KR860000411A - 금속표면 처리공정 - Google Patents

금속표면 처리공정 Download PDF

Info

Publication number
KR860000411A
KR860000411A KR1019850004563A KR850004563A KR860000411A KR 860000411 A KR860000411 A KR 860000411A KR 1019850004563 A KR1019850004563 A KR 1019850004563A KR 850004563 A KR850004563 A KR 850004563A KR 860000411 A KR860000411 A KR 860000411A
Authority
KR
South Korea
Prior art keywords
treatment process
surface treatment
metal
process according
metal surface
Prior art date
Application number
KR1019850004563A
Other languages
English (en)
Other versions
KR890004583B1 (ko
Inventor
아끼시 나까소 (외 3)
Original Assignee
요꼬야마 료오지
히다찌가세이 고오교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59135562A external-priority patent/JPS6115981A/ja
Priority claimed from JP59135561A external-priority patent/JPS6115980A/ja
Priority claimed from JP60015807A external-priority patent/JPS61173932A/ja
Application filed by 요꼬야마 료오지, 히다찌가세이 고오교 가부시기가이샤 filed Critical 요꼬야마 료오지
Publication of KR860000411A publication Critical patent/KR860000411A/ko
Application granted granted Critical
Publication of KR890004583B1 publication Critical patent/KR890004583B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

내용 없음

Description

금속표면 처리공정
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 다층 인쇄배선판의 단면도.

Claims (11)

  1. (Ⅰ) 동이온, 동이온의 착화제, 동이온의 환원제, pH조절제, 물과 (Ⅱ) 상기 성분(Ⅰ)에 첨가하여 금속동과는 다른 빛깔과 광택을 갖는 동을 무전해 석출시킬 수 있는 N-함유유기화합물을 구성하는 액상 조성물로써 금속표면을 처리하는 금속표면 처리공정.
  2. 제1항에 있어서, 상기 N-함유유기화합물이 N-함유헤테로 고리화합물인 것을 특징으로 하는 금속 표면처리공정.
  3. 제2항에 있어서, 상기 N-함유헤테로 고리화합물이 2,4,6-트리스(2-피리딜)-S-트리아진,,′,″-트리피리딜, 1,10-페난트롤린, 4,7-디페닐-1,10-페난트롤린, 4,7-디메틸-1,10-페난트롤린, 4,7-디페닐-1,10-페난트롤린 디술폰산 디소듐염, 3-(2-피리딜)-5,6-디페닐-1,2,4-트리아진,,′-디피리딜, 프탈로시아닌그린 및 2,4-디메틸이미다졸린으로 구성된 군집에서 적어도 하나 선택된 것을 특징으로하는 금속표면 처리공정.
  4. 제1항에 있어서, N-함유화합물이 한 분자내에 -N=와 -NH2및/또는 -OH기를 함유하는 유기화합물인 것을 특징으로 하는 금속표면 처리공정.
  5. 제4항에 있어서, 상기 유기화합물이 8-아자구 아닌, 크산토프테린, 5-아미노인다졸, 2-아미노폐리미딘, 히드로클로라이드, 2-아미노페이미딘, 히드로브로마이드, 벤조구아나민, 아크리플라빈, 히드로클로라이드, 5-아미노-1H-테트라졸, 6-아미노-2-페닐-4-퀴놀리놀, 2-아미노-6.8-디히드록시퓨린, 2-아미노피리미딘, 6-히드록시-2,4,5-트라아미노피리미딘. 설페이트, 2,4-디아미노-6-히드록시피리미딘, 2-아미노-4-히드록시-6-메틸피리미딘, 4,6-디히드록시피리미딘, 니트로구아니딘, 1히드록시-1H-벤조트리아졸. 모노히드레이트, 2-히드록시벤즉이미디다졸, 및 2-아미노-3-히드폭시피리미딘으로 구성된 군집에서 적어도 하나 선택된 것을 특징으로 하는 금속표면 처리공정.
  6. 제1항에 있어서, 암모니아수, 환원제가 함유된 수용액 및 산성용액으로 구성된 군집에서 선택된 적어도 하나로써 상기 표면처리된 금속을 처리하는 단게가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
  7. 제2항에 있어서, 암모니아수, 환원제가 함유된 수용액 및 산성용액으로 구성된 군집에서 선택된 적어도 하나로써 상기 표면처리된 금속을 처리하는 단계가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
  8. 제3항에 있어서, 암모니아수, 환원제가 함유된 수용액 및 산성용액으로 구성된 군집에서 선택된 적어도 하나로써 상기 표면처리된 금속을 처리하는 단계가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
  9. 제5항에 있어서, 암모니아수, 혼원제가 함유된 수용액 및 산성용액으로 구성된 군집에서 선택된 적어도 하나로써 상기 표면처리된 금속을 처리하는 단게가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
  10. 제6항에 있어서, 하나이상의 금속층과 하나이상의 수지층으로 된 직층판으로 하기 위해 하나이상의 수지층을 상기 표면처리된 금속에 부착시키는 단계가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
  11. 제9항에 있어서, 하나이상의 금속층과 하나이상의 수지층으로 된 직층판으로 하기 위해 하나이상의 수지층을 상기 표면처리된 금속에 부착시키는 단계가 더 구성된 것을 특징으로 하는 금속표면 처리공정.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019850004563A 1984-06-29 1985-06-26 금속표면 처리공정 KR890004583B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP135561/84 1984-06-29
JP135561~2 1984-06-29
JP59135562A JPS6115981A (ja) 1984-06-29 1984-06-29 銅の表面処理法
JP59135561A JPS6115980A (ja) 1984-06-29 1984-06-29 銅の表面処理法
JP15807 1985-01-30
JP60015807A JPS61173932A (ja) 1985-01-30 1985-01-30 金属と樹脂層との積層体の製造法

Publications (2)

Publication Number Publication Date
KR860000411A true KR860000411A (ko) 1986-01-28
KR890004583B1 KR890004583B1 (ko) 1989-11-16

Family

ID=27281148

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850004563A KR890004583B1 (ko) 1984-06-29 1985-06-26 금속표면 처리공정

Country Status (4)

Country Link
US (1) US4643793A (ko)
EP (1) EP0170414B1 (ko)
KR (1) KR890004583B1 (ko)
DE (1) DE3582531D1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100597759B1 (ko) * 1998-04-16 2006-07-05 니혼 파커라이징 가부시키가이샤 금속의 표면처리 방법 및 이 표면처리 방법으로 얻어진 표면을 가진 금속부재

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3530617A1 (de) * 1985-08-23 1987-02-26 Schering Ag Konditionierungsmittel fuer die behandlung von basismaterialien
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
EP0364132A1 (en) * 1988-09-29 1990-04-18 Shikoku Chemicals Corporation Method for forming conversion coating on surface of copper or copper alloy
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
EP0469470B1 (en) * 1990-07-30 1996-10-09 Mitsubishi Gas Chemical Company, Inc. Process for producing multilayered printed board
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5261154A (en) * 1991-07-22 1993-11-16 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5279651A (en) * 1992-12-18 1994-01-18 Exxon Research & Engineering Company Inorganic/organic inhibitor for corrosion of iron containing materials in sulfur environment
US5358825A (en) * 1993-03-24 1994-10-25 Amp-Akzo Corporation Manufacture of printed circuit conductors by a partially additive process
JPH07254550A (ja) * 1994-03-16 1995-10-03 Fujitsu Ltd アクリル系レジストの形成方法
US5711996A (en) * 1995-09-28 1998-01-27 Man-Gill Chemical Company Aqueous coating compositions and coated metal surfaces
US5554211A (en) * 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
AU5561696A (en) * 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
MY144574A (en) * 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
JP2001107258A (ja) * 1999-10-06 2001-04-17 Hitachi Ltd 無電解銅めっき方法とめっき装置および多層配線基板
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
WO2009047584A1 (en) * 2007-10-11 2009-04-16 Hatchtech Pty. Ltd. Combination compositions and methods of use of the same for controlling infestation
CN101851431B (zh) * 2009-03-31 2011-10-12 比亚迪股份有限公司 一种塑料组合物及塑料表面金属化方法
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
KR20130007124A (ko) * 2011-06-29 2013-01-18 삼성전자주식회사 유기 보호막을 갖는 조인트 구조
KR102124324B1 (ko) * 2018-11-14 2020-06-18 와이엠티 주식회사 도금 적층체 및 인쇄회로기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1301618A (fr) * 1961-02-13 1962-08-17 Clevite Corp Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
US4313995A (en) * 1976-11-08 1982-02-02 Fortin Laminating Corporation Circuit board and method for producing same
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
US4388136A (en) * 1980-09-26 1983-06-14 Sperry Corporation Method of making a polyimide/glass hybrid printed circuit board
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100597759B1 (ko) * 1998-04-16 2006-07-05 니혼 파커라이징 가부시키가이샤 금속의 표면처리 방법 및 이 표면처리 방법으로 얻어진 표면을 가진 금속부재

Also Published As

Publication number Publication date
EP0170414A3 (en) 1986-12-30
US4643793A (en) 1987-02-17
DE3582531D1 (de) 1991-05-23
EP0170414B1 (en) 1991-04-17
EP0170414A2 (en) 1986-02-05
KR890004583B1 (ko) 1989-11-16

Similar Documents

Publication Publication Date Title
KR860000411A (ko) 금속표면 처리공정
EP0630991B1 (en) Electroless gold plating bath
DE69434619T2 (de) Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
KR970701275A (ko) 무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법(pretreatment solution for electroless plating, electroless plating bath and electroless plating method)
US5232492A (en) Electroless gold plating composition
ATE152188T1 (de) Verfahren zur abscheidung von palladiumschichten
SE8203085L (sv) Badkomposition for stromfri guldpletering
CN100595325C (zh) 一种制备木质电磁屏蔽材料的化学镀方法
CN101675186B (zh) 向非导电基底施用金属涂层的方法
US6383269B1 (en) Electroless gold plating solution and process
DE59802372D1 (de) Verfahren und lösung zur herstellung von goldschichten
JPS56156749A (en) Chemical copper plating solution
US5130168A (en) Electroless gold plating bath and method of using same
EP0361705A2 (en) Gold plating bath and method
DE2222941C3 (de) Verfahren zum Vorbehandeln von Acrylnitril/Butadien/Styrol-Harz-Substraten vor einer stromlosen Metallabscheidung
CN102482780A (zh) 沉积适用于将电线粘结在印刷电路板导体上的钯层的方法及所述方法中使用的钯浴
JP3148428B2 (ja) 無電解金めっき液
DE59406250D1 (de) Elektrolytische Abscheidung von Palladium oder Palladiumlegierungen
JP3677617B2 (ja) 無電解金めっき液
ATE466975T1 (de) Verfahren zur herstellung eines elektroplattierungsbad und zugehöriges kupfer- plattierungsverfahren
DE1621352A1 (de) Stabilisiertes alkalisches Kupferbad zur stromlosen Abscheidung von Kupfer
US5334240A (en) Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base
US4381951A (en) Method of removing contaminants from a surface
ES2141546T3 (es) Compuestos de azufre revestidos de un compuesto de zinc.
JPS575857A (en) Electroless indium-plating solution

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19971104

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee