JP2002506927A5 - - Google Patents

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Publication number
JP2002506927A5
JP2002506927A5 JP2000536908A JP2000536908A JP2002506927A5 JP 2002506927 A5 JP2002506927 A5 JP 2002506927A5 JP 2000536908 A JP2000536908 A JP 2000536908A JP 2000536908 A JP2000536908 A JP 2000536908A JP 2002506927 A5 JP2002506927 A5 JP 2002506927A5
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JP
Japan
Prior art keywords
seed layer
copper
metal
layer
bath
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JP2000536908A
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English (en)
Japanese (ja)
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JP4642229B2 (ja
JP2002506927A (ja
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Priority claimed from US09/045,245 external-priority patent/US6197181B1/en
Application filed filed Critical
Priority claimed from PCT/US1999/006306 external-priority patent/WO1999047731A1/en
Publication of JP2002506927A publication Critical patent/JP2002506927A/ja
Publication of JP2002506927A5 publication Critical patent/JP2002506927A5/ja
Application granted granted Critical
Publication of JP4642229B2 publication Critical patent/JP4642229B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000536908A 1998-03-20 1999-03-22 半導体作業部材の上に銅を電解により沈着させる装置および方法 Expired - Fee Related JP4642229B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/045,245 1998-03-20
US09/045,245 US6197181B1 (en) 1998-03-20 1998-03-20 Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US8567598P 1998-05-15 1998-05-15
US60/085,675 1998-05-15
PCT/US1999/006306 WO1999047731A1 (en) 1998-03-20 1999-03-22 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

Publications (3)

Publication Number Publication Date
JP2002506927A JP2002506927A (ja) 2002-03-05
JP2002506927A5 true JP2002506927A5 (enExample) 2006-08-10
JP4642229B2 JP4642229B2 (ja) 2011-03-02

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JP2000536908A Expired - Fee Related JP4642229B2 (ja) 1998-03-20 1999-03-22 半導体作業部材の上に銅を電解により沈着させる装置および方法

Country Status (7)

Country Link
US (6) US6290833B1 (enExample)
EP (1) EP1064417A4 (enExample)
JP (1) JP4642229B2 (enExample)
KR (1) KR100420157B1 (enExample)
CN (1) CN1246504C (enExample)
TW (2) TWI223678B (enExample)
WO (1) WO1999047731A1 (enExample)

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