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WO2004094702A3 - Multi-chemistry plating system - Google Patents

Multi-chemistry plating system Download PDF

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Publication number
WO2004094702A3
WO2004094702A3 PCT/US2004/012012 US2004012012W WO2004094702A3 WO 2004094702 A3 WO2004094702 A3 WO 2004094702A3 US 2004012012 W US2004012012 W US 2004012012W WO 2004094702 A3 WO2004094702 A3 WO 2004094702A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mainframe
plating system
positioned
multi
Prior art date
Application number
PCT/US2004/012012
Other languages
French (fr)
Other versions
WO2004094702A2 (en
WO2004094702A8 (en
Inventor
Michael X Yang
Ming Xi
Russell C Ellwanger
Eric B Britcher
Bernardo Donoso
Lily L Pang
Svetlana Sherman
Henry Ho
Anh N Nguyen
Alexander N Lerner
Ambra Allen L D
Arulkumar Shanmugasundram
Tetsuya Ishikawa
Yevgeniy Rabinovich
Dmitry Lubomirsky
Yeuk-Fai Edwin Mok
Son T Nguyen
Original Assignee
Applied Materials Inc
Michael X Yang
Ming Xi
Russell C Ellwanger
Eric B Britcher
Bernardo Donoso
Lily L Pang
Svetlana Sherman
Henry Ho
Anh N Nguyen
Alexander N Lerner
Ambra Allen L D
Arulkumar Shanmugasundram
Tetsuya Ishikawa
Yevgeniy Rabinovich
Dmitry Lubomirsky
Yeuk-Fai Edwin Mok
Son T Nguyen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US60/463,970 priority Critical
Priority to US46386003P priority
Priority to US46395603P priority
Priority to US46386203P priority
Priority to US46386103P priority
Priority to US46397003P priority
Priority to US60/463,860 priority
Priority to US60/463,861 priority
Priority to US60/463,862 priority
Priority to US60/463,956 priority
Application filed by Applied Materials Inc, Michael X Yang, Ming Xi, Russell C Ellwanger, Eric B Britcher, Bernardo Donoso, Lily L Pang, Svetlana Sherman, Henry Ho, Anh N Nguyen, Alexander N Lerner, Ambra Allen L D, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T Nguyen filed Critical Applied Materials Inc
Publication of WO2004094702A2 publication Critical patent/WO2004094702A2/en
Publication of WO2004094702A8 publication Critical patent/WO2004094702A8/en
Publication of WO2004094702A3 publication Critical patent/WO2004094702A3/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002Cell separation, e.g. membranes, diaphragms
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/02Heating or cooling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/08Rinsing
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating characterised by the use of gases, e.g. pressure influence
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors coated first with a seed layer, e.g. for filling vias
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
PCT/US2004/012012 2003-04-18 2004-04-16 Multi-chemistry plating system WO2004094702A2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US46386003P true 2003-04-18 2003-04-18
US46395603P true 2003-04-18 2003-04-18
US46386203P true 2003-04-18 2003-04-18
US46386103P true 2003-04-18 2003-04-18
US46397003P true 2003-04-18 2003-04-18
US60/463,860 2003-04-18
US60/463,861 2003-04-18
US60/463,862 2003-04-18
US60/463,956 2003-04-18
US60/463,970 2003-04-18

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04760000A EP1694885A4 (en) 2003-04-18 2004-04-16 Multi-chemistry plating system
JP2006513120A JP2007525591A (en) 2003-04-18 2004-04-16 More chemicals plating system

Publications (3)

Publication Number Publication Date
WO2004094702A2 WO2004094702A2 (en) 2004-11-04
WO2004094702A8 WO2004094702A8 (en) 2005-12-29
WO2004094702A3 true WO2004094702A3 (en) 2006-11-30

Family

ID=33314528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/012012 WO2004094702A2 (en) 2003-04-18 2004-04-16 Multi-chemistry plating system

Country Status (4)

Country Link
EP (1) EP1694885A4 (en)
JP (1) JP2007525591A (en)
TW (1) TWI265216B (en)
WO (1) WO2004094702A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4996125B2 (en) * 2005-04-22 2012-08-08 ルネサスエレクトロニクス株式会社 Method for producing a plating method and a semiconductor device using the same, and the plating device
US20060237319A1 (en) 2005-04-22 2006-10-26 Akira Furuya Planting process and manufacturing process for semiconductor device thereby, and plating apparatus
CA2614483A1 (en) * 2005-07-09 2007-01-18 Tbw Industries Inc. Enhanced end effector arm arrangement for cmp pad conditioning
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US8387635B2 (en) 2006-07-07 2013-03-05 Tel Fsi, Inc. Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
KR101578079B1 (en) * 2009-02-13 2015-12-16 주식회사 뉴파워 프라즈마 A substrate coating apparatus
KR101665036B1 (en) * 2010-04-27 2016-10-24 티이엘 에프에스아이, 인코포레이티드 Wet processing of microelectronic substrates with controlled mixing of fluids proximal to substrate surfaces
US9245767B2 (en) * 2013-09-12 2016-01-26 Applied Materials, Inc. Anneal module for semiconductor wafers
CN107111324A (en) * 2014-10-08 2017-08-29 弗萨姆材料美国有限责任公司 Low pressure fluctuation flow control apparatus and method
CN107112266A (en) 2014-11-10 2017-08-29 布鲁克斯自动化公司 Tool auto-teach method and apparatus

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5883762A (en) * 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6415804B1 (en) * 1999-12-23 2002-07-09 Lam Research Corporation Bowl for processing semiconductor wafers
US20020096508A1 (en) * 2000-12-08 2002-07-25 Weaver Robert A. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US20030070695A1 (en) * 2001-10-16 2003-04-17 Applied Materials, Inc. N2 splash guard for liquid injection on the rotating substrate

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JPH0334216B2 (en) * 1985-10-28 1991-05-21 Tokyo Shibaura Electric Co
JPH0414237A (en) * 1990-05-07 1992-01-20 Tokyo Electron Kyushu Kk Semiconductor manufacturing equipment
JPH09260338A (en) * 1996-03-19 1997-10-03 Nippon Steel Corp Rotary applicator
JP2000084503A (en) * 1998-07-13 2000-03-28 Kokusai Electric Co Ltd Fluid treatment of material to be treated and device therefor
JP3639151B2 (en) * 1999-03-11 2005-04-20 株式会社荏原製作所 Plating apparatus
WO2002004887A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
JP2001102298A (en) * 1999-07-28 2001-04-13 Tokyo Electron Ltd Development apparatus, liquid processing apparatus, and development method
JP4149620B2 (en) * 1999-08-25 2008-09-10 株式会社荏原製作所 Board copper plating treatment method
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JP2002273360A (en) * 2001-03-22 2002-09-24 Dainippon Screen Mfg Co Ltd Substrate treating device
WO2002090623A1 (en) * 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Copper plating bath and method for plating substrate by using the same
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JP4603209B2 (en) * 2001-08-23 2010-12-22 株式会社アドバンテスト Positioning and fixing device for wafer transfer
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883762A (en) * 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6415804B1 (en) * 1999-12-23 2002-07-09 Lam Research Corporation Bowl for processing semiconductor wafers
US20020096508A1 (en) * 2000-12-08 2002-07-25 Weaver Robert A. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US20030070695A1 (en) * 2001-10-16 2003-04-17 Applied Materials, Inc. N2 splash guard for liquid injection on the rotating substrate

Non-Patent Citations (1)

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Title
See also references of EP1694885A2 *

Also Published As

Publication number Publication date
WO2004094702A2 (en) 2004-11-04
EP1694885A2 (en) 2006-08-30
TW200502439A (en) 2005-01-16
WO2004094702A8 (en) 2005-12-29
JP2007525591A (en) 2007-09-06
TWI265216B (en) 2006-11-01
EP1694885A4 (en) 2007-12-19

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