JPS5773977A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5773977A
JPS5773977A JP56136445A JP13644581A JPS5773977A JP S5773977 A JPS5773977 A JP S5773977A JP 56136445 A JP56136445 A JP 56136445A JP 13644581 A JP13644581 A JP 13644581A JP S5773977 A JPS5773977 A JP S5773977A
Authority
JP
Japan
Prior art keywords
film
wire
gate
sio2
si3n4
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56136445A
Other languages
Japanese (ja)
Inventor
Michitoku Kamatani
Minoru Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56136445A priority Critical patent/JPS5773977A/en
Publication of JPS5773977A publication Critical patent/JPS5773977A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a multilayer wire without disconnection by employing an SiO2 film, an Si3N4 film, a polycrystalline Si film, etc. when forming an IGFET and freely limiting the thickness of an insulating film on the upper surface. CONSTITUTION:An SiO2 film 2 is covered on an N type Si substrate 1, a substrate surface 3 is exposed corresponding to source, drain and gate forming regions, and a gate SiO2 film 4 integral with the film 2 is covered thereon. Subsequentlu, an Si3N4 film 5, a polycrystalline Si film 6, an Si3N4 film 7 are laminated, are photoetched, and the film 7 and a film 8 made only of the film 7 are retained on the gate forming region and the wire forming region. Thereafter, with them as masks it is etched to retain the film 6, a gate 11 and a wire 10 only under the films 7, 8, are heat treated, and an SiO2 film 12 is formed at the side face. Thereafter, it is etched to remove the exposed films 5, 8, 9, P type impurity is diffused to form P type source and drain regions 14, 16, and the electrode 11 and the wire 10 are imparted with conductivity.
JP56136445A 1981-08-31 1981-08-31 Manufacture of semiconductor device Pending JPS5773977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56136445A JPS5773977A (en) 1981-08-31 1981-08-31 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56136445A JPS5773977A (en) 1981-08-31 1981-08-31 Manufacture of semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6887072A Division JPS5550395B2 (en) 1972-07-08 1972-07-08

Publications (1)

Publication Number Publication Date
JPS5773977A true JPS5773977A (en) 1982-05-08

Family

ID=15175276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56136445A Pending JPS5773977A (en) 1981-08-31 1981-08-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5773977A (en)

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