EP1694885A4 - Metallabscheidungssystem mit mehreren chemismen - Google Patents

Metallabscheidungssystem mit mehreren chemismen

Info

Publication number
EP1694885A4
EP1694885A4 EP04760000A EP04760000A EP1694885A4 EP 1694885 A4 EP1694885 A4 EP 1694885A4 EP 04760000 A EP04760000 A EP 04760000A EP 04760000 A EP04760000 A EP 04760000A EP 1694885 A4 EP1694885 A4 EP 1694885A4
Authority
EP
European Patent Office
Prior art keywords
plating system
chemistry plating
chemistry
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04760000A
Other languages
English (en)
French (fr)
Other versions
EP1694885A2 (de
Inventor
Michael X Yang
Ming Xi
Eric B Britcher
Bernardo Donoso
Lily L Pang
Svetlana Sherman
Henry Ho
Anh N Nguyen
Alexander N Lerner
Ambra Allen L D
Arulkumar Shanmugasundram
Tetsuya Ishikawa
Yevgeniy Rabinovich
Dmitry Lubomirsky
Yeuk-Fai Edwin Mok
Son T Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1694885A2 publication Critical patent/EP1694885A2/de
Publication of EP1694885A4 publication Critical patent/EP1694885A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
EP04760000A 2003-04-18 2004-04-16 Metallabscheidungssystem mit mehreren chemismen Withdrawn EP1694885A4 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US46395603P 2003-04-18 2003-04-18
US46386203P 2003-04-18 2003-04-18
US46397003P 2003-04-18 2003-04-18
US46386103P 2003-04-18 2003-04-18
US46386003P 2003-04-18 2003-04-18
PCT/US2004/012012 WO2004094702A2 (en) 2003-04-18 2004-04-16 Multi-chemistry plating system

Publications (2)

Publication Number Publication Date
EP1694885A2 EP1694885A2 (de) 2006-08-30
EP1694885A4 true EP1694885A4 (de) 2007-12-19

Family

ID=33314528

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04760000A Withdrawn EP1694885A4 (de) 2003-04-18 2004-04-16 Metallabscheidungssystem mit mehreren chemismen

Country Status (4)

Country Link
EP (1) EP1694885A4 (de)
JP (1) JP2007525591A (de)
TW (1) TWI265216B (de)
WO (1) WO2004094702A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4996125B2 (ja) * 2005-04-22 2012-08-08 ルネサスエレクトロニクス株式会社 めっき方法およびこれを用いた半導体装置の製造方法、ならびにめっき装置
US20060237319A1 (en) 2005-04-22 2006-10-26 Akira Furuya Planting process and manufacturing process for semiconductor device thereby, and plating apparatus
US7217172B2 (en) * 2005-07-09 2007-05-15 Tbw Industries Inc. Enhanced end effector arm arrangement for CMP pad conditioning
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
CN101484974B (zh) 2006-07-07 2013-11-06 Fsi国际公司 用于处理微电子工件的设备和方法以及遮挡结构
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
KR101578079B1 (ko) * 2009-02-13 2015-12-16 주식회사 뉴파워 프라즈마 기판 도금 장치
US20110259376A1 (en) * 2010-04-27 2011-10-27 Wagener Thomas J Wet processing of microelectronic substrates with controlled mixing of fluids proximal to substrate surfaces
US9245767B2 (en) * 2013-09-12 2016-01-26 Applied Materials, Inc. Anneal module for semiconductor wafers
WO2016057797A1 (en) * 2014-10-08 2016-04-14 Air Products And Chemicals, Inc. Low pressure fluctuation flow control apparatus and method
JP6833685B2 (ja) 2014-11-10 2021-02-24 ブルックス オートメーション インコーポレイテッド ツールの自動教示方法および装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030020928A1 (en) * 2000-07-08 2003-01-30 Ritzdorf Thomas L. Methods and apparatus for processing microelectronic workpieces using metrology
WO2004057060A2 (en) * 2002-12-19 2004-07-08 Applied Materials, Inc. Multi-chemistry electrochemical processing system
WO2004075266A2 (en) * 2003-02-18 2004-09-02 Applied Materials, Inc. Method for immersing a substrate

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JPS62101045A (ja) * 1985-10-28 1987-05-11 Toshiba Corp ウエ−ハの中心合せ装置
JPH0414237A (ja) * 1990-05-07 1992-01-20 Tokyo Electron Ltd 半導体製造装置
JPH09260338A (ja) * 1996-03-19 1997-10-03 Nippon Steel Corp 回転塗布装置
US5883762A (en) * 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
DE69929967T2 (de) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
JP2000084503A (ja) * 1998-07-13 2000-03-28 Kokusai Electric Co Ltd 被処理物の流体処理方法及びその装置
JP3639151B2 (ja) * 1999-03-11 2005-04-20 株式会社荏原製作所 めっき装置
JP4149620B2 (ja) * 1999-08-25 2008-09-10 株式会社荏原製作所 基板銅めっき処理方法
JP2001102298A (ja) * 1999-07-28 2001-04-13 Tokyo Electron Ltd 現像装置、液処理装置及び現像方法
JP3286286B2 (ja) * 1999-11-26 2002-05-27 島田理化工業株式会社 洗浄装置
US6415804B1 (en) * 1999-12-23 2002-07-09 Lam Research Corporation Bowl for processing semiconductor wafers
US6780374B2 (en) * 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
JP2002273360A (ja) * 2001-03-22 2002-09-24 Dainippon Screen Mfg Co Ltd 基板処理装置
WO2002090623A1 (fr) * 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
JP2003027280A (ja) * 2001-07-18 2003-01-29 Ebara Corp めっき装置
JP4603209B2 (ja) * 2001-08-23 2010-12-22 株式会社アドバンテスト ウエハ搬送用の位置決め固定装置
US20030070695A1 (en) * 2001-10-16 2003-04-17 Applied Materials, Inc. N2 splash guard for liquid injection on the rotating substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030020928A1 (en) * 2000-07-08 2003-01-30 Ritzdorf Thomas L. Methods and apparatus for processing microelectronic workpieces using metrology
WO2004057060A2 (en) * 2002-12-19 2004-07-08 Applied Materials, Inc. Multi-chemistry electrochemical processing system
WO2004075266A2 (en) * 2003-02-18 2004-09-02 Applied Materials, Inc. Method for immersing a substrate

Also Published As

Publication number Publication date
EP1694885A2 (de) 2006-08-30
WO2004094702A8 (en) 2005-12-29
JP2007525591A (ja) 2007-09-06
WO2004094702A2 (en) 2004-11-04
TW200502439A (en) 2005-01-16
TWI265216B (en) 2006-11-01
WO2004094702A3 (en) 2006-11-30

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: NGUYEN, SON, T.

Inventor name: MOK, YEUK-FAI, EDWIN

Inventor name: LUBOMIRSKY, DMITRY

Inventor name: RABINOVICH, YEVGENIY

Inventor name: ISHIKAWA, TETSUYA

Inventor name: SHANMUGASUNDRAM, ARULKUMAR

Inventor name: D'AMBRA, ALLEN, L.

Inventor name: LERNER, ALEXANDER, N.

Inventor name: NGUYEN, ANH, N.

Inventor name: HO, HENRY

Inventor name: SHERMAN, SVETLANA

Inventor name: PANG, LILY, L.

Inventor name: DONOSO, BERNARDO

Inventor name: BRITCHER, ERIC, B.

Inventor name: XI, MING

Inventor name: YANG, MICHAEL, X.

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 19/00 20060101ALI20070323BHEP

Ipc: C25D 17/02 20060101ALI20070323BHEP

Ipc: C25D 7/12 20060101AFI20070323BHEP

RIN1 Information on inventor provided before grant (corrected)

Inventor name: NGUYEN, SON, T.

Inventor name: MOK, YEUK-FAI, EDWIN

Inventor name: LUBOMIRSKY, DMITRY

Inventor name: RABINOVICH, YEVGENIY

Inventor name: ISHIKAWA, TETSUYA

Inventor name: SHANMUGASUNDRAM, ARULKUMAR

Inventor name: D'AMBRA, ALLEN, L.

Inventor name: LERNER, ALEXANDER, N.

Inventor name: NGUYEN, ANH, N.

Inventor name: HO, HENRY

Inventor name: SHERMAN, SVETLANA

Inventor name: PANG, LILY, L.

Inventor name: DONOSO, BERNARDO

Inventor name: BRITCHER, ERIC, B.

Inventor name: XI, MING

Inventor name: YANG, MICHAEL, X.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: NGUYEN, SON, T.

Inventor name: MOK, YEUK-FAI, EDWIN

Inventor name: LUBOMIRSKY, DMITRY

Inventor name: RABINOVICH, YEVGENIY

Inventor name: ISHIKAWA, TETSUYA

Inventor name: SHANMUGASUNDRAM, ARULKUMAR

Inventor name: D'AMBRA, ALLEN, L.

Inventor name: LERNER, ALEXANDER, N.

Inventor name: NGUYEN, ANH, N.

Inventor name: HO, HENRY

Inventor name: SHERMAN, SVETLANA

Inventor name: PANG, LILY, L.

Inventor name: DONOSO, BERNARDO

Inventor name: BRITCHER, ERIC, B.

Inventor name: XI, MING

Inventor name: YANG, MICHAEL, X.

A4 Supplementary search report drawn up and despatched

Effective date: 20071120

RIC1 Information provided on ipc code assigned before grant

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