FR1301618A - Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille - Google Patents

Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille

Info

Publication number
FR1301618A
FR1301618A FR873937A FR873937A FR1301618A FR 1301618 A FR1301618 A FR 1301618A FR 873937 A FR873937 A FR 873937A FR 873937 A FR873937 A FR 873937A FR 1301618 A FR1301618 A FR 1301618A
Authority
FR
France
Prior art keywords
sheet
manufacturing process
printed circuits
laminated copper
copper sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR873937A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clevite Corp
Original Assignee
Clevite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clevite Corp filed Critical Clevite Corp
Priority to FR873937A priority Critical patent/FR1301618A/fr
Application granted granted Critical
Publication of FR1301618A publication Critical patent/FR1301618A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
FR873937A 1961-02-13 1961-09-22 Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille Expired FR1301618A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR873937A FR1301618A (fr) 1961-02-13 1961-09-22 Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8902561A 1961-02-13 1961-02-13
FR873937A FR1301618A (fr) 1961-02-13 1961-09-22 Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille

Publications (1)

Publication Number Publication Date
FR1301618A true FR1301618A (fr) 1962-08-17

Family

ID=26192403

Family Applications (1)

Application Number Title Priority Date Filing Date
FR873937A Expired FR1301618A (fr) 1961-02-13 1961-09-22 Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille

Country Status (1)

Country Link
FR (1) FR1301618A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2190612A1 (fr) * 1972-06-29 1974-02-01 Fujitsu Ltd
EP0170414A2 (fr) * 1984-06-29 1986-02-05 Hitachi Chemical Co., Ltd. Procédé de traitement de surfaces métalliques
EP0223716A2 (fr) * 1985-11-21 1987-05-27 Shin-Etsu Chemical Co., Ltd. Laminé comportant une feuille de cuivre pour plaque de circuit imprimé flexible

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2190612A1 (fr) * 1972-06-29 1974-02-01 Fujitsu Ltd
EP0170414A2 (fr) * 1984-06-29 1986-02-05 Hitachi Chemical Co., Ltd. Procédé de traitement de surfaces métalliques
EP0170414A3 (en) * 1984-06-29 1986-12-30 Hitachi Chemical Co., Ltd. Process for treating metal surface
EP0223716A2 (fr) * 1985-11-21 1987-05-27 Shin-Etsu Chemical Co., Ltd. Laminé comportant une feuille de cuivre pour plaque de circuit imprimé flexible
EP0223716A3 (en) * 1985-11-21 1987-08-05 Shin-Etsu Chemical Co., Ltd. A copper-foiled laminated sheet for flexible printed circuit board

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