HK1031469A1 - Gan single crystalline substrate and method of producing the same. - Google Patents

Gan single crystalline substrate and method of producing the same.

Info

Publication number
HK1031469A1
HK1031469A1 HK01102181A HK01102181A HK1031469A1 HK 1031469 A1 HK1031469 A1 HK 1031469A1 HK 01102181 A HK01102181 A HK 01102181A HK 01102181 A HK01102181 A HK 01102181A HK 1031469 A1 HK1031469 A1 HK 1031469A1
Authority
HK
Hong Kong
Prior art keywords
producing
same
single crystalline
crystalline substrate
gan single
Prior art date
Application number
HK01102181A
Other languages
English (en)
Inventor
Kensaku Motoki
Takuji Okahisa
Naoki Matsumoto
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK1031469A1 publication Critical patent/HK1031469A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02387Group 13/15 materials
    • H01L21/02395Arsenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02502Layer structure consisting of two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647Lateral overgrowth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0206Substrates, e.g. growth, shape, material, removal or bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • H01S2304/04MOCVD or MOVPE
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/901Levitation, reduced gravity, microgravity, space
    • Y10S117/902Specified orientation, shape, crystallography, or size of seed or substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Optics & Photonics (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
HK01102181A 1997-10-30 2001-03-26 Gan single crystalline substrate and method of producing the same. HK1031469A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP29830097 1997-10-30
JP900898 1998-01-20
JP10254698 1998-04-14
PCT/JP1998/004908 WO1999023693A1 (en) 1997-10-30 1998-10-29 GaN SINGLE CRYSTALLINE SUBSTRATE AND METHOD OF PRODUCING THE SAME

Publications (1)

Publication Number Publication Date
HK1031469A1 true HK1031469A1 (en) 2001-06-15

Family

ID=27278285

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01102181A HK1031469A1 (en) 1997-10-30 2001-03-26 Gan single crystalline substrate and method of producing the same.

Country Status (10)

Country Link
US (5) US6693021B1 (xx)
EP (2) EP1041610B1 (xx)
JP (1) JP2011084469A (xx)
KR (1) KR100629558B1 (xx)
CN (2) CN100344004C (xx)
CA (1) CA2311132C (xx)
DE (1) DE69842052D1 (xx)
HK (1) HK1031469A1 (xx)
TW (2) TW591699B (xx)
WO (1) WO1999023693A1 (xx)

Families Citing this family (232)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065625B2 (ja) * 1997-10-30 2012-11-07 住友電気工業株式会社 GaN単結晶基板の製造方法
US6572700B2 (en) * 1997-12-26 2003-06-03 Sumitomo Electric Industries, Ltd. Semiconductor crystal, and method and apparatus of production thereof
TW428331B (en) * 1998-05-28 2001-04-01 Sumitomo Electric Industries Gallium nitride single crystal substrate and method of producing the same
JP3788104B2 (ja) * 1998-05-28 2006-06-21 住友電気工業株式会社 窒化ガリウム単結晶基板及びその製造方法
JP3788041B2 (ja) * 1998-06-30 2006-06-21 住友電気工業株式会社 GaN単結晶基板の製造方法
JP3788037B2 (ja) * 1998-06-18 2006-06-21 住友電気工業株式会社 GaN単結晶基板
TW417315B (en) * 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
ATE458268T1 (de) * 1999-10-14 2010-03-15 Cree Inc Einstufige pendeo- oder laterale epitaxie von gruppe iii-nitridschichten
US6812053B1 (en) 1999-10-14 2004-11-02 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures
JP4667556B2 (ja) * 2000-02-18 2011-04-13 古河電気工業株式会社 縦型GaN系電界効果トランジスタ、バイポーラトランジスタと縦型GaN系電界効果トランジスタの製造方法
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP2001313259A (ja) * 2000-04-28 2001-11-09 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体基板の製造方法及び半導体素子
FR2815472B1 (fr) * 2000-10-13 2003-03-21 St Microelectronics Sa Diac planar
FR2840731B3 (fr) * 2002-06-11 2004-07-30 Soitec Silicon On Insulator Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees
US8507361B2 (en) 2000-11-27 2013-08-13 Soitec Fabrication of substrates with a useful layer of monocrystalline semiconductor material
JP3988018B2 (ja) * 2001-01-18 2007-10-10 ソニー株式会社 結晶膜、結晶基板および半導体装置
JP3886341B2 (ja) * 2001-05-21 2007-02-28 日本電気株式会社 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US7303630B2 (en) 2003-11-05 2007-12-04 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
JP4192966B2 (ja) 2006-06-08 2008-12-10 住友電気工業株式会社 窒化ガリウムの結晶成長方法
US7105865B2 (en) 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP3864870B2 (ja) 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
US7354477B2 (en) 2001-10-09 2008-04-08 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
JP3801125B2 (ja) * 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
US7473315B2 (en) 2001-10-09 2009-01-06 Sumitomo Electric Industries, Ltd. AlxInyGa1-x-yN mixture crystal substrate, method of growing AlxInyGa1-x-yN mixture crystal substrate and method of producing AlxInyGa1-x-yN mixture crystal substrate
JP4920152B2 (ja) * 2001-10-12 2012-04-18 住友電気工業株式会社 構造基板の製造方法および半導体素子の製造方法
KR100844767B1 (ko) * 2002-04-22 2008-07-07 엘지전자 주식회사 질화물 기판 제조 방법
JP3997827B2 (ja) 2002-04-30 2007-10-24 住友電気工業株式会社 窒化ガリウム成長用基板及び窒化ガリウム成長用基板の製造方法並びに窒化ガリウム基板の製造方法
JP2003327497A (ja) * 2002-05-13 2003-11-19 Sumitomo Electric Ind Ltd GaN単結晶基板、窒化物系半導体エピタキシャル基板、窒化物系半導体素子及びその製造方法
FR2840452B1 (fr) * 2002-05-28 2005-10-14 Lumilog Procede de realisation par epitaxie d'un film de nitrure de gallium separe de son substrat
DE10234977A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Dünnschicht-Halbleiterbauelement auf GaN-Basis
JP2004077051A (ja) * 2002-08-20 2004-03-11 Sony Corp 熱輸送装置およびその製造方法
KR100550491B1 (ko) 2003-05-06 2006-02-09 스미토모덴키고교가부시키가이샤 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법
CN100453712C (zh) * 2003-08-28 2009-01-21 日立电线株式会社 Ⅲ-ⅴ族氮化物系半导体衬底及其制造方法
JP4881003B2 (ja) * 2003-09-26 2012-02-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 放射を発する薄膜半導体チップ
FR2860248B1 (fr) * 2003-09-26 2006-02-17 Centre Nat Rech Scient Procede de realisation de substrats autosupportes de nitrures d'elements iii par hetero-epitaxie sur une couche sacrificielle
JP2005191530A (ja) * 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
JP2005209803A (ja) * 2004-01-21 2005-08-04 Sumitomo Electric Ind Ltd GaN結晶基板の製造方法
JP3888374B2 (ja) * 2004-03-17 2007-02-28 住友電気工業株式会社 GaN単結晶基板の製造方法
US7622318B2 (en) 2004-03-30 2009-11-24 Sony Corporation Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and device
JP5194334B2 (ja) * 2004-05-18 2013-05-08 住友電気工業株式会社 Iii族窒化物半導体デバイスの製造方法
CN100444319C (zh) * 2004-09-06 2008-12-17 璨圆光电股份有限公司 氮化物外延层制作方法及其结构
CN101232067B (zh) * 2005-05-16 2013-05-15 索尼株式会社 发光二极管及其制造方法、集成发光二极管、以及显示器
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
EP2595176B1 (en) 2005-05-17 2020-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8324660B2 (en) 2005-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
KR100638869B1 (ko) 2005-06-21 2006-10-27 삼성전기주식회사 질화물계 화합물층을 형성하는 방법 및 이를 이용한 GaN기판 및 수직구조 질화물계 반도체 발광소자를 제조하는방법
WO2007014294A2 (en) * 2005-07-26 2007-02-01 Amberwave Systems Corporation Solutions integrated circuit integration of alternative active area materials
US20070054467A1 (en) * 2005-09-07 2007-03-08 Amberwave Systems Corporation Methods for integrating lattice-mismatched semiconductor structure on insulators
US7638842B2 (en) * 2005-09-07 2009-12-29 Amberwave Systems Corporation Lattice-mismatched semiconductor structures on insulators
JP4720441B2 (ja) * 2005-11-02 2011-07-13 日立電線株式会社 青色発光ダイオード用GaN基板
WO2007057892A2 (en) * 2005-11-17 2007-05-24 Mosaic Crystals Ltd. Gan crystal sheet
JP4631681B2 (ja) * 2005-12-05 2011-02-16 日立電線株式会社 窒化物系半導体基板及び半導体装置
US8435879B2 (en) 2005-12-12 2013-05-07 Kyma Technologies, Inc. Method for making group III nitride articles
JP2007197302A (ja) 2005-12-28 2007-08-09 Sumitomo Electric Ind Ltd Iii族窒化物結晶の製造方法および製造装置
US7691732B2 (en) 2008-06-18 2010-04-06 Sumitomo Electric Industries, Ltd. Manufacturing method of nitride substrate, nitride substrate, and nitride-based semiconductor device
JP2007191321A (ja) * 2006-01-17 2007-08-02 Sumitomo Electric Ind Ltd 窒化物基板の製造方法と窒化物基板及び窒化物系半導体デバイス
US9406505B2 (en) * 2006-02-23 2016-08-02 Allos Semiconductors Gmbh Nitride semiconductor component and process for its production
KR101375435B1 (ko) * 2006-03-08 2014-03-17 큐나노 에이비 Si 상의 에피택셜 반도체 나노와이어를 금속 없이 합성하기 위한 방법
US7968359B2 (en) * 2006-03-10 2011-06-28 Stc.Unm Thin-walled structures
NZ570678A (en) 2006-03-10 2010-10-29 Stc Unm Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices
CN101443887B (zh) * 2006-03-10 2011-04-20 Stc.Unm公司 Gan纳米线的脉冲式生长及在族ⅲ氮化物半导体衬底材料中的应用和器件
WO2007112066A2 (en) 2006-03-24 2007-10-04 Amberwave Systems Corporation Lattice-mismatched semiconductor structures and related methods for device fabrication
JP5287240B2 (ja) * 2006-03-29 2013-09-11 富士通株式会社 多結晶SiC基板を有する化合物半導体ウエハの製造方法
JP4873381B2 (ja) * 2006-03-31 2012-02-08 信越半導体株式会社 発光素子の製造方法、化合物半導体ウェーハ及び発光素子
US8728234B2 (en) 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
US8764903B2 (en) 2009-05-05 2014-07-01 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
US7560364B2 (en) * 2006-05-05 2009-07-14 Applied Materials, Inc. Dislocation-specific lateral epitaxial overgrowth to reduce dislocation density of nitride films
US7880278B2 (en) 2006-05-16 2011-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit having stress tuning layer
KR100755598B1 (ko) * 2006-06-30 2007-09-06 삼성전기주식회사 질화물 반도체 발광소자 어레이
JP5045032B2 (ja) * 2006-08-28 2012-10-10 住友電気工業株式会社 気相成長装置及び化合物半導体膜の成長方法
TWI309439B (en) * 2006-09-05 2009-05-01 Ind Tech Res Inst Nitride semiconductor and method for forming the same
US8173551B2 (en) 2006-09-07 2012-05-08 Taiwan Semiconductor Manufacturing Co., Ltd. Defect reduction using aspect ratio trapping
FR2905799B1 (fr) * 2006-09-12 2008-12-26 Soitec Silicon On Insulator Realisation d'un substrat en gan
WO2008036256A1 (en) * 2006-09-18 2008-03-27 Amberwave Systems Corporation Aspect ratio trapping for mixed signal applications
US7799592B2 (en) * 2006-09-27 2010-09-21 Taiwan Semiconductor Manufacturing Company, Ltd. Tri-gate field-effect transistors formed by aspect ratio trapping
US7875958B2 (en) 2006-09-27 2011-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US20080187018A1 (en) 2006-10-19 2008-08-07 Amberwave Systems Corporation Distributed feedback lasers formed via aspect ratio trapping
JP5242587B2 (ja) * 2006-12-08 2013-07-24 サン−ゴバン クリストー エ デテクトゥール 結晶が基材端部上に成長しないように基板上にエピタキシャル成長させて窒化物単結晶を製造する方法
KR100831835B1 (ko) * 2006-12-21 2008-05-28 주식회사 실트론 고 광적출 발광 다이오드의 제조를 위한 질화 갈륨층의성장 방법, 이 방법을 이용한 발광 다이오드의 제조 방법,및 이 방법에 의해 제조된 발광 다이오드
WO2008079078A1 (en) * 2006-12-22 2008-07-03 Qunano Ab Elevated led and method of producing such
US8183587B2 (en) * 2006-12-22 2012-05-22 Qunano Ab LED with upstanding nanowire structure and method of producing such
CN102255018B (zh) 2006-12-22 2013-06-19 昆南诺股份有限公司 带有直立式纳米线结构的led及其制作方法
US8049203B2 (en) * 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such
JP5125098B2 (ja) 2006-12-26 2013-01-23 信越半導体株式会社 窒化物半導体自立基板の製造方法
WO2008085129A1 (en) 2007-01-12 2008-07-17 Qunano Ab Nitride nanowires and method of producing such
JP2010521810A (ja) * 2007-03-16 2010-06-24 セバスチャン ローデュドス、 半導体ヘテロ構造及びその製造
US8237151B2 (en) 2009-01-09 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9508890B2 (en) * 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon
US8304805B2 (en) 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US7825328B2 (en) 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
US8329541B2 (en) 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
WO2009035746A2 (en) 2007-09-07 2009-03-19 Amberwave Systems Corporation Multi-junction solar cells
WO2009035648A1 (en) * 2007-09-14 2009-03-19 Kyma Technologies, Inc. Non-polar and semi-polar gan substrates, devices, and methods for making them
JP2009091175A (ja) * 2007-10-04 2009-04-30 Sumitomo Electric Ind Ltd GaNエピタキシャル基板、半導体デバイス、GaNエピタキシャル基板及び半導体デバイスの製造方法
CA2641016A1 (en) 2007-10-24 2009-04-24 Sumitomo Electric Industries, Ltd. Semi-insulating nitride semiconductor substrate and method of manufacturing the same, nitride semiconductor epitaxial substrate, and field-effect transistor
JP5258285B2 (ja) * 2007-12-28 2013-08-07 Dowaエレクトロニクス株式会社 半導体発光素子
JP5560528B2 (ja) 2008-01-28 2014-07-30 住友電気工業株式会社 Iii族窒化物単結晶インゴットの製造方法、及びiii族窒化物単結晶基板の製造方法
JP2009190936A (ja) 2008-02-14 2009-08-27 Sumitomo Electric Ind Ltd Iii族窒化物結晶の製造方法
TWI487817B (zh) 2008-02-25 2015-06-11 Sixpoint Materials Inc 用於製造第iii族氮化物晶圓之方法及第iii族氮化物晶圓
CN102136414B (zh) * 2008-04-16 2013-06-05 晶元光电股份有限公司 减少半导体外延位错发生的氮化镓半导体结构及其方法
WO2009146583A1 (en) * 2008-06-02 2009-12-10 Hong Kong Applied Science and Technology Research Institute Co. Ltd Semiconductor wafer, semiconductor device and methods for manufacturing semiconductor wafer and device
CN102637788B (zh) * 2008-06-02 2014-06-25 香港应用科技研究院有限公司 半导体晶圆和半导体器件
US8183667B2 (en) 2008-06-03 2012-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Epitaxial growth of crystalline material
WO2009149300A1 (en) 2008-06-04 2009-12-10 Sixpoint Materials High-pressure vessel for growing group iii nitride crystals and method of growing group iii nitride crystals using high-pressure vessel and group iii nitride crystal
US8097081B2 (en) 2008-06-05 2012-01-17 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20090301388A1 (en) * 2008-06-05 2009-12-10 Soraa Inc. Capsule for high pressure processing and method of use for supercritical fluids
US9157167B1 (en) 2008-06-05 2015-10-13 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8871024B2 (en) * 2008-06-05 2014-10-28 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
EP2286007B1 (en) 2008-06-12 2018-04-04 SixPoint Materials, Inc. Method for testing gallium nitride wafers and method for producing gallium nitride wafers
US8303710B2 (en) * 2008-06-18 2012-11-06 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20090320745A1 (en) * 2008-06-25 2009-12-31 Soraa, Inc. Heater device and method for high pressure processing of crystalline materials
US20100006873A1 (en) * 2008-06-25 2010-01-14 Soraa, Inc. HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN
US8274097B2 (en) 2008-07-01 2012-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
WO2011044554A1 (en) 2009-10-09 2011-04-14 Soraa, Inc. Method for synthesis of high quality large area bulk gallium based crystals
US9404197B2 (en) 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US8124996B2 (en) 2008-08-04 2012-02-28 Soraa, Inc. White light devices using non-polar or semipolar gallium containing materials and phosphors
US8284810B1 (en) 2008-08-04 2012-10-09 Soraa, Inc. Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods
US8979999B2 (en) 2008-08-07 2015-03-17 Soraa, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US20100031873A1 (en) * 2008-08-07 2010-02-11 Soraa, Inc. Basket process and apparatus for crystalline gallium-containing nitride
US8430958B2 (en) 2008-08-07 2013-04-30 Soraa, Inc. Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride
US8021481B2 (en) 2008-08-07 2011-09-20 Soraa, Inc. Process and apparatus for large-scale manufacturing of bulk monocrystalline gallium-containing nitride
US8323405B2 (en) 2008-08-07 2012-12-04 Soraa, Inc. Process and apparatus for growing a crystalline gallium-containing nitride using an azide mineralizer
US7976630B2 (en) 2008-09-11 2011-07-12 Soraa, Inc. Large-area seed for ammonothermal growth of bulk gallium nitride and method of manufacture
US20100072515A1 (en) 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
WO2010033813A2 (en) 2008-09-19 2010-03-25 Amberwave System Corporation Formation of devices by epitaxial layer overgrowth
US8253211B2 (en) 2008-09-24 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor sensor structures with reduced dislocation defect densities
US20100295088A1 (en) * 2008-10-02 2010-11-25 Soraa, Inc. Textured-surface light emitting diode and method of manufacture
US8354679B1 (en) 2008-10-02 2013-01-15 Soraa, Inc. Microcavity light emitting diode method of manufacture
US8455894B1 (en) 2008-10-17 2013-06-04 Soraa, Inc. Photonic-crystal light emitting diode and method of manufacture
US8852341B2 (en) 2008-11-24 2014-10-07 Sixpoint Materials, Inc. Methods for producing GaN nutrient for ammonothermal growth
US8987156B2 (en) 2008-12-12 2015-03-24 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
USRE47114E1 (en) 2008-12-12 2018-11-06 Slt Technologies, Inc. Polycrystalline group III metal nitride with getter and method of making
US8461071B2 (en) * 2008-12-12 2013-06-11 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US9589792B2 (en) 2012-11-26 2017-03-07 Soraa, Inc. High quality group-III metal nitride crystals, methods of making, and methods of use
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
US20100147210A1 (en) * 2008-12-12 2010-06-17 Soraa, Inc. high pressure apparatus and method for nitride crystal growth
US8878230B2 (en) * 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
US20110100291A1 (en) * 2009-01-29 2011-05-05 Soraa, Inc. Plant and method for large-scale ammonothermal manufacturing of gallium nitride boules
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
WO2010114956A1 (en) 2009-04-02 2010-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
US8299473B1 (en) 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
KR20120003493A (ko) * 2009-04-24 2012-01-10 어플라이드 머티어리얼스, 인코포레이티드 후속하는 고온 그룹 ⅲ 증착들을 위한 기판 전처리
CN101877377B (zh) * 2009-04-30 2011-12-14 比亚迪股份有限公司 一种分立发光二极管的外延片及其制造方法
US8791499B1 (en) 2009-05-27 2014-07-29 Soraa, Inc. GaN containing optical devices and method with ESD stability
US8306081B1 (en) 2009-05-27 2012-11-06 Soraa, Inc. High indium containing InGaN substrates for long wavelength optical devices
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
US8509275B1 (en) 2009-05-29 2013-08-13 Soraa, Inc. Gallium nitride based laser dazzling device and method
US9800017B1 (en) 2009-05-29 2017-10-24 Soraa Laser Diode, Inc. Laser device and method for a vehicle
JP4638958B1 (ja) * 2009-08-20 2011-02-23 株式会社パウデック 半導体素子の製造方法
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US8598685B2 (en) * 2009-09-04 2013-12-03 Sumitomo Electric Industries, Ltd. GaN single crystal substrate and method of manufacturing thereof and GaN-based semiconductor device and method of manufacturing thereof
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US8502465B2 (en) 2009-09-18 2013-08-06 Soraa, Inc. Power light emitting diode and method with current density operation
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US8435347B2 (en) 2009-09-29 2013-05-07 Soraa, Inc. High pressure apparatus with stackable rings
US9012253B2 (en) 2009-12-16 2015-04-21 Micron Technology, Inc. Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods
JP5282978B2 (ja) * 2009-12-18 2013-09-04 日立電線株式会社 Iii族窒化物半導体基板
JP5251893B2 (ja) * 2010-01-21 2013-07-31 日立電線株式会社 導電性iii族窒化物結晶の製造方法及び導電性iii族窒化物基板の製造方法
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110186874A1 (en) * 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US8729559B2 (en) 2010-10-13 2014-05-20 Soraa, Inc. Method of making bulk InGaN substrates and devices thereon
US8110484B1 (en) 2010-11-19 2012-02-07 Sumitomo Electric Industries, Ltd. Conductive nitride semiconductor substrate and method for producing the same
US9024310B2 (en) * 2011-01-12 2015-05-05 Tsinghua University Epitaxial structure
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
EP2724356B1 (en) 2011-06-27 2018-10-03 SixPoint Materials, Inc. Ultracapacitors with electrodes containing transition metal nitride
US8492185B1 (en) 2011-07-14 2013-07-23 Soraa, Inc. Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US9694158B2 (en) 2011-10-21 2017-07-04 Ahmad Mohamad Slim Torque for incrementally advancing a catheter during right heart catheterization
US10029955B1 (en) 2011-10-24 2018-07-24 Slt Technologies, Inc. Capsule for high pressure, high temperature processing of materials and methods of use
KR101254716B1 (ko) * 2011-11-07 2013-04-15 삼성코닝정밀소재 주식회사 패턴을 갖는 전이기판 제조방법
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
CN103137567B (zh) * 2011-11-30 2016-05-25 和舰科技(苏州)有限公司 一种减轻晶圆切割应力破坏的晶圆结构及版图设计方法
US8482104B2 (en) 2012-01-09 2013-07-09 Soraa, Inc. Method for growth of indium-containing nitride films
EP3656895A1 (en) * 2012-01-11 2020-05-27 Osaka University Method for producing group iii nitride crystals
US9653286B2 (en) 2012-02-14 2017-05-16 Hexagem Ab Gallium nitride nanowire based electronics
JP5673581B2 (ja) * 2012-02-24 2015-02-18 豊田合成株式会社 Iii族窒化物半導体発光素子の製造方法、iii族窒化物半導体発光素子、ランプ、並びに、レチクル
EP2823515A4 (en) 2012-03-06 2015-08-19 Soraa Inc LIGHT-EMITTING DIODES WITH MATERIAL LAYERS WITH LOW BREAKING INDEX TO REDUCE LIGHT PIPE EFFECTS
US10145026B2 (en) 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
US9142400B1 (en) 2012-07-17 2015-09-22 Stc.Unm Method of making a heteroepitaxial layer on a seed area
US8971368B1 (en) 2012-08-16 2015-03-03 Soraa Laser Diode, Inc. Laser devices having a gallium and nitrogen containing semipolar surface orientation
US9275912B1 (en) 2012-08-30 2016-03-01 Soraa, Inc. Method for quantification of extended defects in gallium-containing nitride crystals
DE102012217644A1 (de) 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9299555B1 (en) 2012-09-28 2016-03-29 Soraa, Inc. Ultrapure mineralizers and methods for nitride crystal growth
CN108281378B (zh) * 2012-10-12 2022-06-24 住友电气工业株式会社 Iii族氮化物复合衬底、半导体器件及它们的制造方法
JP6322890B2 (ja) 2013-02-18 2018-05-16 住友電気工業株式会社 Iii族窒化物複合基板およびその製造方法、ならびにiii族窒化物半導体デバイスの製造方法
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
CN103811592A (zh) * 2012-11-12 2014-05-21 展晶科技(深圳)有限公司 发光二极管制造方法
WO2014097931A1 (ja) 2012-12-17 2014-06-26 三菱化学株式会社 窒化ガリウム基板、および、窒化物半導体結晶の製造方法
CN103871849A (zh) * 2012-12-18 2014-06-18 上海华虹宏力半导体制造有限公司 外延层的形成方法
US8802471B1 (en) 2012-12-21 2014-08-12 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
CN104995713A (zh) 2013-02-18 2015-10-21 住友电气工业株式会社 Iii族氮化物复合衬底及其制造方法,层叠的iii族氮化物复合衬底,以及iii族氮化物半导体器件及其制造方法
US9650723B1 (en) 2013-04-11 2017-05-16 Soraa, Inc. Large area seed crystal for ammonothermal crystal growth and method of making
US8994033B2 (en) 2013-07-09 2015-03-31 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
WO2015114732A1 (ja) 2014-01-28 2015-08-06 株式会社サイオクス 半導体基板の製造方法
US10100434B2 (en) 2014-04-14 2018-10-16 Sumitomo Chemical Company, Limited Nitride semiconductor single crystal substrate manufacturing method
JP6454981B2 (ja) * 2014-04-24 2019-01-23 住友電気工業株式会社 半導体積層体および受光素子
JP6363455B2 (ja) * 2014-09-30 2018-07-25 日本碍子株式会社 GaN複合基板およびGaN自立基板の作製方法ならびにGaN複合基板
DE102014116999A1 (de) * 2014-11-20 2016-05-25 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP2015157760A (ja) * 2015-05-28 2015-09-03 株式会社リコー 13族窒化物結晶および13族窒化物結晶基板
CN107227490B (zh) * 2016-03-23 2021-06-18 松下知识产权经营株式会社 Iii族氮化物半导体及其制造方法
JP6770340B2 (ja) 2016-05-30 2020-10-14 株式会社ディスコ ウエーハの生成方法
CN108242385B (zh) * 2016-12-23 2021-03-12 比亚迪股份有限公司 生长氮化镓的方法、氮化镓外延结构及半导体器件
JP2017100944A (ja) * 2017-02-22 2017-06-08 株式会社リコー 13族窒化物結晶および13族窒化物結晶基板
US20180277713A1 (en) * 2017-03-21 2018-09-27 Glo Ab Red light emitting diodes having an indium gallium nitride template layer and method of making thereof
US10174438B2 (en) 2017-03-30 2019-01-08 Slt Technologies, Inc. Apparatus for high pressure reaction
JP6874572B2 (ja) * 2017-07-07 2021-05-19 富士通株式会社 電子デバイス、及び電子デバイスの製造方法
TWI646228B (zh) * 2017-08-10 2019-01-01 新唐科技股份有限公司 半導體基板及其製造方法
CN109346922B (zh) * 2018-11-29 2020-11-17 西安工业大学 一种输出均匀偏振光的微型激光器及其制备方法
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
CN111434809B (zh) * 2019-01-14 2022-04-19 中国科学院苏州纳米技术与纳米仿生研究所 非极性/半极性氮化镓单晶及其助熔剂法生长方法
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US10662058B1 (en) * 2019-03-05 2020-05-26 Rosemount Aerospace Inc. Wet etch patterning of an aluminum nitride film
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
US11705322B2 (en) 2020-02-11 2023-07-18 Slt Technologies, Inc. Group III nitride substrate, method of making, and method of use
JP2023181727A (ja) 2022-06-13 2023-12-25 株式会社ディスコ ウェーハの製造方法
CN114783869B (zh) * 2022-06-20 2022-09-23 度亘激光技术(苏州)有限公司 制备半导体结构的方法、半导体结构及半导体器件
JP2024024975A (ja) 2022-08-10 2024-02-26 株式会社ディスコ レーザー加工装置及びウエーハの生成方法
CN115036402B (zh) * 2022-08-12 2022-10-25 江苏第三代半导体研究院有限公司 诱导增强型Micro-LED同质外延结构及其制备方法
JP2024066235A (ja) 2022-11-01 2024-05-15 株式会社ディスコ 窒化ガリウム基板の製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150899A (en) * 1974-10-30 1976-05-04 Hitachi Ltd gan noketsushoseichohoho
EP0193830A3 (en) * 1980-04-10 1986-10-01 Massachusetts Institute Of Technology Solar cell device incorporating plural constituent solar cells
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
JPH088217B2 (ja) * 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JPH07267796A (ja) * 1994-03-31 1995-10-17 Mitsubishi Cable Ind Ltd GaN単結晶の製造方法
DE69431333T2 (de) 1993-10-08 2003-07-31 Mitsubishi Cable Ind Ltd GaN-Einkristall
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
JPH07273048A (ja) * 1994-03-31 1995-10-20 Mitsubishi Cable Ind Ltd 化合物半導体単結晶の製造方法、該化合物半導体の単結晶および単結晶基板の製造方法
US5838029A (en) 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
JP3974667B2 (ja) * 1994-08-22 2007-09-12 ローム株式会社 半導体発光素子の製法
JPH0864791A (ja) * 1994-08-23 1996-03-08 Matsushita Electric Ind Co Ltd エピタキシャル成長方法
JP3254931B2 (ja) * 1994-10-17 2002-02-12 松下電器産業株式会社 p型窒化ガリウム系化合物半導体の製造方法
WO1996041906A1 (en) * 1995-06-13 1996-12-27 Advanced Technology Materials, Inc. Bulk single crystal gallium nitride and method of making same
JP3620105B2 (ja) * 1995-07-27 2005-02-16 日立電線株式会社 窒化ガリウム結晶の製造方法
US5730798A (en) * 1995-08-07 1998-03-24 Motorola Masking methods during semiconductor device fabrication
DE69633203T2 (de) 1995-09-18 2005-09-01 Hitachi, Ltd. Halbleiterlaservorrichtungen
JPH08213656A (ja) * 1995-11-29 1996-08-20 Nichia Chem Ind Ltd 窒化ガリウム系化合物半導体発光素子
JP2743901B2 (ja) 1996-01-12 1998-04-28 日本電気株式会社 窒化ガリウムの結晶成長方法
JP2925004B2 (ja) * 1996-03-22 1999-07-26 日本電気株式会社 窒化ガリウムの結晶成長方法
JP3879173B2 (ja) 1996-03-25 2007-02-07 住友電気工業株式会社 化合物半導体気相成長方法
JP3164016B2 (ja) 1996-05-31 2001-05-08 住友電気工業株式会社 発光素子および発光素子用ウエハの製造方法
US5792566A (en) * 1996-07-02 1998-08-11 American Xtal Technology Single crystal wafers
JPH1022494A (ja) * 1996-07-03 1998-01-23 Sony Corp オーミック電極およびその形成方法
US5828088A (en) * 1996-09-05 1998-10-27 Astropower, Inc. Semiconductor device structures incorporating "buried" mirrors and/or "buried" metal electrodes
JPH10229218A (ja) * 1997-02-17 1998-08-25 Nichia Chem Ind Ltd 窒化物半導体基板の製造方法および窒化物半導体基板
US6348096B1 (en) * 1997-03-13 2002-02-19 Nec Corporation Method for manufacturing group III-V compound semiconductors
JP3139445B2 (ja) * 1997-03-13 2001-02-26 日本電気株式会社 GaN系半導体の成長方法およびGaN系半導体膜
JP3416042B2 (ja) * 1997-03-25 2003-06-16 三菱電線工業株式会社 GaN基材及びその製造方法
EP0874405A3 (en) * 1997-03-25 2004-09-15 Mitsubishi Cable Industries, Ltd. GaN group crystal base member having low dislocation density, use thereof and manufacturing methods thereof
JPH10265297A (ja) * 1997-03-26 1998-10-06 Shiro Sakai GaNバルク単結晶の製造方法
JPH10321529A (ja) * 1997-05-22 1998-12-04 Nippon Telegr & Teleph Corp <Ntt> 2層選択成長法
US6270569B1 (en) * 1997-06-11 2001-08-07 Hitachi Cable Ltd. Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method
JP3718329B2 (ja) * 1997-08-29 2005-11-24 株式会社東芝 GaN系化合物半導体発光素子
JPH11135770A (ja) 1997-09-01 1999-05-21 Sumitomo Chem Co Ltd 3−5族化合物半導体とその製造方法および半導体素子
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates

Also Published As

Publication number Publication date
US20070105351A1 (en) 2007-05-10
US7521339B2 (en) 2009-04-21
EP1041610A4 (en) 2004-04-07
EP1041610B1 (en) 2010-12-15
US7357837B2 (en) 2008-04-15
TW200415712A (en) 2004-08-16
TW591699B (en) 2004-06-11
CA2311132A1 (en) 1999-05-14
CN1542992A (zh) 2004-11-03
KR100629558B1 (ko) 2006-09-27
JP2011084469A (ja) 2011-04-28
US7504323B2 (en) 2009-03-17
EP1041610A1 (en) 2000-10-04
US20090263955A1 (en) 2009-10-22
KR20010031642A (ko) 2001-04-16
US20040089222A1 (en) 2004-05-13
WO1999023693A1 (en) 1999-05-14
CN100344004C (zh) 2007-10-17
EP2200071B1 (en) 2012-01-18
CA2311132C (en) 2004-12-07
TWI236056B (en) 2005-07-11
US6693021B1 (en) 2004-02-17
EP2200071A1 (en) 2010-06-23
DE69842052D1 (de) 2011-01-27
CN1283306A (zh) 2001-02-07
CN1175473C (zh) 2004-11-10
US20040072410A1 (en) 2004-04-15

Similar Documents

Publication Publication Date Title
HK1031469A1 (en) Gan single crystalline substrate and method of producing the same.
EP0667637A3 (en) Monocrystalline conductor carrier and method for its production.
EP0675534A3 (en) SOI substrate and manufacturing method.
EP0977259A3 (en) Semiconductor device and method of producing the same
SG63669A1 (en) Semiconductor substrate and producing method thereof
AU5952298A (en) Substrate and production method thereof
EP0609861A3 (en) Ceramic substrate and manufacturing process.
AU5969998A (en) Semiconductor substrate and method of manufacturing the same
AU6006499A (en) P-type zno single crystal and method for producing the same
EP0862208A3 (en) Semiconductor device and method of manufacturing the same
AU5643798A (en) Common rail and method of manufacturing the same
GB2326160B (en) Nitride crystal fabricating method
EP0664540A3 (en) Supergloss grinding process and slurry independent of the substrate.
GB2333521B (en) Nitride crystal growth method
SG85106A1 (en) Soi substrate and method and system for manufacturing the same
EP0953997A4 (en) ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
AU2046297A (en) Method for the manufacture of ammonia
EP1081734A4 (en) FILM-SHAPED COLD-EMISSIONS CATHODE AND METHOD FOR THE PRODUCTION THEREOF
HK1025223A1 (en) Bifidobacterium-fermented milk and process for producing the same
AU1683499A (en) Bilberry-containing drinks and process for producing the same
EP1120819A4 (en) SOI SUBSTRATE AND METHOD FOR MANUFACTURING SAME
AU1183999A (en) Semiconductor component and manufacturing method for semiconductor component
ZA200000456B (en) High-melting superalloy and method of producing the same.
AU6333199A (en) Webbing and method for producing the same
AU3148600A (en) Reaction-bonded silicon nitride-based materials and method for producing the same

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081029