JPS5216433A - Method of producing very thin copper foil - Google Patents

Method of producing very thin copper foil

Info

Publication number
JPS5216433A
JPS5216433A JP9280775A JP9280775A JPS5216433A JP S5216433 A JPS5216433 A JP S5216433A JP 9280775 A JP9280775 A JP 9280775A JP 9280775 A JP9280775 A JP 9280775A JP S5216433 A JPS5216433 A JP S5216433A
Authority
JP
Japan
Prior art keywords
producing
copper foil
thin copper
thin
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9280775A
Other languages
Japanese (ja)
Inventor
Masanori Yokoyama
Mitsuru Satou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical Furukawa Metals Co Ltd
Priority to JP9280775A priority Critical patent/JPS5216433A/en
Publication of JPS5216433A publication Critical patent/JPS5216433A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP9280775A 1975-07-30 1975-07-30 Method of producing very thin copper foil Pending JPS5216433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9280775A JPS5216433A (en) 1975-07-30 1975-07-30 Method of producing very thin copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9280775A JPS5216433A (en) 1975-07-30 1975-07-30 Method of producing very thin copper foil

Publications (1)

Publication Number Publication Date
JPS5216433A true JPS5216433A (en) 1977-02-07

Family

ID=14064673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9280775A Pending JPS5216433A (en) 1975-07-30 1975-07-30 Method of producing very thin copper foil

Country Status (1)

Country Link
JP (1) JPS5216433A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147883A (en) * 1984-12-20 1986-07-05 C Uyemura & Co Ltd Plating method onto aluminum or alloy thereof
US6632345B1 (en) 1998-03-20 2003-10-14 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a workpiece
US6811675B2 (en) 1998-03-20 2004-11-02 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US7025866B2 (en) 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
JP2008531363A (en) * 2005-02-25 2008-08-14 ベール ゲーエムベーハー ウント コー カーゲー A device that regulates airflow

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147883A (en) * 1984-12-20 1986-07-05 C Uyemura & Co Ltd Plating method onto aluminum or alloy thereof
US6632345B1 (en) 1998-03-20 2003-10-14 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a workpiece
US6638410B2 (en) 1998-03-20 2003-10-28 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US6811675B2 (en) 1998-03-20 2004-11-02 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US6919013B2 (en) 1998-03-20 2005-07-19 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a workpiece
US6932892B2 (en) 1998-03-20 2005-08-23 Semitool, Inc. Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
US7025866B2 (en) 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
JP2008531363A (en) * 2005-02-25 2008-08-14 ベール ゲーエムベーハー ウント コー カーゲー A device that regulates airflow

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