ATE466975T1 - Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren - Google Patents

Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren

Info

Publication number
ATE466975T1
ATE466975T1 AT00870299T AT00870299T ATE466975T1 AT E466975 T1 ATE466975 T1 AT E466975T1 AT 00870299 T AT00870299 T AT 00870299T AT 00870299 T AT00870299 T AT 00870299T AT E466975 T1 ATE466975 T1 AT E466975T1
Authority
AT
Austria
Prior art keywords
solution
copper
source
organic group
electroplatting
Prior art date
Application number
AT00870299T
Other languages
English (en)
Inventor
Roger Palmans
Yuri Lantasov
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE466975T1 publication Critical patent/ATE466975T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
AT00870299T 2000-12-13 2000-12-13 Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren ATE466975T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00870299A EP1215305B1 (de) 2000-12-13 2000-12-13 Verfahren zur Herstellung eines Elektroplattierungsbad und zugehöriges Kupfer-Plattierungsverfahren

Publications (1)

Publication Number Publication Date
ATE466975T1 true ATE466975T1 (de) 2010-05-15

Family

ID=8175873

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00870299T ATE466975T1 (de) 2000-12-13 2000-12-13 Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren

Country Status (4)

Country Link
US (1) US6872295B2 (de)
EP (1) EP1215305B1 (de)
AT (1) ATE466975T1 (de)
DE (1) DE60044362D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006245A1 (en) * 2003-07-08 2005-01-13 Applied Materials, Inc. Multiple-step electrodeposition process for direct copper plating on barrier metals
DE10323905A1 (de) * 2003-05-26 2005-01-05 Infineon Technologies Ag Verfahren zur Erzeugung von ultradünnen homogenen Metallschichten
US20090188808A1 (en) * 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
US20090283411A1 (en) * 2008-05-15 2009-11-19 Serdar Aksu Selenium electroplating chemistries and methods
US9831122B2 (en) 2012-05-29 2017-11-28 Globalfoundries Inc. Integrated circuit including wire structure, related method and design structure
CN114990533B (zh) * 2022-04-13 2023-06-16 江苏富乐华半导体科技股份有限公司 一种改善陶瓷基板表面电镀铜结合力的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
TWI223678B (en) 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
EP1020543A1 (de) * 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Absetzung von Kupfer auf einer aktivierter Oberfläche eines Substrats
EP1022355B1 (de) * 1999-01-15 2004-09-15 Imec (Interuniversity Microelectronics Center) VZW Absetzung von Kupfer auf einer aktivierten Oberfläche eines Substrats

Also Published As

Publication number Publication date
DE60044362D1 (de) 2010-06-17
US20020153259A1 (en) 2002-10-24
EP1215305B1 (de) 2010-05-05
EP1215305A1 (de) 2002-06-19
US6872295B2 (en) 2005-03-29

Similar Documents

Publication Publication Date Title
TWI273146B (en) Method for manufacturing copper-resin composite material
KR940021765A (ko) 자체 가속성 및 재충전성 포름알데히드 비함유 함침 금속 도금법 및 이를 위한 조성물
KR20150113111A (ko) 무전해 구리도금용 수계 구리 콜로이드 촉매액 및 무전해 구리도금 방법
KR102474143B1 (ko) 폴리이미드 수지 상의 금속 피막 형성 방법
CN101675186B (zh) 向非导电基底施用金属涂层的方法
DE602004015748D1 (de) Lösung zum ätzen von kupferoberflächen und verfahren zur abscheidung von metall auf kupferoberflächen
KR860000411A (ko) 금속표면 처리공정
KR20030033034A (ko) 치환 무전해 금 도금액, 및 상기 도금액 제조용 첨가제
KR20120081107A (ko) 비전도성 기판에 금속 코팅을 적용하기 위한 프로세스
DE60044362D1 (de) Verfahren zur Herstellung eines Elektroplattierungsbad und zugehöriges Kupfer-Plattierungsverfahren
JPH09509219A (ja) 不均化反応による銅のアンモニアフリー付着
CN113737159A (zh) 用于抑制铜面化学镀渗镀的预浸液及其制备方法和应用
US20080248194A1 (en) Method for producing a copper layer on a substrate in a flat panel display manufacturing process
KR100856687B1 (ko) 유전체로 사용한 소재에 전도체 물질을 형성하는 무전해도금방법
US20220154343A1 (en) A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
EP0907763B1 (de) Verfahren zur reduktion von kupferoxid
ATE355399T1 (de) Verfahren zur stromlosen metallabscheidung und vorrichtung zur stromlosen metallabscheidung
JP4320606B2 (ja) 金めっき浴
US6383254B1 (en) Treatment solution and treatment method for reducing copper oxides
KR20130100042A (ko) 전해 경질 금도금액, 도금 방법 및 금-철 합금 피막의 제조 방법
JP2005256140A (ja) 金めっき浴
EP1022355A3 (de) Absetzung von Kupfer auf einer aktivierten Oberfläche eines Substrats
KR102641511B1 (ko) 무전해도금액 조성물 및 이를 이용한 구리도금방법
KR101059487B1 (ko) 주석 휘스커 방지제 및 그것을 이용한 휘스커 방지성 주석도금물의 제조 방법
JP2004332035A (ja) 無電解ニッケル−金めっき方法

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties