ATE466975T1 - Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren - Google Patents

Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren

Info

Publication number
ATE466975T1
ATE466975T1 AT00870299T AT00870299T ATE466975T1 AT E466975 T1 ATE466975 T1 AT E466975T1 AT 00870299 T AT00870299 T AT 00870299T AT 00870299 T AT00870299 T AT 00870299T AT E466975 T1 ATE466975 T1 AT E466975T1
Authority
AT
Austria
Prior art keywords
solution
copper
source
organic group
electroplatting
Prior art date
Application number
AT00870299T
Other languages
English (en)
Inventor
Roger Palmans
Yuri Lantasov
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE466975T1 publication Critical patent/ATE466975T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
AT00870299T 2000-12-13 2000-12-13 Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren ATE466975T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00870299A EP1215305B1 (de) 2000-12-13 2000-12-13 Verfahren zur Herstellung eines Elektroplattierungsbad und zugehöriges Kupfer-Plattierungsverfahren

Publications (1)

Publication Number Publication Date
ATE466975T1 true ATE466975T1 (de) 2010-05-15

Family

ID=8175873

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00870299T ATE466975T1 (de) 2000-12-13 2000-12-13 Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren

Country Status (4)

Country Link
US (1) US6872295B2 (de)
EP (1) EP1215305B1 (de)
AT (1) ATE466975T1 (de)
DE (1) DE60044362D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006245A1 (en) * 2003-07-08 2005-01-13 Applied Materials, Inc. Multiple-step electrodeposition process for direct copper plating on barrier metals
DE10323905A1 (de) * 2003-05-26 2005-01-05 Infineon Technologies Ag Verfahren zur Erzeugung von ultradünnen homogenen Metallschichten
US20090188808A1 (en) * 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
US20090283411A1 (en) * 2008-05-15 2009-11-19 Serdar Aksu Selenium electroplating chemistries and methods
US9831122B2 (en) 2012-05-29 2017-11-28 Globalfoundries Inc. Integrated circuit including wire structure, related method and design structure
CN114990533B (zh) * 2022-04-13 2023-06-16 江苏富乐华半导体科技股份有限公司 一种改善陶瓷基板表面电镀铜结合力的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
TW593731B (en) 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
EP1022355B1 (de) * 1999-01-15 2004-09-15 Imec (Interuniversity Microelectronics Center) VZW Absetzung von Kupfer auf einer aktivierten Oberfläche eines Substrats
EP1020543A1 (de) 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Absetzung von Kupfer auf einer aktivierter Oberfläche eines Substrats

Also Published As

Publication number Publication date
US20020153259A1 (en) 2002-10-24
DE60044362D1 (de) 2010-06-17
US6872295B2 (en) 2005-03-29
EP1215305B1 (de) 2010-05-05
EP1215305A1 (de) 2002-06-19

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Legal Events

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