JPS5515230A - Semiconductor device and its manufacturing method - Google Patents
Semiconductor device and its manufacturing methodInfo
- Publication number
- JPS5515230A JPS5515230A JP8799678A JP8799678A JPS5515230A JP S5515230 A JPS5515230 A JP S5515230A JP 8799678 A JP8799678 A JP 8799678A JP 8799678 A JP8799678 A JP 8799678A JP S5515230 A JPS5515230 A JP S5515230A
- Authority
- JP
- Japan
- Prior art keywords
- film
- poly
- etched
- layer
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 5
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- 230000010354 integration Effects 0.000 abstract 2
- 238000005468 ion implantation Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE: To obtain a bi-polar transistor with a high integration rate by using an inverse peaozoid mask.
CONSTITUTION: A poly Si 42 and Si2N243 are, laminated on a n-type Si substrate 41, and a SiO247 having the density distribution to a thickness direction is etched in an inverse peaozoid shape by Si2N446. After A B ion implantation, the film 43 is etched to be turned to a film 50 and heat-oxidized to form a SiO251. Successively, a film 50 is etched to be changed to a film 53, is provided for a B ion implantation after covering it with a poly Si and conduction layer 55 to 57 are made selectively. After heat treatment, the poly Si is selectively etched and a poly Si 60 is made narrower than SiO2N453 in width. After the film 47 has been removed, the poly Si 55 is selectively removed, and when a heat oxidization film 65 is made, a P+ layer is formed. Successively, after injection of ion, a shallow P layer 67 is formed, thereafter the film 53 is removed and the film 65 is ion-implanated by using a mask 65 to form a N layer 69 under the lower face of the film 68. Successively, a hole is provided in the film 65 to made an electrode 71 and 72. Thus, a device with a high integration rate can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8799678A JPS5515230A (en) | 1978-07-19 | 1978-07-19 | Semiconductor device and its manufacturing method |
| CA331,965A CA1129118A (en) | 1978-07-19 | 1979-07-17 | Semiconductor devices and method of manufacturing the same |
| GB7924980A GB2030002B (en) | 1978-07-19 | 1979-07-18 | Semiconductor devices and methods of manufacturing them |
| FR7918558A FR2433833A1 (en) | 1978-07-19 | 1979-07-18 | SEMICONDUCTOR HAVING SILICON REGIONS IN THE FORM OF SPECIFICALLY PROFILE PROJECTIONS AND ITS MANUFACTURING METHOD |
| DE19792928923 DE2928923A1 (en) | 1978-07-19 | 1979-07-18 | SEMICONDUCTOR DEVICE |
| US06/058,417 US4379001A (en) | 1978-07-19 | 1979-07-18 | Method of making semiconductor devices |
| NLAANVRAGE7905607,A NL189102C (en) | 1978-07-19 | 1979-07-19 | TRANSISTOR AND METHOD FOR MANUFACTURING THAT. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8799678A JPS5515230A (en) | 1978-07-19 | 1978-07-19 | Semiconductor device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5515230A true JPS5515230A (en) | 1980-02-02 |
| JPS6153864B2 JPS6153864B2 (en) | 1986-11-19 |
Family
ID=13930402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8799678A Granted JPS5515230A (en) | 1978-07-19 | 1978-07-19 | Semiconductor device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5515230A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56135976A (en) * | 1980-03-27 | 1981-10-23 | Seiko Instr & Electronics Ltd | Manufacture of field effect semiconductor device of junction type |
| JPS57109371A (en) * | 1980-12-26 | 1982-07-07 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS62367A (en) * | 1985-06-26 | 1987-01-06 | フジタ工業株式会社 | Non-combustible building |
| WO1991003841A1 (en) * | 1989-09-09 | 1991-03-21 | Tadahiro Ohmi | Element, method of fabricating the same, semiconductor element and method of fabricating the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5140866A (en) * | 1974-10-04 | 1976-04-06 | Nippon Electric Co |
-
1978
- 1978-07-19 JP JP8799678A patent/JPS5515230A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5140866A (en) * | 1974-10-04 | 1976-04-06 | Nippon Electric Co |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56135976A (en) * | 1980-03-27 | 1981-10-23 | Seiko Instr & Electronics Ltd | Manufacture of field effect semiconductor device of junction type |
| JPS57109371A (en) * | 1980-12-26 | 1982-07-07 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS62367A (en) * | 1985-06-26 | 1987-01-06 | フジタ工業株式会社 | Non-combustible building |
| WO1991003841A1 (en) * | 1989-09-09 | 1991-03-21 | Tadahiro Ohmi | Element, method of fabricating the same, semiconductor element and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6153864B2 (en) | 1986-11-19 |
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