DE69929967D1 - Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten - Google Patents

Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten

Info

Publication number
DE69929967D1
DE69929967D1 DE69929967T DE69929967T DE69929967D1 DE 69929967 D1 DE69929967 D1 DE 69929967D1 DE 69929967 T DE69929967 T DE 69929967T DE 69929967 T DE69929967 T DE 69929967T DE 69929967 D1 DE69929967 D1 DE 69929967D1
Authority
DE
Germany
Prior art keywords
electroplating
substrates
electroplating system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69929967T
Other languages
English (en)
Other versions
DE69929967T2 (de
Inventor
Uziel Landau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69929967D1 publication Critical patent/DE69929967D1/de
Publication of DE69929967T2 publication Critical patent/DE69929967T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69929967T 1998-04-21 1999-04-21 Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten Expired - Fee Related DE69929967T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8252198P 1998-04-21 1998-04-21
US82521P 1998-04-21
PCT/US1999/008782 WO1999054527A2 (en) 1998-04-21 1999-04-21 Electro-chemical deposition system and method of electroplating on substrates

Publications (2)

Publication Number Publication Date
DE69929967D1 true DE69929967D1 (de) 2006-04-27
DE69929967T2 DE69929967T2 (de) 2007-05-24

Family

ID=22171736

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69929967T Expired - Fee Related DE69929967T2 (de) 1998-04-21 1999-04-21 Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten

Country Status (6)

Country Link
US (2) US6261433B1 (de)
EP (1) EP0991795B1 (de)
JP (1) JP2002506488A (de)
KR (1) KR100616198B1 (de)
DE (1) DE69929967T2 (de)
WO (1) WO1999054527A2 (de)

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EP0991795B1 (de) 2006-02-22
EP0991795A1 (de) 2000-04-12
KR20010014062A (ko) 2001-02-26
USRE40218E1 (en) 2008-04-08
JP2002506488A (ja) 2002-02-26
DE69929967T2 (de) 2007-05-24
KR100616198B1 (ko) 2006-08-25
US6261433B1 (en) 2001-07-17

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