KR970701275A - 무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법(pretreatment solution for electroless plating, electroless plating bath and electroless plating method) - Google Patents

무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법(pretreatment solution for electroless plating, electroless plating bath and electroless plating method)

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KR970701275A
KR970701275A KR1019960704700A KR19960704700A KR970701275A KR 970701275 A KR970701275 A KR 970701275A KR 1019960704700 A KR1019960704700 A KR 1019960704700A KR 19960704700 A KR19960704700 A KR 19960704700A KR 970701275 A KR970701275 A KR 970701275A
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electroless plating
plating
electroless
pretreatment liquid
adjuster
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KR1019960704700A
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KR100235850B1 (ko
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벤젠 유안
모토 아사이
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엔도 마사루
이비덴 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

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  • Microelectronics & Electronic Packaging (AREA)
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  • Chemically Coating (AREA)
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Abstract

Pd치환처리를 행하는 일없이 확실히 도금반응을 진행시킬 수가 있고, 게다가 도금석출의 고속화를 도무할 수 있는 무전해 도금기술로서, 기재상에 형성한 1차도금막(또는 금속막)에 2차도금(무전해도금)을 실시하는 무전해 도금방법에 있어서, 상기 1차도금막의 포면전위를 그 1차도금막의 표면전류밀도가 2차도금의 무전해 도금처리액중에서 0으로 되는 가장 낮은 표면전위 보다도 더욱 낮게 되도록 조정한후, 2차도금을 실시하는 것을 특징으로 하는 무전해 도금방법, 및 이를 실시하는데 사용하기에 알맞은 pH조정제, 환원제 및 착화제를 포함하는 무전해 도금용 전처리액과 무전해 도금욕을 제안한다.

Description

무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법(PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 1차도금을 실시한 기재의 각종 용액에 있어서의 분극측정결과를 도시하는 그래프이고,
제2도는 본 발명을 적용한 프린터 배선판의 1실시예를 도시하는 제조공정도이고,
제3도는 같은 본 발명을 적용한 다른 프린트 배선판의 1실시예를 도시하는 제조공정도이고,
제4도는 본 발명을 적용한 화장판(化粧板)의 1실시예를 도시하는 제조공정도이다.

Claims (31)

  1. pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액.
  2. 제1항에 있어서, 상기 pH조정제는 염기성 화합물인 것을 특징으로 하는 무전해 도급용 전처리액.
  3. 제1항에 있어서, 상기 환원제는 알데히드, 치아인산염, 수소화붕소염 및 히드라진 중에서 선택되는 적어도 어느 1종인 것을 특징으로 하는 무전해 도금용 전처리액.
  4. 제1항에 있어서, 상기 착화제는 카르복실산, 카르복실산염, 제3차아민, 디옥심, 디티존, 히드록시퀴놀린, β-디케론 및 아미노아세트산 중에서 선택되는 적어도 어느 1종인 것을 특징으로 하는 무전해 도금용 전처리액.
  5. 제1항에 있어서, 상기 착화제는 디가카르복실산, 디가카르복실산염, 방향족 카르복실산, 방향족 카르복실산염, 히드록시카르복실산, 히드록시카르복실산염, 트리알칸올모노아민, 에틸렌디아민4아세트산, 디메틸글리옥심, 벤질디글리옥심, 1, 2-시클로헥산디온디글리옥심, 옥신, 아세틸아세톤, 글리신 및 니트릴로3아세트산염 중에서 선택되는 적어도 어느 1종인 것을 특징으로 하는 무전해 도금용 전처리액.
  6. 제1항에 있어서, 상기 착화제는 타르타르산, 타르타르산염 및 트리에탄올아민 중에서 선택되는 적어도 어느 1종인 것을 특징으로 하는 무전해 도금용 처리액.
  7. 제1항에 있어서, pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하는 무전해 도금의 전처리로서 사용하는 것을 특징으로 하는 무전해 도금용 전처리액.
  8. pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액의 통과 pH조정제, 환원제, 금속이온 및 착화제로 주로 구성되는 무전해 도금액의 통으로 이루어지는 무전해 도금욕.
  9. 제8항에 있어서, 상기 무전해 도금용 전처리액은 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액인 것을 특징으로 하는 무전해 도금욕.
  10. 제8항에 있어서, 상기 전처리액과 무전해 도금액은 이들을 구성하는 pH조정제, 환원제 및 착화제중 적어도 어느 1종이 동일한 것임을 특징으로 하는 무전해 도금욕.
  11. 제8항에 있어서, 상기 무전해 도금액은 pH조정제, 환원제, 구리이온 및 트리알칼올아민으로 주로 구성되는 것을 특징으로 하는 무전해 도금욕.
  12. 기재상에 1차 도금을 실시한 후에 2차도금을 실시하는 무전해 도금방법에 있어서, 상기 2차도금은 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액에 의한 전처리를 행한후에 실시하는 것을 특징으로 하는 무전해 도금방법.
  13. 제12항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  14. 제12항에 있어서, 상기 2차도금은 pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  15. 기재상에 1차 도금을 실시한 후에 2차도금을 실시하는 무전해 도금방법에 있어서, 상기 1차도금을 실시하여 기재상에 형성한 1차도금막의 표면전위를, 그 1차도금막의 표면전류밀도가 2차도금의 무전해 도금액중에서 0으로 되는 가장 낮은 표면전위 보다도 더욱 낮게 되도록 조정한 후, 2차도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  16. 제15항에 있어서, 상기 1차도금막의 표면전위는 pH조정제, 환원제, 및 착화제로 주로 수성되는 무전해도금용 전처리액을 사용하여 조정되는 것을 특징으로 하는 무전해 도금방법.
  17. 제16항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  18. 제15항에 있어서, 상기 1차도금막의 표면전위를 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해도금용 전처리액을 사용하여, 그 1차도금막의 표면전류밀도가 2차도금의 무전해 도금액 중에서 0으로 되는 가장 낮은 표면전위보다도 더욱 낮게 되도록 조정한후, pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하여 2차도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  19. 제18항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  20. 제15항에 있어서, 상기 1차도금막의 표면전위를 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해도금용 전처리액을 사용하여, 포화감흥 전극을 표준전극으로 한 경우에 -0.8V보다도 더욱 낮게 되도록 조정한후, pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 2차도금의 무전해 구리도금액을 사용하여 2차도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  21. 제20항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  22. 기재상에 형성된 금속막상에 무전해 도금을 실시하는 무전해 도금방법에 있어서, 상기 무전해 도금은 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액에 의한 전처리를 행한후에 실시하는 것을 특징으로 하는 무전해 도금방법.
  23. 제22항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  24. 제22항에 있어서, 상기 무전해 도금은 pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  25. 기재상에 형성된 금속막상에 무전해 도금을 실시하는 무전해 도금방법에 있어서, 상기 금속막의 표면전위를 그 금속막의 표면전류밀도가 무전해 도금액 중에서 0으로 되는 가장 낮은 표면전위 보다도 더욱 낮게 되도록 조정한후 무전해 도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  26. 제25항에 있어서, 상기 금속막의 표면전위는 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액을 사용하여 조정되는 것을 특징으로 하는 무전해 도금방법.
  27. 제26항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  28. 제25항에 있어서, 상기 금속막의 표면전위를 pH조정제, 환원제, 및 착화제로 주로 구성되는 무전해 도금용 전처리액을 사용하여 그 금속막의 표면전류밀도가 무전해 도금액 중에서 0으로 되는 가장 낮은 표면전위보다도 더욱 낮게 되도록 조정한 후, pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하여 무전해 도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  29. 제28항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
  30. 제25항에 있어서, 상기 금속막의 표면전위를 pH조정제, 환원제 및 착화제로 주로 구성되는 무전해 도금용 전처리액을 사용하여, 포화감흥 전극을 표준전극으로 한 경우에 -0.8V보다 더욱 낮게 되도록 조정한후, pH조정제, 환원제, 구리이온 및 트리알칸올아민으로 주로 구성되는 무전해 구리도금액을 사용하여 무전해 도금을 실시하는 것을 특징으로 하는 무전해 도금방법.
  31. 제30항에 있어서, 상기 무전해 도금용 전처리액으로서 제2항 내지 제7항 중의 어느 한 항에 기재된 전처리액을 사용하는 것을 특징으로 하는 무전해 도금방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960704700A 1994-12-27 1995-10-03 무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법 KR100235850B1 (ko)

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