JP3751625B2 - 貫通電極の製造方法 - Google Patents
貫通電極の製造方法 Download PDFInfo
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- JP3751625B2 JP3751625B2 JP2004191488A JP2004191488A JP3751625B2 JP 3751625 B2 JP3751625 B2 JP 3751625B2 JP 2004191488 A JP2004191488 A JP 2004191488A JP 2004191488 A JP2004191488 A JP 2004191488A JP 3751625 B2 JP3751625 B2 JP 3751625B2
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Description
12 基板
14 蓋体
16 素子搭載空間
18 機能素子
24 貫通電極
28 貫通孔
30 柱状電極
32 下側電極パッド
34 上側電極パッド
44 Siウエハ
46 粘着テープ
48 シード層
50 ドライフィルム
52 フォトレジスト層
54 保護フィルム
56,66 電解Auめっき層
5524 電解Niめっき層
60 スタッドビア
62 ネガ型レジスト層
70 ガラスウエハ
Claims (6)
- 支持体の表面にシード層を形成する第1工程と、
前記シード層の表面に接着層を形成する第2工程と、
貫通孔が形成された基板を前記接着層に押圧して貼り付ける第3工程と、
前記基板の貫通孔に連通された領域の前記接着層を除去し、前記貫通孔の下端に前記貫通孔の内部寸法より幅広形状となる空間を形成する第4工程と、
前記空間内及び前記貫通孔内に導体を積層し、前記貫通孔の下端を覆う下端電極パッド及び前記貫通孔に充填された柱状電極を形成する第5工程と、
前記支持体及び前記シード層及び前記接着層を前記基板から除去する第6工程と、
を有することを特徴とする貫通電極の製造方法。 - 前記第5工程は、
前記シード層の表面に前記下端電極パッドを構成するAu層を形成する工程と、
前記Au層の表面にNi層を形成する工程と、
前記Ni層表面にCu層を積層して前記柱状電極を形成する工程と、
を有することを特徴とする請求項1に記載の貫通電極の製造方法。 - 前記第1工程で前記支持体の表面に粘着テープを接着し、次いで前記粘着テープの粘着面に前記シード層を形成し、
前記第5工程で前記柱状電極を形成した後、
前記第6工程で前記粘着テープを加熱して前記支持体を前記シード層から分離することを特徴とする請求項1または2の何れかに記載の貫通電極の製造方法。 - 前記第1工程で前記支持体の表面に前記シード層を形成し、次いで前記シード層に前記接着層を形成し、
前記第5工程で前記貫通孔の内部に前記柱状電極を形成した後、
前記第6工程で前記接着層を加熱して前記支持体を前記基板から分離することを特徴とする請求項1または2の何れかに記載の貫通電極の製造方法。 - 前記第4工程は、前記接着層をフォトレジスト層により形成する工程と、
前記基板の貫通孔に連通された領域の前記フォトレジスト層を現像処理により除去する工程と、
前記貫通孔の下端に前記貫通孔の内部寸法より幅広形状となる空間を形成する工程と、
を有することを特徴とする請求項1乃至4の何れかに記載の貫通電極の製造方法。 - 前記基板の上面にレジスト層を積層し、前記レジスト層に前記貫通孔の内部寸法より幅広な開口部を前記貫通孔の上端に形成する工程と、
前記レジスト層の開口部に導体を積層し、前記柱状電極の上端に連続する上端電極パッドを形成する工程と、
前記上端電極パッドを囲む前記レジスト層を除去する工程と、
を有することを特徴とする請求項1乃至5の何れかに記載の貫通電極の製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191488A JP3751625B2 (ja) | 2004-06-29 | 2004-06-29 | 貫通電極の製造方法 |
TW094120930A TWI381482B (zh) | 2004-06-29 | 2005-06-23 | 形成貫穿電極之方法 |
DE602005019124T DE602005019124D1 (de) | 2004-06-29 | 2005-06-24 | Herstellung einer Durchgangselektrode |
EP05253943A EP1612859B1 (en) | 2004-06-29 | 2005-06-24 | Method for forming a through electrode |
US11/167,750 US20060001173A1 (en) | 2004-06-29 | 2005-06-27 | Through electrode and method for forming the same |
KR1020050056136A KR101117618B1 (ko) | 2004-06-29 | 2005-06-28 | 관통 전극 형성 방법 |
CNB2005100811765A CN100461357C (zh) | 2004-06-29 | 2005-06-29 | 贯通电极及其形成方法 |
US11/499,947 US7498259B2 (en) | 2004-06-29 | 2006-08-07 | Through electrode and method for forming the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191488A JP3751625B2 (ja) | 2004-06-29 | 2004-06-29 | 貫通電極の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006013330A JP2006013330A (ja) | 2006-01-12 |
JP3751625B2 true JP3751625B2 (ja) | 2006-03-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004191488A Expired - Fee Related JP3751625B2 (ja) | 2004-06-29 | 2004-06-29 | 貫通電極の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20060001173A1 (ja) |
EP (1) | EP1612859B1 (ja) |
JP (1) | JP3751625B2 (ja) |
KR (1) | KR101117618B1 (ja) |
CN (1) | CN100461357C (ja) |
DE (1) | DE602005019124D1 (ja) |
TW (1) | TWI381482B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258322A (ja) * | 2007-04-03 | 2008-10-23 | Shinko Electric Ind Co Ltd | 基板及びその製造方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100620810B1 (ko) * | 2005-03-07 | 2006-09-07 | 삼성전자주식회사 | Mems 소자 패키지 및 그 제조방법 |
US7633167B2 (en) * | 2005-09-29 | 2009-12-15 | Nec Electronics Corporation | Semiconductor device and method for manufacturing same |
TWI324800B (en) | 2005-12-28 | 2010-05-11 | Sanyo Electric Co | Method for manufacturing semiconductor device |
US7704800B2 (en) * | 2006-11-06 | 2010-04-27 | Broadcom Corporation | Semiconductor assembly with one metal layer after base metal removal |
JP5193503B2 (ja) * | 2007-06-04 | 2013-05-08 | 新光電気工業株式会社 | 貫通電極付き基板及びその製造方法 |
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JP2008258322A (ja) * | 2007-04-03 | 2008-10-23 | Shinko Electric Ind Co Ltd | 基板及びその製造方法 |
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CN1716558A (zh) | 2006-01-04 |
CN100461357C (zh) | 2009-02-11 |
KR20060048594A (ko) | 2006-05-18 |
US7498259B2 (en) | 2009-03-03 |
EP1612859B1 (en) | 2010-01-27 |
TW200603237A (en) | 2006-01-16 |
EP1612859A3 (en) | 2006-02-01 |
TWI381482B (zh) | 2013-01-01 |
EP1612859A2 (en) | 2006-01-04 |
JP2006013330A (ja) | 2006-01-12 |
US20060267210A1 (en) | 2006-11-30 |
DE602005019124D1 (de) | 2010-03-18 |
KR101117618B1 (ko) | 2012-03-07 |
US20060001173A1 (en) | 2006-01-05 |
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