FR1450874A - Procédé de fabrication de circuits imprimés - Google Patents

Procédé de fabrication de circuits imprimés

Info

Publication number
FR1450874A
FR1450874A FR31741A FR31741A FR1450874A FR 1450874 A FR1450874 A FR 1450874A FR 31741 A FR31741 A FR 31741A FR 31741 A FR31741 A FR 31741A FR 1450874 A FR1450874 A FR 1450874A
Authority
FR
France
Prior art keywords
printed circuit
manufacturing process
circuit manufacturing
printed
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR31741A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB4066664A external-priority patent/GB1061750A/en
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to FR31741A priority Critical patent/FR1450874A/fr
Application granted granted Critical
Publication of FR1450874A publication Critical patent/FR1450874A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR31741A 1964-10-06 1965-09-17 Procédé de fabrication de circuits imprimés Expired FR1450874A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR31741A FR1450874A (fr) 1964-10-06 1965-09-17 Procédé de fabrication de circuits imprimés

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB4066664A GB1061750A (en) 1964-10-06 1964-10-06 A method of producing printed wiring assemblies
FR31741A FR1450874A (fr) 1964-10-06 1965-09-17 Procédé de fabrication de circuits imprimés

Publications (1)

Publication Number Publication Date
FR1450874A true FR1450874A (fr) 1966-06-24

Family

ID=26166193

Family Applications (1)

Application Number Title Priority Date Filing Date
FR31741A Expired FR1450874A (fr) 1964-10-06 1965-09-17 Procédé de fabrication de circuits imprimés

Country Status (1)

Country Link
FR (1) FR1450874A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280641B1 (en) * 1998-06-02 2001-08-28 Mitsubishi Gas Chemical Company, Inc. Printed wiring board having highly reliably via hole and process for forming via hole

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280641B1 (en) * 1998-06-02 2001-08-28 Mitsubishi Gas Chemical Company, Inc. Printed wiring board having highly reliably via hole and process for forming via hole

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