JPS57114274A - Electrode for semiconductor device and manufacture thereof - Google Patents

Electrode for semiconductor device and manufacture thereof

Info

Publication number
JPS57114274A
JPS57114274A JP76581A JP76581A JPS57114274A JP S57114274 A JPS57114274 A JP S57114274A JP 76581 A JP76581 A JP 76581A JP 76581 A JP76581 A JP 76581A JP S57114274 A JPS57114274 A JP S57114274A
Authority
JP
Japan
Prior art keywords
layer
electrode
accumulated
silicide
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP76581A
Other languages
Japanese (ja)
Inventor
Takehisa Yashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP76581A priority Critical patent/JPS57114274A/en
Publication of JPS57114274A publication Critical patent/JPS57114274A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To flatten an electrode for a semiconductor device by forming a contacting electrode of two layers made of a metallic layer and a silicide layer on the diffused region of the device. CONSTITUTION:A selectively oxidized region 101 and a gate insulating film 104 are formed on a semiconductor substrate 1. Then, a polycrystalline silicon layer 110 is accumulated to form a gate electrode 105. With an interlayer insulating layer 111 as a mask the substrate is sidewisely etched. Then, an oxidized film is formed on the side face. Subsequently, an unnecessary film is removed. An impurity is injected to form source and drain regions 102, 103. Subsequently, metallic layers 106, 107 of metal such as W, Mo, etc., are accumulated. Then, a silicide forming metal layer of metal such as Pt and a polycrystalline Si are accumulated to form silicide layers 108, 109. In this manner, the surface can be flattened and the source and drain electrodes can be formed by a self-alignment. Accordingly, the device can be increased in density.
JP76581A 1981-01-08 1981-01-08 Electrode for semiconductor device and manufacture thereof Pending JPS57114274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP76581A JPS57114274A (en) 1981-01-08 1981-01-08 Electrode for semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP76581A JPS57114274A (en) 1981-01-08 1981-01-08 Electrode for semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS57114274A true JPS57114274A (en) 1982-07-16

Family

ID=11482784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP76581A Pending JPS57114274A (en) 1981-01-08 1981-01-08 Electrode for semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57114274A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851369A (en) * 1987-12-04 1989-07-25 U.S. Philips Corporation Method of establishing a structure of electrical interconnections on a silicon semiconductor device
JPH02156542A (en) * 1988-12-08 1990-06-15 Mitsubishi Electric Corp Semiconductor device and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851369A (en) * 1987-12-04 1989-07-25 U.S. Philips Corporation Method of establishing a structure of electrical interconnections on a silicon semiconductor device
JPH02156542A (en) * 1988-12-08 1990-06-15 Mitsubishi Electric Corp Semiconductor device and manufacture thereof

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