation Method and apparatus for inspection of wafer and semiconductor device
JP2012146892A (ja) * 2011-01-14 2012-08-02 Renesas Electronics Corp 半導体装置の製造方法
JP2013074200A (ja) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The 脆性ウェハ加工用粘着テープ及びそれを用いた脆性ウェハの加工方法
JP2013214600A (ja) * 2012-04-02 2013-10-17 Disco Abrasive Syst Ltd 接着フィルム付きチップの形成方法
US8822241B2 (en) 2010-05-31 2014-09-02 Mitsubishi Electric Corporation Method of manufacturing a semiconductor device
TWI559361B (zh) * 2013-01-04 2016-11-21 Psk有限公司 基板處理裝置及其方法
JP2017157749A (ja) * 2016-03-03 2017-09-07 株式会社ディスコ ウェーハの加工方法
JP2018501972A (ja) * 2014-12-15 2018-01-25 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティドＷ．Ｌ． Ｇｏｒｅ ＆ Ａｓｓｏｃｉａｔｅｓ， Ｉｎｃｏｒｐｏｒａｔｅｄ 微小電気機械システムのためのベント取付けシステム
JP2019201051A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
JP2019201050A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
JP2019201049A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
KR20210015716A (ko) * 2019-08-01 2021-02-10 가부시기가이샤 디스코 기판 처리 방법
WO2024161636A1 (ja) * 2023-02-03 2024-08-08 ヤマハ発動機株式会社 レーザ加工装置、レーザ加工方法、半導体チップおよび半導体チップの製造方法

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US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US20060091126A1 (en) * 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
US7910822B1 (en) * 2005-10-17 2011-03-22 Solaria Corporation Fabrication process for photovoltaic cell
US8153464B2 (en) * 2005-10-18 2012-04-10 International Rectifier Corporation Wafer singulation process
KR100675001B1 (ko) * 2006-01-04 2007-01-29 삼성전자주식회사 웨이퍼 다이싱 방법 및 그 방법을 이용하여 제조된 다이
KR100679684B1 (ko) * 2006-02-16 2007-02-06 삼성전자주식회사 외곽에 보호층이 형성된 웨이퍼 레벨 반도체 소자 제조방법
JP2007235069A (ja) * 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing
KR100825798B1 (ko) * 2006-12-29 2008-04-28 삼성전자주식회사 다이싱 방법
JP5122854B2 (ja) * 2007-04-13 2013-01-16 株式会社ディスコ デバイスの研削方法
JP2010062375A (ja) * 2008-09-04 2010-03-18 Disco Abrasive Syst Ltd ウエーハの加工方法
KR101006526B1 (ko) * 2008-10-22 2011-01-07 주식회사 하이닉스반도체 웨이퍼 마운트 테이프, 이를 이용한 웨이퍼 가공 장치 및 방법
JP4988815B2 (ja) * 2009-12-25 2012-08-01 日東電工株式会社 チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法
JP5993845B2 (ja) 2010-06-08 2016-09-14 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
EP2671248A4 (en) * 2011-02-01 2015-10-07 Henkel Corp ON A PRECUTED WAFER APPLIED FILM ON A DICING TAPE
WO2012106191A2 (en) 2011-02-01 2012-08-09 Henkel Corporation Pre- cut wafer applied underfill film
JP5772092B2 (ja) * 2011-03-11 2015-09-02 富士電機株式会社 半導体製造方法および半導体製造装置
US8987898B2 (en) 2011-06-06 2015-03-24 International Rectifier Corporation Semiconductor wafer with reduced thickness variation and method for fabricating same
JP2013012690A (ja) * 2011-06-30 2013-01-17 Toshiba Corp 半導体ウエハの加工方法及び加工装置、並びに、半導体ウエハ
PL2773580T3 (pl) * 2011-11-02 2016-07-29 Langhammer Gmbh Urządzenie do przenoszenia i manipulacji produktami
JP5770677B2 (ja) * 2012-05-08 2015-08-26 株式会社ディスコ ウェーハの加工方法
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP6265594B2 (ja) 2012-12-21 2018-01-24 ラピスセミコンダクタ株式会社 半導体装置の製造方法、及び半導体装置
CN103295893B (zh) * 2013-05-29 2016-12-28 华进半导体封装先导技术研发中心有限公司 一种晶圆级微组装工艺
US20160005653A1 (en) * 2014-07-02 2016-01-07 Nxp B.V. Flexible wafer-level chip-scale packages with improved board-level reliability
JP6532273B2 (ja) * 2015-04-21 2019-06-19 株式会社ディスコ ウェーハの加工方法
MY186784A (en) * 2015-05-07 2021-08-20 Technoprobe Spa Testing head having vertical probes, in particular for reduced pitch applications
SG10201606197XA (en) * 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
SG10202100910UA (en) * 2015-08-18 2021-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m
US20170084490A1 (en) * 2015-09-18 2017-03-23 Stmicroelectronics, Inc. Method for making ic with stepped sidewall and related ic devices
JP6685126B2 (ja) * 2015-12-24 2020-04-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6608713B2 (ja) * 2016-01-19 2019-11-20 株式会社ディスコ ウエーハの加工方法
JP6619685B2 (ja) * 2016-04-19 2019-12-11 株式会社ディスコ ＳｉＣウエーハの加工方法
JP6669594B2 (ja) * 2016-06-02 2020-03-18 株式会社ディスコ ウエーハ生成方法
KR101831256B1 (ko) * 2016-07-01 2018-02-22 한미반도체 주식회사 반도체 스트립 정렬장치 및 반도체 스트립 정렬방법
KR102566170B1 (ko) * 2016-09-12 2023-08-10 삼성전자주식회사 웨이퍼 타공 장치
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
CN108091605B (zh) * 2017-12-06 2018-12-21 英特尔产品（成都）有限公司 一种降低晶圆误剥离的方法
CN109048504B (zh) * 2018-06-28 2020-01-14 华灿光电股份有限公司 一种晶圆的加工方法
JP7417411B2 (ja) * 2019-02-13 2024-01-18 株式会社ディスコ 確認方法
JP7542922B2 (ja) * 2020-12-21 2024-09-02 株式会社ディスコ 研削装置及び研削装置の駆動方法
CN112802734A (zh) * 2020-12-30 2021-05-14 长春长光圆辰微电子技术有限公司 硅片单侧膜淀积的方法
CN115602532B (zh) * 2022-12-13 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种实现晶片分离的方法及装置

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DE19520238C2 (de) * 1995-06-02 1998-01-15 Beiersdorf Ag Selbstklebeband
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JP3816253B2 (ja) * 1999-01-19 2006-08-30 富士通株式会社 半導体装置の製造方法
JP2002043251A (ja) * 2000-07-25 2002-02-08 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
WO2003028072A1 (en) * 2001-09-20 2003-04-03 Renesas Technology Corp. Method for manufacturing semiconductor device
JP3831287B2 (ja) * 2002-04-08 2006-10-11 株式会社日立製作所 半導体装置の製造方法

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US8224062B2 (en) 2006-08-14 2012-07-17 Yamaha Corporation Method and apparatus for inspection of wafer and semiconductor device
JP2008071992A (ja) * 2006-09-15 2008-03-27 Mitsubishi Electric Corp 半導体装置の製造方法、半導体ウエハおよび半導体装置
JP2008098348A (ja) * 2006-10-11 2008-04-24 Yamaha Corp 半導体チップの検査方法
JP2010525561A (ja) * 2007-04-17 2010-07-22 アイメック 基板の薄層化方法
JP2010177277A (ja) * 2009-01-27 2010-08-12 Tokyo Seimitsu Co Ltd レーザーダイシング方法及びレーザーダイシング装置
JP2011165932A (ja) * 2010-02-10 2011-08-25 Disco Abrasive Syst Ltd 裏面撮像テーブルユニット
US8822241B2 (en) 2010-05-31 2014-09-02 Mitsubishi Electric Corporation Method of manufacturing a semiconductor device
JP2012146892A (ja) * 2011-01-14 2012-08-02 Renesas Electronics Corp 半導体装置の製造方法
JP2013074200A (ja) * 2011-09-28 2013-04-22 Furukawa Electric Co Ltd:The 脆性ウェハ加工用粘着テープ及びそれを用いた脆性ウェハの加工方法
JP2013214600A (ja) * 2012-04-02 2013-10-17 Disco Abrasive Syst Ltd 接着フィルム付きチップの形成方法
TWI559361B (zh) * 2013-01-04 2016-11-21 Psk有限公司 基板處理裝置及其方法
US9508541B2 (en) 2013-01-04 2016-11-29 Psk Inc. Apparatus and method for treating substrate
JP2018501972A (ja) * 2014-12-15 2018-01-25 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティドＷ．Ｌ． Ｇｏｒｅ ＆ Ａｓｓｏｃｉａｔｅｓ， Ｉｎｃｏｒｐｏｒａｔｅｄ 微小電気機械システムのためのベント取付けシステム
JP2017157749A (ja) * 2016-03-03 2017-09-07 株式会社ディスコ ウェーハの加工方法
JP7134561B2 (ja) 2018-05-14 2022-09-12 株式会社ディスコ ウェーハの加工方法
JP2019201050A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
JP2019201049A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
JP2019201051A (ja) * 2018-05-14 2019-11-21 株式会社ディスコ ウェーハの加工方法
JP7134560B2 (ja) 2018-05-14 2022-09-12 株式会社ディスコ ウェーハの加工方法
JP7130323B2 (ja) 2018-05-14 2022-09-05 株式会社ディスコ ウェーハの加工方法
KR20210015716A (ko) * 2019-08-01 2021-02-10 가부시기가이샤 디스코 기판 처리 방법
JP2021027336A (ja) * 2019-08-01 2021-02-22 株式会社ディスコ 基板の処理法
JP7332095B2 (ja) 2019-08-01 2023-08-23 株式会社ディスコ 基板の処理法
KR102593404B1 (ko) * 2019-08-01 2023-10-23 가부시기가이샤 디스코 기판 처리 방법
US11823941B2 (en) 2019-08-01 2023-11-21 Disco Corporation Method of processing a substrate
WO2024161636A1 (ja) * 2023-02-03 2024-08-08 ヤマハ発動機株式会社 レーザ加工装置、レーザ加工方法、半導体チップおよび半導体チップの製造方法
TWI889124B (zh) * 2023-02-03 2025-07-01 日商山葉發動機股份有限公司 雷射加工裝置、雷射加工方法、半導體晶片及半導體晶片之製造方法

Also Published As

Publication number Publication date
CN1700424A (zh) 2005-11-23
TW200539338A (en) 2005-12-01
CN100407379C (zh) 2008-07-30
US20050260829A1 (en) 2005-11-24
KR20060048012A (ko) 2006-05-18

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