ATE466975T1 - METHOD FOR PRODUCING AN ELECTROPLATTING BATH AND ASSOCIATED COPPER PLATING PROCESS - Google Patents

METHOD FOR PRODUCING AN ELECTROPLATTING BATH AND ASSOCIATED COPPER PLATING PROCESS

Info

Publication number
ATE466975T1
ATE466975T1 AT00870299T AT00870299T ATE466975T1 AT E466975 T1 ATE466975 T1 AT E466975T1 AT 00870299 T AT00870299 T AT 00870299T AT 00870299 T AT00870299 T AT 00870299T AT E466975 T1 ATE466975 T1 AT E466975T1
Authority
AT
Austria
Prior art keywords
solution
copper
source
organic group
electroplatting
Prior art date
Application number
AT00870299T
Other languages
German (de)
Inventor
Roger Palmans
Yuri Lantasov
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE466975T1 publication Critical patent/ATE466975T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention is related to A method for the preparation of a composition for electroplating a copper-containing layer on a substrate, comprising the steps of: (i) providing an aqueous solution comprising at least: a source of copper Cu (II) ions, an additive to adjust the pH to a predetermined value, and a complexing agent for complexing Cu (II) ions, said complexing agent having the chemical formula: COOR1-COHR2R3 wherein R1 is an organic group covalently bound to the carboxylate group (COO), R2 is either hydrogen or an organic group, and R3 is either hydrogen or an organic group, said solution comprising no reducing agent, (ii) providing electrons from a source not being in direct contact with said solution, through transport means assuming the contact between said source and said solution. The present invention is also related to a process for forming a copper-containing layer on a substrate in an electroplating bath prepared according to said method.
AT00870299T 2000-12-13 2000-12-13 METHOD FOR PRODUCING AN ELECTROPLATTING BATH AND ASSOCIATED COPPER PLATING PROCESS ATE466975T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00870299A EP1215305B1 (en) 2000-12-13 2000-12-13 Method for preparing an electroplating bath and related copper plating process

Publications (1)

Publication Number Publication Date
ATE466975T1 true ATE466975T1 (en) 2010-05-15

Family

ID=8175873

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00870299T ATE466975T1 (en) 2000-12-13 2000-12-13 METHOD FOR PRODUCING AN ELECTROPLATTING BATH AND ASSOCIATED COPPER PLATING PROCESS

Country Status (4)

Country Link
US (1) US6872295B2 (en)
EP (1) EP1215305B1 (en)
AT (1) ATE466975T1 (en)
DE (1) DE60044362D1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050006245A1 (en) * 2003-07-08 2005-01-13 Applied Materials, Inc. Multiple-step electrodeposition process for direct copper plating on barrier metals
DE10323905A1 (en) * 2003-05-26 2005-01-05 Infineon Technologies Ag Method of producing ultrathin homogeneous metal layers
US20090188808A1 (en) * 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
US20090283411A1 (en) * 2008-05-15 2009-11-19 Serdar Aksu Selenium electroplating chemistries and methods
US9831122B2 (en) 2012-05-29 2017-11-28 Globalfoundries Inc. Integrated circuit including wire structure, related method and design structure
CN114990533B (en) * 2022-04-13 2023-06-16 江苏富乐华半导体科技股份有限公司 Method for improving binding force of electroplated copper on surface of ceramic substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
JPH0544075A (en) * 1991-08-15 1993-02-23 Nippon Riironaale Kk Copper striking method substituted for electroless copper plating
TWI223678B (en) 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
EP1020543A1 (en) 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Deposition of copper on an activated surface of a substrate
EP1022355B1 (en) * 1999-01-15 2004-09-15 Imec (Interuniversity Microelectronics Center) VZW Deposition of copper on an activated surface of a substrate

Also Published As

Publication number Publication date
EP1215305A1 (en) 2002-06-19
US20020153259A1 (en) 2002-10-24
US6872295B2 (en) 2005-03-29
DE60044362D1 (en) 2010-06-17
EP1215305B1 (en) 2010-05-05

Similar Documents

Publication Publication Date Title
KR101089616B1 (en) Method for Manufacturing Copper-Resin Composite Material
KR20170059493A (en) Aqueous copper colloid catalyst solution and electroless copper plating method for the electroless copper plating
DE602004015748D1 (en) SOLUTION FOR COATING COPPER SURFACES AND METHOD FOR DECOMPOSING ON COPPER SURFACES
KR860000411A (en) Metal Surface Treatment Process
ES2395736T3 (en) Procedure for applying a metallic coating to a non-conductive substrate
EP1327700A1 (en) Electroless displacement gold plating solution and additive for preparing said plating solution
DE60044362D1 (en) Process for producing an electroplating bath and associated copper plating process
KR20120081107A (en) Process for applying a metal coating to a non-conductive substrate
CN113737159B (en) Presoaking liquid for inhibiting copper surface chemical plating and infiltration plating, and preparation method and application thereof
JPH09509219A (en) Ammonia-free deposition of copper by disproportionation reaction
JP6676620B2 (en) Copper circuit, copper alloy circuit, and method of reducing light reflectance of touch screen device
US20080248194A1 (en) Method for producing a copper layer on a substrate in a flat panel display manufacturing process
KR102474143B1 (en) Method for forming metal film on polyimide resin
EP0907763B1 (en) Process for the reduction of copper oxide
JP4646376B2 (en) Accelerator bath solution for direct plating and direct plating method
CN102482780A (en) Method for depositing a palladium layer suitable for wire bonding on conductors of a printed circuit board and palladium bath for use in said method
JP4320606B2 (en) Gold plating bath
US20220154343A1 (en) A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
JP2005256140A (en) Gold plating bath
KR20130100042A (en) Electrolytic hard gold plating solution, plating method, and method for manufacturing gold-iron alloy coating
KR102641511B1 (en) Electroless plating solution and method of copper electroplating
EP1022355A3 (en) Deposition of copper on an activated surface of a substrate
JP4059133B2 (en) Electroless nickel-gold plating method
KR101059487B1 (en) Tin whisker inhibitor and manufacturing method of whisker-resistant tin plating material using the same
JPS613883A (en) Chemical copper plating method

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties