JPS5216433A - Method of producing very thin copper foil - Google Patents
Method of producing very thin copper foilInfo
- Publication number
- JPS5216433A JPS5216433A JP9280775A JP9280775A JPS5216433A JP S5216433 A JPS5216433 A JP S5216433A JP 9280775 A JP9280775 A JP 9280775A JP 9280775 A JP9280775 A JP 9280775A JP S5216433 A JPS5216433 A JP S5216433A
- Authority
- JP
- Japan
- Prior art keywords
- producing
- copper foil
- thin copper
- thin
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 239000011889 copper foil Substances 0.000 title 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9280775A JPS5216433A (en) | 1975-07-30 | 1975-07-30 | Method of producing very thin copper foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9280775A JPS5216433A (en) | 1975-07-30 | 1975-07-30 | Method of producing very thin copper foil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5216433A true JPS5216433A (en) | 1977-02-07 |
Family
ID=14064673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9280775A Pending JPS5216433A (en) | 1975-07-30 | 1975-07-30 | Method of producing very thin copper foil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5216433A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61147883A (en) * | 1984-12-20 | 1986-07-05 | C Uyemura & Co Ltd | Plating method onto aluminum or alloy thereof |
US6632345B1 (en) | 1998-03-20 | 2003-10-14 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a workpiece |
US6811675B2 (en) | 1998-03-20 | 2004-11-02 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US7025866B2 (en) | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
JP2008531363A (en) * | 2005-02-25 | 2008-08-14 | ベール ゲーエムベーハー ウント コー カーゲー | A device that regulates airflow |
-
1975
- 1975-07-30 JP JP9280775A patent/JPS5216433A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61147883A (en) * | 1984-12-20 | 1986-07-05 | C Uyemura & Co Ltd | Plating method onto aluminum or alloy thereof |
US6632345B1 (en) | 1998-03-20 | 2003-10-14 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a workpiece |
US6638410B2 (en) | 1998-03-20 | 2003-10-28 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6811675B2 (en) | 1998-03-20 | 2004-11-02 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6919013B2 (en) | 1998-03-20 | 2005-07-19 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a workpiece |
US6932892B2 (en) | 1998-03-20 | 2005-08-23 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US7025866B2 (en) | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
JP2008531363A (en) * | 2005-02-25 | 2008-08-14 | ベール ゲーエムベーハー ウント コー カーゲー | A device that regulates airflow |
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