CN100453712C - Ⅲ-ⅴ族氮化物系半导体衬底及其制造方法 - Google Patents
Ⅲ-ⅴ族氮化物系半导体衬底及其制造方法 Download PDFInfo
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- CN100453712C CN100453712C CNB2004100570497A CN200410057049A CN100453712C CN 100453712 C CN100453712 C CN 100453712C CN B2004100570497 A CNB2004100570497 A CN B2004100570497A CN 200410057049 A CN200410057049 A CN 200410057049A CN 100453712 C CN100453712 C CN 100453712C
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- 238000002073 fluorescence micrograph Methods 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 11
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
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- 229910052594 sapphire Inorganic materials 0.000 description 43
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 15
- XOYLJNJLGBYDTH-UHFFFAOYSA-M chlorogallium Chemical compound [Ga]Cl XOYLJNJLGBYDTH-UHFFFAOYSA-M 0.000 description 13
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- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
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- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Images
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- Chemical Vapour Deposition (AREA)
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Abstract
Description
Claims (48)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003304078 | 2003-08-28 | ||
JP2003304078 | 2003-08-28 |
Publications (2)
Publication Number | Publication Date |
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CN1590600A CN1590600A (zh) | 2005-03-09 |
CN100453712C true CN100453712C (zh) | 2009-01-21 |
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CNB2004100570497A Expired - Lifetime CN100453712C (zh) | 2003-08-28 | 2004-08-25 | Ⅲ-ⅴ族氮化物系半导体衬底及其制造方法 |
Country Status (2)
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JP (2) | JP2008277841A (zh) |
CN (1) | CN100453712C (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4696935B2 (ja) * | 2006-01-27 | 2011-06-08 | 日立電線株式会社 | Iii−v族窒化物系半導体基板及びiii−v族窒化物系発光素子 |
DE102007026298A1 (de) | 2007-06-06 | 2008-12-11 | Freiberger Compound Materials Gmbh | Anordnung und Verfahren zur Herstellung eines Kristalls aus der Schmelze eines Rohmaterials sowie Einkristall |
JP5251893B2 (ja) * | 2010-01-21 | 2013-07-31 | 日立電線株式会社 | 導電性iii族窒化物結晶の製造方法及び導電性iii族窒化物基板の製造方法 |
JPWO2011161975A1 (ja) * | 2010-06-25 | 2013-08-19 | Dowaエレクトロニクス株式会社 | エピタキシャル成長基板及び半導体装置、エピタキシャル成長方法 |
US8698163B2 (en) * | 2011-09-29 | 2014-04-15 | Toshiba Techno Center Inc. | P-type doping layers for use with light emitting devices |
JP2013084832A (ja) * | 2011-10-12 | 2013-05-09 | Sharp Corp | 窒化物半導体構造の製造方法 |
JP2013214686A (ja) * | 2012-04-04 | 2013-10-17 | Furukawa Co Ltd | Iii族窒化物半導体層およびiii族窒化物半導体層の製造方法 |
JP2014009156A (ja) * | 2012-06-29 | 2014-01-20 | Samsung Corning Precision Materials Co Ltd | 窒化ガリウム基板の製造方法および該方法により製造された窒化ガリウム基板 |
CN103928582B (zh) * | 2012-08-28 | 2017-09-29 | 晶元光电股份有限公司 | 一种化合物半导体元件及其制备方法 |
KR101363254B1 (ko) * | 2012-11-07 | 2014-02-13 | 주식회사 루미스탈 | 대구경 질화갈륨 자립기판 제조방법 |
CN103165771B (zh) * | 2013-03-28 | 2015-07-15 | 天津三安光电有限公司 | 一种具有埋入式孔洞结构的氮化物底层及其制备方法 |
JP2014236093A (ja) | 2013-05-31 | 2014-12-15 | サンケン電気株式会社 | シリコン系基板、半導体装置、及び、半導体装置の製造方法 |
JP6213414B2 (ja) * | 2014-07-25 | 2017-10-18 | 住友電気工業株式会社 | 半導体素子およびこれを用いた半導体デバイス |
JPWO2020203541A1 (zh) * | 2019-03-29 | 2020-10-08 | ||
CN113161226A (zh) * | 2021-03-10 | 2021-07-23 | 无锡吴越半导体有限公司 | 一种基于等离子体cvd的氮化镓单结晶基板制造方法 |
CN113140447A (zh) * | 2021-04-21 | 2021-07-20 | 西安电子科技大学 | 基于TiN掩膜的GaN材料及其制备方法 |
CN115295405B (zh) * | 2022-09-30 | 2023-03-21 | 北京大学 | 一种提高宽禁带半导体载流子浓度的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251253A (ja) * | 1998-03-05 | 1999-09-17 | Nichia Chem Ind Ltd | 窒化物半導体基板の製造方法および窒化物半導体基板 |
EP1246233A2 (en) * | 2001-03-27 | 2002-10-02 | Nec Corporation | Semiconductor substrate made of group III nitride, and process for manufacture thereof |
Family Cites Families (7)
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JP3424507B2 (ja) * | 1997-07-02 | 2003-07-07 | 松下電器産業株式会社 | 窒化ガリウム系化合物半導体薄膜の製造方法 |
CN100344004C (zh) * | 1997-10-30 | 2007-10-17 | 住友电气工业株式会社 | GaN单晶衬底及其制造方法 |
JP2001122693A (ja) * | 1999-10-22 | 2001-05-08 | Nec Corp | 結晶成長用下地基板およびこれを用いた基板の製造方法 |
JP4534356B2 (ja) * | 2001-01-16 | 2010-09-01 | パナソニック株式会社 | 窒化物半導体層の製造方法および窒化物半導体基板の製造方法ならびに窒化物半導体基板製造用基体 |
JP2002284600A (ja) * | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
JP3826825B2 (ja) * | 2001-04-12 | 2006-09-27 | 住友電気工業株式会社 | 窒化ガリウム結晶への酸素ドーピング方法と酸素ドープされたn型窒化ガリウム単結晶基板 |
JP3849855B2 (ja) * | 2001-11-12 | 2006-11-22 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法 |
-
2004
- 2004-08-25 CN CNB2004100570497A patent/CN100453712C/zh not_active Expired - Lifetime
-
2008
- 2008-05-30 JP JP2008142275A patent/JP2008277841A/ja active Pending
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2011
- 2011-02-23 JP JP2011037613A patent/JP5531983B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251253A (ja) * | 1998-03-05 | 1999-09-17 | Nichia Chem Ind Ltd | 窒化物半導体基板の製造方法および窒化物半導体基板 |
EP1246233A2 (en) * | 2001-03-27 | 2002-10-02 | Nec Corporation | Semiconductor substrate made of group III nitride, and process for manufacture thereof |
JP2003178984A (ja) * | 2001-03-27 | 2003-06-27 | Nec Corp | Iii族窒化物半導体基板およびその製造方法 |
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Publication number | Publication date |
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JP5531983B2 (ja) | 2014-06-25 |
JP2008277841A (ja) | 2008-11-13 |
CN1590600A (zh) | 2005-03-09 |
JP2011119761A (ja) | 2011-06-16 |
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