JPS5550660A - Manufacturing of semiconductor device - Google Patents
Manufacturing of semiconductor deviceInfo
- Publication number
- JPS5550660A JPS5550660A JP12262778A JP12262778A JPS5550660A JP S5550660 A JPS5550660 A JP S5550660A JP 12262778 A JP12262778 A JP 12262778A JP 12262778 A JP12262778 A JP 12262778A JP S5550660 A JPS5550660 A JP S5550660A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- mask
- silicon layer
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To accelerate the operating speed of a semiconductor device by decreasing the resistance thereof without increasing the thickness of a polycrystal silicon layer doped with impurities in the device by illuminating laser light through an insulating layer to the silicon layer when forming an electrode or wire using the silicon layer.
CONSTITUTION: Thick field SiO2 films 12 are formed on both ends of a p-type silicon substrate 11, and a thin gate SiO2 film 13 is coated on the surface of the substrate 11 surrounded by the film 12 to then a polycrystal silicon layer 14 is grown on the entire surface in vapor. N-type impurities are doped with the layer 14 to impart a conductivity to the layer 14. Then, a mask 15 of photoresist film is provided, and etched to thereby retain only a layer 14' becoming a gate electrode or a wire. Then, the mask 14 is removed, N-type source and drain regions 16 and 17 are formed by an ion implantation process with the layer 14' as a mask, a PSG film 18 is coated on the entire surface, and heat treated to thereby form a smooth surface by means of reflow. Then, laser light 30 is illuminated through the film 18 to the layer 14' to thereby lower the resistance to predetermined value, and openings are provided to mount aluminum layers 19a and 19b making contact with the regions 16 and 17.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12262778A JPS5550660A (en) | 1978-10-06 | 1978-10-06 | Manufacturing of semiconductor device |
US06/078,783 US4309224A (en) | 1978-10-06 | 1979-09-25 | Method for manufacturing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12262778A JPS5550660A (en) | 1978-10-06 | 1978-10-06 | Manufacturing of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5550660A true JPS5550660A (en) | 1980-04-12 |
JPS6152987B2 JPS6152987B2 (en) | 1986-11-15 |
Family
ID=14840637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12262778A Granted JPS5550660A (en) | 1978-10-06 | 1978-10-06 | Manufacturing of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5550660A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01179582U (en) * | 1988-06-10 | 1989-12-22 | ||
JPH0421520U (en) * | 1990-06-14 | 1992-02-24 |
-
1978
- 1978-10-06 JP JP12262778A patent/JPS5550660A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6152987B2 (en) | 1986-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5492175A (en) | Manufacture of semiconductor device | |
JPS5550660A (en) | Manufacturing of semiconductor device | |
JPS5642367A (en) | Manufacture of bipolar integrated circuit | |
JPS5688358A (en) | Manufacture of semiconductor device | |
JPS5583267A (en) | Method of fabricating semiconductor device | |
JPS54130883A (en) | Production of semiconductor device | |
JPS5550661A (en) | Insulated gate type field effect semiconductor device | |
JPS5541738A (en) | Preparation of semiconductor device | |
JPS54139486A (en) | Manufacture of semiconductor device | |
JPS5559778A (en) | Method of fabricating semiconductor device | |
JPS5780768A (en) | Semiconductor device | |
JPS55105332A (en) | Manufacture of semiconductor device | |
JPS5550662A (en) | Manufacturing of mos-type semiconductor device | |
JPS5459873A (en) | Production of semiconductor device | |
JPS5559738A (en) | Preparation of semiconductor device | |
JPS5544779A (en) | Producing method for mos semiconductor device | |
JPS5773977A (en) | Manufacture of semiconductor device | |
JPS5739579A (en) | Mos semiconductor device and manufacture thereof | |
JPS6465874A (en) | Manufacture of semiconductor device | |
JPS5578566A (en) | Manufacture of semiconductor device | |
JPS54116185A (en) | Manufacture for semiconductor device | |
JPS55157242A (en) | Manufacture of semiconductor device | |
JPS5518042A (en) | Method of fabricating semiconductor device | |
JPS5610945A (en) | Manufacture of semiconductor device | |
JPS553614A (en) | Insulating gate type fet device and its manufacturing method |