IL115637A - Naked 3D integrated circuits - Google Patents

Naked 3D integrated circuits

Info

Publication number
IL115637A
IL115637A IL11563795A IL11563795A IL115637A IL 115637 A IL115637 A IL 115637A IL 11563795 A IL11563795 A IL 11563795A IL 11563795 A IL11563795 A IL 11563795A IL 115637 A IL115637 A IL 115637A
Authority
IL
Israel
Prior art keywords
chip
carrier
pads
carrier substrate
vias
Prior art date
Application number
IL11563795A
Other languages
English (en)
Hebrew (he)
Other versions
IL115637A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL115637A0 publication Critical patent/IL115637A0/xx
Publication of IL115637A publication Critical patent/IL115637A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1076—Shape of the containers
    • H01L2225/1088—Arrangements to limit the height of the assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
IL11563795A 1994-10-20 1995-10-15 Naked 3D integrated circuits IL115637A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/326,455 US5579207A (en) 1994-10-20 1994-10-20 Three-dimensional integrated circuit stacking

Publications (2)

Publication Number Publication Date
IL115637A0 IL115637A0 (en) 1996-01-19
IL115637A true IL115637A (en) 1998-09-24

Family

ID=23272291

Family Applications (1)

Application Number Title Priority Date Filing Date
IL11563795A IL115637A (en) 1994-10-20 1995-10-15 Naked 3D integrated circuits

Country Status (5)

Country Link
US (1) US5579207A (de)
EP (1) EP0708484B1 (de)
JP (1) JP2703745B2 (de)
DE (1) DE69522887T2 (de)
IL (1) IL115637A (de)

Families Citing this family (169)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100437436B1 (ko) * 1994-03-18 2004-07-16 히다치 가세고교 가부시끼가이샤 반도체패키지의제조법및반도체패키지
US5468917A (en) * 1994-03-23 1995-11-21 International Business Machines Corporation Circuitized structure including flexible circuit with elastomeric member bonded thereto
US5701233A (en) * 1995-01-23 1997-12-23 Irvine Sensors Corporation Stackable modules and multimodular assemblies
JPH09214097A (ja) * 1996-02-06 1997-08-15 Toshiba Corp プリント回路基板
US5914534A (en) * 1996-05-03 1999-06-22 Ford Motor Company Three-dimensional multi-layer molded electronic device and method for manufacturing same
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
KR100422608B1 (ko) * 1997-05-10 2004-06-04 삼성전자주식회사 적층칩패키지
US6195268B1 (en) * 1997-06-09 2001-02-27 Floyd K. Eide Stacking layers containing enclosed IC chips
US5790384A (en) * 1997-06-26 1998-08-04 International Business Machines Corporation Bare die multiple dies for direct attach
US6070531A (en) * 1997-07-22 2000-06-06 Autoliv Asp, Inc. Application specific integrated circuit package and initiator employing same
KR100280398B1 (ko) * 1997-09-12 2001-02-01 김영환 적층형 반도체 패키지 모듈의 제조 방법
KR19990051841A (ko) * 1997-12-20 1999-07-05 김영환 칩 스케일 패키지 및 그 제조방법
US6099677A (en) * 1998-02-13 2000-08-08 Merrimac Industries, Inc. Method of making microwave, multifunction modules using fluoropolymer composite substrates
JP3109477B2 (ja) * 1998-05-26 2000-11-13 日本電気株式会社 マルチチップモジュール
JP3563604B2 (ja) * 1998-07-29 2004-09-08 株式会社東芝 マルチチップ半導体装置及びメモリカード
US6668242B1 (en) * 1998-09-25 2003-12-23 Infineon Technologies North America Corp. Emulator chip package that plugs directly into the target system
US6190425B1 (en) 1998-11-03 2001-02-20 Zomaya Group, Inc. Memory bar and related circuits and methods
US6295220B1 (en) 1998-11-03 2001-09-25 Zomaya Group, Inc. Memory bar and related circuits and methods
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
US6268568B1 (en) * 1999-05-04 2001-07-31 Anam Semiconductor, Inc. Printed circuit board with oval solder ball lands for BGA semiconductor packages
US6593645B2 (en) * 1999-09-24 2003-07-15 United Microelectronics Corp. Three-dimensional system-on-chip structure
US6392428B1 (en) * 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
US6627864B1 (en) 1999-11-22 2003-09-30 Amkor Technology, Inc. Thin image sensor package
US6396043B1 (en) 1999-11-22 2002-05-28 Amkor Technology, Inc. Thin image sensor package fabrication method
JP2001177051A (ja) * 1999-12-20 2001-06-29 Toshiba Corp 半導体装置及びシステム装置
AU2001234610A1 (en) * 2000-01-31 2001-08-07 Joseph L. Chovan Micro electro-mechanical component and system architecture
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US6571466B1 (en) 2000-03-27 2003-06-03 Amkor Technology, Inc. Flip chip image sensor package fabrication method
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
US6362972B1 (en) * 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
US6812048B1 (en) 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6537831B1 (en) * 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
JP3874062B2 (ja) * 2000-09-05 2007-01-31 セイコーエプソン株式会社 半導体装置
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US6686657B1 (en) 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
US6342406B1 (en) 2000-11-15 2002-01-29 Amkor Technology, Inc. Flip chip on glass image sensor package fabrication method
US6849916B1 (en) 2000-11-15 2005-02-01 Amkor Technology, Inc. Flip chip on glass sensor package
US6524885B2 (en) * 2000-12-15 2003-02-25 Eaglestone Partners I, Llc Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US20020076854A1 (en) * 2000-12-15 2002-06-20 Pierce John L. System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates
US6529022B2 (en) 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
US20020078401A1 (en) * 2000-12-15 2002-06-20 Fry Michael Andrew Test coverage analysis system
US6673653B2 (en) * 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
US6469375B2 (en) * 2001-02-28 2002-10-22 William F. Beausoleil High bandwidth 3D memory packaging technique
KR100897314B1 (ko) * 2001-03-14 2009-05-14 레가시 일렉트로닉스, 인크. 반도체 칩의 3차원 표면 실장 어레이를 갖는 회로 기판을 제조하기 위한 방법 및 장치
US6979892B2 (en) * 2001-04-25 2005-12-27 Delphi Technologies, Inc. Laminated co-fired sandwiched element for non-thermal plasma reactor
US6586826B1 (en) 2001-06-13 2003-07-01 Amkor Technology, Inc. Integrated circuit package having posts for connection to other packages and substrates
US6476476B1 (en) * 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
US20040173894A1 (en) * 2001-09-27 2004-09-09 Amkor Technology, Inc. Integrated circuit package including interconnection posts for multiple electrical connections
US20050051859A1 (en) * 2001-10-25 2005-03-10 Amkor Technology, Inc. Look down image sensor package
JP3655242B2 (ja) * 2002-01-04 2005-06-02 株式会社東芝 半導体パッケージ及び半導体実装装置
ES2440770T3 (es) * 2002-02-26 2014-01-30 Legacy Electronics, Inc. Un soporte modular de microplaquetas de circuitos integrados
US7754976B2 (en) * 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
US6711029B2 (en) * 2002-05-21 2004-03-23 Cts Corporation Low temperature co-fired ceramic with improved shrinkage control
WO2004006333A1 (en) * 2002-07-04 2004-01-15 Koninklijke Philips Electronics N.V. Multi electric device package
JP3778445B2 (ja) * 2003-03-27 2006-05-24 富士通株式会社 半導体装置
US7030486B1 (en) * 2003-05-29 2006-04-18 Marshall Paul N High density integrated circuit package architecture
US6768189B1 (en) * 2003-06-04 2004-07-27 Northrop Grumman Corporation High power chip scale package
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
US7042307B2 (en) * 2003-09-10 2006-05-09 Merrimac Industries, Inc. Coupler resource module
JP4175241B2 (ja) * 2003-11-07 2008-11-05 セイコーエプソン株式会社 半導体装置の製造方法
JP3751625B2 (ja) 2004-06-29 2006-03-01 新光電気工業株式会社 貫通電極の製造方法
KR100688500B1 (ko) * 2004-09-06 2007-03-02 삼성전자주식회사 반도체 칩 보호용 더미 패키지 기판을 구비하는 멀티스택패키지와 그 제조 방법
KR100608289B1 (ko) * 2004-10-01 2006-08-09 엘지이노텍 주식회사 프론트 엔드 모듈
JP2006165320A (ja) * 2004-12-08 2006-06-22 Matsushita Electric Ind Co Ltd 半導体積層モジュールとその製造方法
JP4433298B2 (ja) * 2004-12-16 2010-03-17 パナソニック株式会社 多段構成半導体モジュール
WO2006076381A2 (en) 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
US7279786B2 (en) * 2005-02-04 2007-10-09 Stats Chippac Ltd. Nested integrated circuit package on package system
EP1863087A4 (de) 2005-03-17 2010-12-22 Panasonic Corp Modul-board
US7364945B2 (en) * 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
US7354800B2 (en) * 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7746656B2 (en) * 2005-05-16 2010-06-29 Stats Chippac Ltd. Offset integrated circuit package-on-package stacking system
US7518224B2 (en) * 2005-05-16 2009-04-14 Stats Chippac Ltd. Offset integrated circuit package-on-package stacking system
US8643163B2 (en) * 2005-08-08 2014-02-04 Stats Chippac Ltd. Integrated circuit package-on-package stacking system and method of manufacture thereof
US20070108583A1 (en) * 2005-08-08 2007-05-17 Stats Chippac Ltd. Integrated circuit package-on-package stacking system
US8389867B2 (en) * 2005-09-30 2013-03-05 Ibiden Co., Ltd. Multilayered circuit substrate with semiconductor device incorporated therein
US7768125B2 (en) * 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7456088B2 (en) * 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7750482B2 (en) * 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) * 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
US7435619B2 (en) * 2006-02-14 2008-10-14 Stats Chippac Ltd. Method of fabricating a 3-D package stacking system
JP2007234782A (ja) * 2006-02-28 2007-09-13 Toyota Industries Corp 複合回路基板
US7903417B2 (en) * 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics
US20080084671A1 (en) * 2006-10-10 2008-04-10 Ronnie Dean Stahlhut Electrical circuit assembly for high-power electronics
KR100817073B1 (ko) * 2006-11-03 2008-03-26 삼성전자주식회사 휨방지용 보강부재가 기판에 연결된 반도체 칩 스택 패키지
JP5068990B2 (ja) * 2006-12-26 2012-11-07 新光電気工業株式会社 電子部品内蔵基板
US8163600B2 (en) * 2006-12-28 2012-04-24 Stats Chippac Ltd. Bridge stack integrated circuit package-on-package system
TWI335070B (en) * 2007-03-23 2010-12-21 Advanced Semiconductor Eng Semiconductor package and the method of making the same
KR100874926B1 (ko) * 2007-06-07 2008-12-19 삼성전자주식회사 스택 모듈, 이를 포함하는 카드 및 이를 포함하는 시스템
US7713891B1 (en) * 2007-06-19 2010-05-11 Milliken & Company Flame resistant fabrics and process for making
DE102007041892A1 (de) * 2007-09-04 2009-03-05 Robert Bosch Gmbh Elektrische Schaltanordnung mit einem MID-Schaltungsträger und einer damit verbundenen Verbindungsschnittstelle
US8124451B2 (en) * 2007-09-21 2012-02-28 Stats Chippac Ltd. Integrated circuit packaging system with interposer
US7933128B2 (en) * 2007-10-10 2011-04-26 Epson Toyocom Corporation Electronic device, electronic module, and methods for manufacturing the same
US8399973B2 (en) * 2007-12-20 2013-03-19 Mosaid Technologies Incorporated Data storage and stackable configurations
US7791175B2 (en) * 2007-12-20 2010-09-07 Mosaid Technologies Incorporated Method for stacking serially-connected integrated circuits and multi-chip device made from same
EP2250862B1 (de) 2008-02-13 2019-06-12 Cameron International Corporation Anordnungssystem
US8258015B2 (en) * 2008-02-22 2012-09-04 Stats Chippac Ltd. Integrated circuit package system with penetrable film adhesive
JP5175616B2 (ja) * 2008-05-23 2013-04-03 シャープ株式会社 半導体装置およびその製造方法
TWI473553B (zh) * 2008-07-03 2015-02-11 Advanced Semiconductor Eng 晶片封裝結構
US8304869B2 (en) * 2008-08-01 2012-11-06 Stats Chippac Ltd. Fan-in interposer on lead frame for an integrated circuit package on package system
US8339474B2 (en) * 2008-08-20 2012-12-25 Freescale Semiconductor, Inc. Gain controlled threshold in denoising filter for image signal processing
US7836586B2 (en) * 2008-08-21 2010-11-23 National Semiconductor Corporation Thin foil semiconductor package
US20100171206A1 (en) * 2009-01-07 2010-07-08 Chi-Chih Chu Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same
TWI499024B (zh) * 2009-01-07 2015-09-01 Advanced Semiconductor Eng 堆疊式多封裝構造裝置、半導體封裝構造及其製造方法
US8012797B2 (en) * 2009-01-07 2011-09-06 Advanced Semiconductor Engineering, Inc. Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
US7894230B2 (en) * 2009-02-24 2011-02-22 Mosaid Technologies Incorporated Stacked semiconductor devices including a master device
JP2011029535A (ja) * 2009-07-29 2011-02-10 Elpida Memory Inc 半導体装置
TWI469283B (zh) * 2009-08-31 2015-01-11 Advanced Semiconductor Eng 封裝結構以及封裝製程
US10202720B2 (en) 2009-10-21 2019-02-12 Milliken & Company Flame resistant textile
US8198131B2 (en) 2009-11-18 2012-06-12 Advanced Semiconductor Engineering, Inc. Stackable semiconductor device packages
US8304888B2 (en) * 2009-12-22 2012-11-06 Fairchild Semiconductor Corporation Integrated circuit package with embedded components
US8432031B1 (en) * 2009-12-22 2013-04-30 Western Digital Technologies, Inc. Semiconductor die including a current routing line having non-metallic slots
TWI408785B (zh) 2009-12-31 2013-09-11 Advanced Semiconductor Eng 半導體封裝結構
US8115260B2 (en) 2010-01-06 2012-02-14 Fairchild Semiconductor Corporation Wafer level stack die package
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI419283B (zh) 2010-02-10 2013-12-11 Advanced Semiconductor Eng 封裝結構
US9496152B2 (en) * 2010-03-12 2016-11-15 STATS ChipPAC Pte. Ltd. Carrier system with multi-tier conductive posts and method of manufacture thereof
US7928552B1 (en) 2010-03-12 2011-04-19 Stats Chippac Ltd. Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
US8278746B2 (en) 2010-04-02 2012-10-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages including connecting elements
US8624374B2 (en) 2010-04-02 2014-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
EP2393345A1 (de) * 2010-05-04 2011-12-07 Vincotech Holdings S.a.r.l. Schaltungsträger mit Aussparung zum Aufnehmen elektronischer Bauteile, die mit einer Leiterplatine in Kontakt kommen
JP5206822B2 (ja) 2010-07-09 2013-06-12 株式会社デンソー 半導体装置
US8253234B2 (en) 2010-10-28 2012-08-28 International Business Machines Corporation Optimized semiconductor packaging in a three-dimensional stack
US8405998B2 (en) 2010-10-28 2013-03-26 International Business Machines Corporation Heat sink integrated power delivery and distribution for integrated circuits
US8427833B2 (en) 2010-10-28 2013-04-23 International Business Machines Corporation Thermal power plane for integrated circuits
TWI451546B (zh) 2010-10-29 2014-09-01 Advanced Semiconductor Eng 堆疊式封裝結構、其封裝結構及封裝結構之製造方法
TWI445155B (zh) 2011-01-06 2014-07-11 Advanced Semiconductor Eng 堆疊式封裝結構及其製造方法
KR101828386B1 (ko) * 2011-02-15 2018-02-13 삼성전자주식회사 스택 패키지 및 그의 제조 방법
US9171792B2 (en) 2011-02-28 2015-10-27 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having a side-by-side device arrangement and stacking functionality
US8654541B2 (en) 2011-03-24 2014-02-18 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional power electronics packages
US8697457B1 (en) * 2011-06-22 2014-04-15 Bae Systems Information And Electronic Systems Integration Inc. Devices and methods for stacking individually tested devices to form multi-chip electronic modules
US8624359B2 (en) 2011-10-05 2014-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer level chip scale package and method of manufacturing the same
JP2013115214A (ja) * 2011-11-28 2013-06-10 Shinko Electric Ind Co Ltd 半導体装置、半導体素子、及び半導体装置の製造方法
US8680684B2 (en) 2012-01-09 2014-03-25 Invensas Corporation Stackable microelectronic package structures
US9888568B2 (en) * 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
US9947609B2 (en) * 2012-03-09 2018-04-17 Honeywell International Inc. Integrated circuit stack
CN103681365B (zh) * 2012-08-31 2016-08-10 宏启胜精密电子(秦皇岛)有限公司 层叠封装结构及其制作方法
US8933540B2 (en) 2013-02-28 2015-01-13 International Business Machines Corporation Thermal via for 3D integrated circuits structures
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
TWI504320B (zh) * 2014-06-17 2015-10-11 矽品精密工業股份有限公司 線路結構及其製法
US9472878B2 (en) * 2015-01-16 2016-10-18 Tyco Electronics Corporation Electrical cable connector having a two-dimensional array of mating interfaces
US9230726B1 (en) 2015-02-20 2016-01-05 Crane Electronics, Inc. Transformer-based power converters with 3D printed microchannel heat sink
US9548277B2 (en) 2015-04-21 2017-01-17 Honeywell International Inc. Integrated circuit stack including a patterned array of electrically conductive pillars
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
US10178786B2 (en) 2015-05-04 2019-01-08 Honeywell International Inc. Circuit packages including modules that include at least one integrated circuit
US9741644B2 (en) 2015-05-04 2017-08-22 Honeywell International Inc. Stacking arrangement for integration of multiple integrated circuits
US10600691B2 (en) 2016-10-07 2020-03-24 Xcelsis Corporation 3D chip sharing power interconnect layer
US10600780B2 (en) 2016-10-07 2020-03-24 Xcelsis Corporation 3D chip sharing data bus circuit
US10672745B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D processor
US10600735B2 (en) 2016-10-07 2020-03-24 Xcelsis Corporation 3D chip sharing data bus
US10593667B2 (en) * 2016-10-07 2020-03-17 Xcelsis Corporation 3D chip with shielded clock lines
US10672663B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D chip sharing power circuit
US10580735B2 (en) * 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10672743B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D Compute circuit with high density z-axis interconnects
US11176450B2 (en) 2017-08-03 2021-11-16 Xcelsis Corporation Three dimensional circuit implementing machine trained network
US10580757B2 (en) * 2016-10-07 2020-03-03 Xcelsis Corporation Face-to-face mounted IC dies with orthogonal top interconnect layers
US10672744B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D compute circuit with high density Z-axis interconnects
US10586786B2 (en) 2016-10-07 2020-03-10 Xcelsis Corporation 3D chip sharing clock interconnect layer
KR102512017B1 (ko) 2016-10-07 2023-03-17 엑셀시스 코포레이션 직접-접합된 네이티브 상호접속부 및 능동 베이스 다이
DE102017123413B4 (de) * 2017-10-09 2023-09-14 Osram Gmbh Optoelektronisches Halbleiterbauteil und Herstellungsverfahren für ein optoelektronisches Halbleiterbauteil
KR20200114084A (ko) * 2019-03-27 2020-10-07 삼성전자주식회사 반도체 패키지
CN110035601B (zh) * 2019-04-23 2020-05-26 Oppo广东移动通信有限公司 一种层叠板及终端设备
CN110060993B (zh) * 2019-04-26 2020-12-11 胡志刚 多层芯片架构及连接方法
US11599299B2 (en) 2019-11-19 2023-03-07 Invensas Llc 3D memory circuit
CN111326503B (zh) * 2019-12-31 2021-03-12 诺思(天津)微系统有限责任公司 具有叠置单元的半导体结构及制造方法、电子设备
CN114630491B (zh) * 2022-03-22 2023-06-09 广东松普微波技术有限公司 射频3d微封装集成结构、射频封装器件及其方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432447Y2 (de) * 1975-11-28 1979-10-08
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
JPS58446U (ja) * 1981-06-25 1983-01-05 富士通株式会社 混成集積回路装置
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
JPS62160557U (de) * 1986-04-02 1987-10-13
US4764846A (en) * 1987-01-05 1988-08-16 Irvine Sensors Corporation High density electronic package comprising stacked sub-modules
US5280414A (en) * 1990-06-11 1994-01-18 International Business Machines Corp. Au-Sn transient liquid bonding in high performance laminates
EP0486829B1 (de) * 1990-10-22 1997-04-23 Seiko Epson Corporation Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
JPH05259376A (ja) * 1992-03-13 1993-10-08 Matsushita Electric Works Ltd 半導体装置
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5435733A (en) * 1993-11-12 1995-07-25 Hughes Aircraft Company Connector assembly for microelectronic multi-chip-module

Also Published As

Publication number Publication date
JPH08213543A (ja) 1996-08-20
EP0708484B1 (de) 2001-09-26
DE69522887D1 (de) 2001-10-31
JP2703745B2 (ja) 1998-01-26
IL115637A0 (en) 1996-01-19
EP0708484A1 (de) 1996-04-24
DE69522887T2 (de) 2002-05-29
US5579207A (en) 1996-11-26

Similar Documents

Publication Publication Date Title
US5579207A (en) Three-dimensional integrated circuit stacking
JP2909704B2 (ja) 誘電体テープから形成されたディスクリートなチップキャリアを有する垂直なｉｃチップ積層体
US5585675A (en) Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs
US5455385A (en) Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
US6037665A (en) Mounting assembly of integrated circuit device and method for production thereof
US6426549B1 (en) Stackable flex circuit IC package and method of making same
US6195268B1 (en) Stacking layers containing enclosed IC chips
US5241456A (en) Compact high density interconnect structure
US4991000A (en) Vertically interconnected integrated circuit chip system
US7205646B2 (en) Electronic device and chip package
KR100248678B1 (ko) 스택가능한 반도체 다중 칩 모듈 및 그 제조방법
US4922377A (en) Module and a substrate for the module
KR20010078712A (ko) 칩 스택 및 그 제조 방법
US20040135243A1 (en) Semiconductor device, its manufacturing method and electronic device
EP0590915B1 (de) Chip-Direktmontage
US7265441B2 (en) Stackable single package and stacked multi-chip assembly
JPS6356706B2 (de)
JP3450477B2 (ja) 半導体装置及びその製造方法
JPS6267828A (ja) 半導体デバイスの実装構造

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
KB Patent renewed
KB Patent renewed
EXP Patent expired