DE69034023T2 - Verfahren zur Herstellung einer Halbleiteranordnung mit einer leitfähigen Schicht - Google Patents

Verfahren zur Herstellung einer Halbleiteranordnung mit einer leitfähigen Schicht

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Publication number
DE69034023T2
DE69034023T2 DE69034023T DE69034023T DE69034023T2 DE 69034023 T2 DE69034023 T2 DE 69034023T2 DE 69034023 T DE69034023 T DE 69034023T DE 69034023 T DE69034023 T DE 69034023T DE 69034023 T2 DE69034023 T2 DE 69034023T2
Authority
DE
Germany
Prior art keywords
film
producing
semiconductor device
conductive layer
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69034023T
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English (en)
Other versions
DE69034023D1 (de
Inventor
Tadahiro Ohmi
Mamoru Miyawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69034023D1 publication Critical patent/DE69034023D1/de
Publication of DE69034023T2 publication Critical patent/DE69034023T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02244Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer
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    • H01L21/02172Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02178Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314Inorganic layers
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    • H01L21/3165Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31683Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of metallic layers, e.g. Al deposited on the body, e.g. formation of multi-layer insulating structures
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    • H01L21/02129Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S148/00Metal treatment
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S438/926Dummy metallization
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S438/942Masking
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    • Y10S438/951Lift-off

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69034023T 1989-09-09 1990-09-07 Verfahren zur Herstellung einer Halbleiteranordnung mit einer leitfähigen Schicht Expired - Lifetime DE69034023T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1233929A JP2746289B2 (ja) 1989-09-09 1989-09-09 素子の作製方法並びに半導体素子およびその作製方法
PCT/JP1990/001149 WO1991003841A1 (en) 1989-09-09 1990-09-07 Element, method of fabricating the same, semiconductor element and method of fabricating the same

Publications (2)

Publication Number Publication Date
DE69034023D1 DE69034023D1 (de) 2003-01-16
DE69034023T2 true DE69034023T2 (de) 2003-04-30

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DE69034023T Expired - Lifetime DE69034023T2 (de) 1989-09-09 1990-09-07 Verfahren zur Herstellung einer Halbleiteranordnung mit einer leitfähigen Schicht

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Country Link
US (2) US5541444A (de)
EP (1) EP0463165B1 (de)
JP (1) JP2746289B2 (de)
AT (1) ATE229231T1 (de)
DE (1) DE69034023T2 (de)
WO (1) WO1991003841A1 (de)

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EP0463165A1 (de) 1992-01-02
EP0463165A4 (en) 1992-03-11
ATE229231T1 (de) 2002-12-15
US5541444A (en) 1996-07-30
US5854097A (en) 1998-12-29
JPH0397231A (ja) 1991-04-23
DE69034023D1 (de) 2003-01-16
WO1991003841A1 (en) 1991-03-21
JP2746289B2 (ja) 1998-05-06

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