DE60034032D1 - Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten - Google Patents
Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substratenInfo
- Publication number
- DE60034032D1 DE60034032D1 DE60034032T DE60034032T DE60034032D1 DE 60034032 D1 DE60034032 D1 DE 60034032D1 DE 60034032 T DE60034032 T DE 60034032T DE 60034032 T DE60034032 T DE 60034032T DE 60034032 D1 DE60034032 D1 DE 60034032D1
- Authority
- DE
- Germany
- Prior art keywords
- lotpase
- substrates
- layers
- controlling
- lotpase layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Biochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/304,699 US6738505B1 (en) | 1999-05-04 | 1999-05-04 | Method and apparatus for detecting solder paste deposits on substrates |
US304699 | 1999-05-04 | ||
PCT/US2000/012121 WO2000067005A1 (en) | 1999-05-04 | 2000-05-03 | A method and apparatus for inspecting solder paste deposits on substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60034032D1 true DE60034032D1 (de) | 2007-05-03 |
DE60034032T2 DE60034032T2 (de) | 2007-12-13 |
Family
ID=23177612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60034032T Expired - Lifetime DE60034032T2 (de) | 1999-05-04 | 2000-05-03 | Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten |
Country Status (6)
Country | Link |
---|---|
US (1) | US6738505B1 (de) |
EP (1) | EP1181535B1 (de) |
JP (1) | JP4971543B2 (de) |
AU (1) | AU4697800A (de) |
DE (1) | DE60034032T2 (de) |
WO (1) | WO2000067005A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7072503B2 (en) * | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
US6891967B2 (en) * | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
JP3661604B2 (ja) * | 2001-04-05 | 2005-06-15 | 松下電器産業株式会社 | 顕微観察装置および顕微観察方法 |
US20020196336A1 (en) * | 2001-06-19 | 2002-12-26 | Applied Materials, Inc. | Method and apparatus for substrate imaging |
US7813559B2 (en) | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
KR100421987B1 (ko) * | 2001-12-06 | 2004-03-11 | 삼성전자주식회사 | 오차확산 처리방법 |
US7101508B2 (en) * | 2002-07-31 | 2006-09-05 | Agilent Technologies, Inc. | Chemical array fabrication errors |
US7213738B2 (en) * | 2002-09-30 | 2007-05-08 | Speedline Technologies, Inc. | Selective wave solder system |
DE10311822A1 (de) * | 2003-03-13 | 2004-10-07 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck |
US7508973B2 (en) * | 2003-03-28 | 2009-03-24 | Hitachi High-Technologies Corporation | Method of inspecting defects |
GB2403003B (en) * | 2003-06-19 | 2006-06-07 | Dek Int Gmbh | Inspection system for and method of inspecting deposits printed on workpieces |
US7003871B2 (en) * | 2003-10-01 | 2006-02-28 | Integrated Ideas & Technologies, Inc. | Solder paste stencil manufacturing system |
US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20060016066A1 (en) * | 2004-07-21 | 2006-01-26 | Cyberoptics Corporation | Pick and place machine with improved inspection |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
DE112006002473T5 (de) * | 2005-09-14 | 2008-08-14 | Cyberoptics Corp., Golden Valley | Bestückungsmaschine mit verbesserter Bauteil-Aufnahmebild-Identifizierungsverarbeitung |
US20070130755A1 (en) * | 2005-10-31 | 2007-06-14 | Duquette David W | Electronics assembly machine with embedded solder paste inspection |
US20070102478A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
US20070102477A1 (en) | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
JP5322257B2 (ja) * | 2005-12-06 | 2013-10-23 | 芝浦メカトロニクス株式会社 | 面粗さ検査装置 |
US7458318B2 (en) * | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
US9068917B1 (en) * | 2006-03-14 | 2015-06-30 | Kla-Tencor Technologies Corp. | Systems and methods for inspection of a specimen |
WO2007126027A1 (ja) | 2006-04-26 | 2007-11-08 | Sharp Kabushiki Kaisha | カラーフィルタ検査方法およびカラーフィルタ製造方法並びにカラーフィルタ検査装置 |
US7549371B2 (en) * | 2006-07-10 | 2009-06-23 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
SG141355A1 (en) * | 2006-09-13 | 2008-04-28 | Asml Masktools Bv | A method for performing pattern decomposition based on feature pitch |
JP2008139027A (ja) * | 2006-11-29 | 2008-06-19 | Sharp Corp | 検査装置、検査方法、撮像検査システム、カラーフィルタの製造方法、検査プログラム |
US7710611B2 (en) | 2007-02-16 | 2010-05-04 | Illinois Tool Works, Inc. | Single and multi-spectral illumination system and method |
US7861650B2 (en) * | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
JP5877639B2 (ja) * | 2010-12-27 | 2016-03-08 | 富士機械製造株式会社 | 画像生成装置および画像生成方法 |
US8939074B2 (en) | 2013-03-12 | 2015-01-27 | Illinois Tool Works Inc. | Color-based linear three dimensional acquisition system and method |
KR102025184B1 (ko) * | 2013-07-31 | 2019-09-25 | 엘지디스플레이 주식회사 | 데이터 변환 장치 및 이를 이용한 디스플레이 장치 |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
US10576566B2 (en) * | 2016-06-06 | 2020-03-03 | International Business Machines Corporation | Solder paste misprint cleaning |
KR20190084167A (ko) * | 2017-12-21 | 2019-07-16 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체 |
CN108960306B (zh) * | 2018-06-22 | 2022-03-04 | 西安电子科技大学 | 基于smt大数据的锡膏检测阈值优化方法 |
US11033990B2 (en) | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
EP4092408A4 (de) * | 2020-01-17 | 2023-02-08 | Fuji Corporation | Inspektionsvorrichtung und inspektionsverfahren |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6361110A (ja) * | 1986-05-27 | 1988-03-17 | シンセテイツク ヴイジヨン システムズ インコ−ポレ−テツド | 高速三次元測定方法及び装置 |
JPH081373B2 (ja) * | 1991-05-28 | 1996-01-10 | エイ・ティ・アンド・ティ・コーポレーション | 反射性のパタンの特質を監視するための検査方法 |
US5172420A (en) | 1991-05-28 | 1992-12-15 | At&T Bell Laboratories | Method for monitoring the dimensions and other aspects linewidth thickness and discoloration of specular patterns |
DE4222804A1 (de) | 1991-07-10 | 1993-04-01 | Raytheon Co | Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten |
DE69435333D1 (de) * | 1993-04-21 | 2011-03-24 | Omron Tateisi Electronics Co | Vorrichtung zur visuellen kontrolle von platinen und deren verwendung zur kontrolle und korrektur von lötungen |
GB9325243D0 (en) | 1993-12-09 | 1994-02-09 | New Royal Holloway & Bedford | Automatic monitoring system |
JPH07201946A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体装置等の製造方法及びその装置並びに検査方法及びその装置 |
DE4410603C1 (de) | 1994-03-26 | 1995-06-14 | Jenoptik Technologie Gmbh | Verfahren zur Erkennung von Fehlern bei der Inspektion von strukturierten Oberflächen |
JPH0834111A (ja) * | 1994-05-18 | 1996-02-06 | Sanyo Electric Co Ltd | スクリーン印刷機 |
JPH1056569A (ja) * | 1996-08-07 | 1998-02-24 | Riso Kagaku Corp | 画像処理方法および装置 |
US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
US5873939A (en) * | 1997-02-21 | 1999-02-23 | Doyle; Dennis G. | Dual track stencil/screen printer |
-
1999
- 1999-05-04 US US09/304,699 patent/US6738505B1/en not_active Expired - Lifetime
-
2000
- 2000-05-03 WO PCT/US2000/012121 patent/WO2000067005A1/en active IP Right Grant
- 2000-05-03 JP JP2000615594A patent/JP4971543B2/ja not_active Expired - Fee Related
- 2000-05-03 DE DE60034032T patent/DE60034032T2/de not_active Expired - Lifetime
- 2000-05-03 EP EP00928798A patent/EP1181535B1/de not_active Expired - Lifetime
- 2000-05-03 AU AU46978/00A patent/AU4697800A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US6738505B1 (en) | 2004-05-18 |
EP1181535B1 (de) | 2007-03-21 |
JP4971543B2 (ja) | 2012-07-11 |
DE60034032T2 (de) | 2007-12-13 |
WO2000067005A1 (en) | 2000-11-09 |
JP2002543421A (ja) | 2002-12-17 |
EP1181535A1 (de) | 2002-02-27 |
AU4697800A (en) | 2000-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |