DE60034389D1 - Festkörperbildaufnahmevorrichtung und Verfahren zu ihrer Herstellung - Google Patents

Festkörperbildaufnahmevorrichtung und Verfahren zu ihrer Herstellung

Info

Publication number
DE60034389D1
DE60034389D1 DE60034389T DE60034389T DE60034389D1 DE 60034389 D1 DE60034389 D1 DE 60034389D1 DE 60034389 T DE60034389 T DE 60034389T DE 60034389 T DE60034389 T DE 60034389T DE 60034389 D1 DE60034389 D1 DE 60034389D1
Authority
DE
Germany
Prior art keywords
solid
production
image pickup
pickup device
state image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60034389T
Other languages
English (en)
Other versions
DE60034389T2 (de
Inventor
Ryoji Suzuki
Takahisa Ueno
Hirofumi Sumi
Keiji Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26370147&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60034389(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE60034389D1 publication Critical patent/DE60034389D1/de
Application granted granted Critical
Publication of DE60034389T2 publication Critical patent/DE60034389T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1463—Pixel isolation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE60034389T 1999-02-09 2000-02-08 Festkörperbildaufnahmevorrichtung und Verfahren zu ihrer Herstellung Expired - Lifetime DE60034389T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3164499 1999-02-09
JP3164499 1999-02-09
JP29136399 1999-10-13
JP29136399A JP4604296B2 (ja) 1999-02-09 1999-10-13 固体撮像装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE60034389D1 true DE60034389D1 (de) 2007-05-31
DE60034389T2 DE60034389T2 (de) 2008-01-03

Family

ID=26370147

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60034389T Expired - Lifetime DE60034389T2 (de) 1999-02-09 2000-02-08 Festkörperbildaufnahmevorrichtung und Verfahren zu ihrer Herstellung

Country Status (5)

Country Link
US (2) US6423993B1 (de)
EP (1) EP1028470B1 (de)
JP (1) JP4604296B2 (de)
KR (1) KR100733532B1 (de)
DE (1) DE60034389T2 (de)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4988086B2 (ja) * 2000-06-13 2012-08-01 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法並びに抵抗器及び半導体素子
JP3688980B2 (ja) * 2000-06-28 2005-08-31 株式会社東芝 Ｍｏｓ型固体撮像装置及びその製造方法
JP3759435B2 (ja) * 2001-07-11 2006-03-22 ソニー株式会社 Ｘ−ｙアドレス型固体撮像素子
US7109535B1 (en) * 2001-08-22 2006-09-19 Ess Technology, Inc. Semiconductor device for isolating a photodiode to reduce junction leakage
US20030038336A1 (en) * 2001-08-22 2003-02-27 Mann Richard A. Semiconductor device for isolating a photodiode to reduce junction leakage and method of formation
US6504196B1 (en) * 2001-08-30 2003-01-07 Micron Technology, Inc. CMOS imager and method of formation
JP4235787B2 (ja) * 2001-10-03 2009-03-11 ソニー株式会社 固体撮像素子の製造方法
JP2003142674A (ja) 2001-11-07 2003-05-16 Toshiba Corp Ｍｏｓ型固体撮像装置
KR20030037655A (ko) * 2001-11-07 2003-05-14 주식회사 하이닉스반도체 씨모스 이미지 센서의 제조방법
KR100813800B1 (ko) * 2001-12-21 2008-03-13 매그나칩 반도체 유한회사 암전류 특성과 전하저장능력을 향상시킨 이미지센서 및 그제조방법
KR100838466B1 (ko) * 2001-12-27 2008-06-16 매그나칩 반도체 유한회사 고집적 이미지센서 제조 방법
KR100813801B1 (ko) * 2001-12-27 2008-03-13 매그나칩 반도체 유한회사 광감도를 향상시키기 위한 이미지센서 및 그 제조 방법
KR100776151B1 (ko) * 2001-12-27 2007-11-16 매그나칩 반도체 유한회사 고집적 이미지센서 제조 방법
KR100494030B1 (ko) * 2002-01-10 2005-06-10 매그나칩 반도체 유한회사 이미지센서 및 그 제조 방법
US6864516B2 (en) * 2002-02-28 2005-03-08 Advanced Micro Devices, Inc. SOI MOSFET junction degradation using multiple buried amorphous layers
JP4282049B2 (ja) * 2002-02-28 2009-06-17 キヤノン株式会社 半導体装置、光電変換装置及びカメラ
JP3702854B2 (ja) * 2002-03-06 2005-10-05 ソニー株式会社 固体撮像素子
JP3908572B2 (ja) * 2002-03-18 2007-04-25 株式会社東芝 半導体素子
JP3986051B2 (ja) * 2002-04-30 2007-10-03 株式会社半導体エネルギー研究所 発光装置、電子機器
JP4107890B2 (ja) * 2002-06-27 2008-06-25 富士通株式会社 光導波路デバイス
JP3840203B2 (ja) 2002-06-27 2006-11-01 キヤノン株式会社 固体撮像装置及び固体撮像装置を用いたカメラシステム
KR100893054B1 (ko) * 2002-07-05 2009-04-15 매그나칩 반도체 유한회사 크로스토크를 방지할 수 있는 이미지센서 및 그 제조 방법
KR100873292B1 (ko) * 2002-07-15 2008-12-11 매그나칩 반도체 유한회사 소자 격리 특성을 향상시킨 이미지센서 및 그 제조 방법
KR20040008912A (ko) * 2002-07-19 2004-01-31 주식회사 하이닉스반도체 이미지센서의 하이브리드 소자분리 방법
US7091536B2 (en) * 2002-11-14 2006-08-15 Micron Technology, Inc. Isolation process and structure for CMOS imagers
US7087944B2 (en) * 2003-01-16 2006-08-08 Micron Technology, Inc. Image sensor having a charge storage region provided within an implant region
US6949445B2 (en) * 2003-03-12 2005-09-27 Micron Technology, Inc. Method of forming angled implant for trench isolation
FR2855655B1 (fr) * 2003-05-26 2005-08-19 Commissariat Energie Atomique Detecteur de rayonnement infrarouge photovoltaique a grille conductrice independante et tridimensionnelle
US7148528B2 (en) * 2003-07-02 2006-12-12 Micron Technology, Inc. Pinned photodiode structure and method of formation
KR100508864B1 (ko) * 2003-10-23 2005-08-17 동부아남반도체 주식회사 씨모스 이미지 센서 및 이의 제조 방법
US7354789B2 (en) * 2003-11-04 2008-04-08 Dongbu Electronics Co., Ltd. CMOS image sensor and method for fabricating the same
JP4514188B2 (ja) * 2003-11-10 2010-07-28 キヤノン株式会社 光電変換装置及び撮像装置
WO2005088720A2 (en) 2004-03-17 2005-09-22 Matsushita Electric Works, Ltd. Light detecting element and method for operating it
JP2005327858A (ja) * 2004-05-13 2005-11-24 Matsushita Electric Ind Co Ltd 固体撮像装置
KR100698069B1 (ko) * 2004-07-01 2007-03-23 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 제조방법
KR100659382B1 (ko) * 2004-08-06 2006-12-19 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP2006073736A (ja) * 2004-09-01 2006-03-16 Canon Inc 光電変換装置、固体撮像装置及び固体撮像システム
JP4646577B2 (ja) * 2004-09-01 2011-03-09 キヤノン株式会社 光電変換装置、その製造方法及び撮像システム
JP4691990B2 (ja) * 2005-01-05 2011-06-01 ソニー株式会社 固体撮像装置及びその製造方法
JP4742602B2 (ja) 2005-02-01 2011-08-10 ソニー株式会社 固体撮像装置及びその製造方法
KR100642760B1 (ko) * 2005-03-28 2006-11-10 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP4718875B2 (ja) * 2005-03-31 2011-07-06 株式会社東芝 固体撮像素子
JP5292628B2 (ja) * 2005-04-29 2013-09-18 トリクセル 画像センサを備えた半導体装置及びその製造方法
JP2006339533A (ja) * 2005-06-03 2006-12-14 Sanyo Electric Co Ltd 半導体装置
KR100699844B1 (ko) * 2005-06-10 2007-03-27 삼성전자주식회사 이미지 센서의 제조 방법
CN100416845C (zh) * 2005-07-12 2008-09-03 北京思比科微电子技术有限公司 低衬底漏电流的空穴积累型有源像素及其制造方法
US8446508B2 (en) * 2005-07-27 2013-05-21 Sony Corporation Solid state imaging device with optimized locations of internal electrical components
US7800146B2 (en) * 2005-08-26 2010-09-21 Aptina Imaging Corporation Implanted isolation region for imager pixels
US7875916B2 (en) 2005-09-28 2011-01-25 Eastman Kodak Company Photodetector and n-layer structure for improved collection efficiency
KR100752646B1 (ko) * 2005-10-01 2007-08-29 삼성전자주식회사 이미지 센서 및 이의 제조 방법
JP2007242697A (ja) * 2006-03-06 2007-09-20 Canon Inc 撮像装置および撮像システム
JP2008034772A (ja) * 2006-08-01 2008-02-14 Matsushita Electric Ind Co Ltd 固体撮像装置及び固体撮像装置の製造方法およびカメラ
US7521278B2 (en) * 2006-10-17 2009-04-21 Eastman Kodak Company Isolation method for low dark current imager
KR100935269B1 (ko) * 2007-12-27 2010-01-06 주식회사 동부하이텍 이미지 센서 및 그 제조방법
US20090243025A1 (en) * 2008-03-25 2009-10-01 Stevens Eric G Pixel structure with a photodetector having an extended depletion depth
JP2010050374A (ja) * 2008-08-25 2010-03-04 Seiko Instruments Inc 半導体装置
US8618458B2 (en) * 2008-11-07 2013-12-31 Omnivision Technologies, Inc. Back-illuminated CMOS image sensors
JP5538922B2 (ja) * 2009-02-06 2014-07-02 キヤノン株式会社 固体撮像装置の製造方法
JP2010206181A (ja) * 2009-02-06 2010-09-16 Canon Inc 光電変換装置及び撮像システム
JP2010206178A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置、及び光電変換装置の製造方法
JP2010212319A (ja) * 2009-03-09 2010-09-24 Sony Corp 固体撮像装置、電子機器および固体撮像装置の製造方法
US8138531B2 (en) * 2009-09-17 2012-03-20 International Business Machines Corporation Structures, design structures and methods of fabricating global shutter pixel sensor cells
JP2012142560A (ja) * 2010-12-15 2012-07-26 Canon Inc 固体撮像装置およびその製造方法ならびにカメラ
JP5950507B2 (ja) * 2011-05-02 2016-07-13 キヤノン株式会社 半導体装置の製造方法およびｃｍｏｓイメージセンサーの製造方法
WO2012176390A1 (ja) * 2011-06-23 2012-12-27 パナソニック株式会社 固体撮像装置
WO2013076924A1 (ja) 2011-11-22 2013-05-30 パナソニック株式会社 固体撮像装置
US20150162367A1 (en) * 2013-12-05 2015-06-11 Himax Imaging, Inc. Semiconductor structure for suppressing hot cluster and method of forming semiconductor for suppressing hot cluster
JP2016092178A (ja) 2014-11-04 2016-05-23 株式会社リコー 固体撮像素子
JP6396775B2 (ja) * 2014-12-03 2018-09-26 ルネサスエレクトロニクス株式会社 撮像装置
JP2017045879A (ja) * 2015-08-27 2017-03-02 株式会社東芝 固体撮像装置および固体撮像装置の製造方法
JP2017054932A (ja) * 2015-09-09 2017-03-16 株式会社東芝 固体撮像装置および固体撮像装置の製造方法
JP6911767B2 (ja) * 2016-04-25 2021-07-28 ソニーグループ株式会社 固体撮像素子およびその製造方法、並びに電子機器
JP7121468B2 (ja) * 2017-02-24 2022-08-18 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP2020088293A (ja) * 2018-11-29 2020-06-04 キヤノン株式会社 光電変換装置、光電変換システム、移動体
JP2019114797A (ja) * 2019-02-20 2019-07-11 株式会社東芝 固体撮像装置および固体撮像装置の製造方法
JP6682674B2 (ja) * 2019-02-27 2020-04-15 株式会社東芝 固体撮像装置および固体撮像装置の製造方法
CN111952398A (zh) * 2019-05-17 2020-11-17 清华大学 一种平衡探测器及其制备方法
JP7176483B2 (ja) * 2019-06-24 2022-11-22 信越半導体株式会社 半導体基板の評価方法および評価用半導体基板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484210A (en) * 1980-09-05 1984-11-20 Nippon Electric Co., Ltd. Solid-state imaging device having a reduced image lag
JPH07107928B2 (ja) * 1986-03-25 1995-11-15 ソニー株式会社 固体撮像装置
JPH01248658A (ja) * 1988-03-30 1989-10-04 Nec Corp 固体撮像素子
JPH0316263A (ja) * 1989-06-14 1991-01-24 Hitachi Ltd 固体撮像素子
JPH04286361A (ja) * 1991-03-15 1992-10-12 Sony Corp 固体撮像装置
JPH05145056A (ja) * 1991-11-19 1993-06-11 Hitachi Ltd 固体撮像素子
KR930017195A (ko) * 1992-01-23 1993-08-30 오가 노리오 고체촬상소자 및 그 제법
JPH06275809A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 固体撮像素子
JPH07161958A (ja) * 1993-12-09 1995-06-23 Nec Corp 固体撮像装置
US5736756A (en) * 1994-09-29 1998-04-07 Sony Corporation Solid-state image sensing device with lght shielding film
US5625210A (en) * 1995-04-13 1997-04-29 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode
KR100192954B1 (ko) * 1996-07-18 1999-06-15 김광호 수직형 전달게이트를 가지는 전하결합형 고체촬상소자 및 그 제조방법
JPH1098176A (ja) * 1996-09-19 1998-04-14 Toshiba Corp 固体撮像装置
JP3455655B2 (ja) * 1997-03-03 2003-10-14 株式会社東芝 固体撮像装置および固体撮像装置応用システム
GB2324651B (en) * 1997-04-25 1999-09-01 Vlsi Vision Ltd Improved solid state image sensor
JPH11274462A (ja) * 1998-03-23 1999-10-08 Sony Corp 固体撮像装置
US6215165B1 (en) * 1998-06-17 2001-04-10 Intel Corporation Reduced leakage trench isolation
US6287886B1 (en) * 1999-08-23 2001-09-11 United Microelectronics Corp. Method of forming a CMOS image sensor

Also Published As

Publication number Publication date
JP2000299453A (ja) 2000-10-24
EP1028470A2 (de) 2000-08-16
DE60034389T2 (de) 2008-01-03
US6423993B1 (en) 2002-07-23
KR20000057977A (ko) 2000-09-25
EP1028470B1 (de) 2007-04-18
KR100733532B1 (ko) 2007-06-29
EP1028470A3 (de) 2004-06-30
JP4604296B2 (ja) 2011-01-05
US20010015435A1 (en) 2001-08-23
US6417023B2 (en) 2002-07-09

Similar Documents

Publication Publication Date Title
DE60034389D1 (de) Festkörperbildaufnahmevorrichtung und Verfahren zu ihrer Herstellung
DE60226529D1 (de) Festkörper-Bildaufnahmevorrichtung und Verfahren zu ihrer Ansteuerung
DE60042914D1 (de) Halbleitervorrichtung und verfahren zu ihrer herstellung
DE60135206D1 (de) Röntgenabbildungseinrichtung und verfahren zu ihrer herstellung
DE60031949D1 (de) Leiterplatte und verfahren zu ihrer herstellung
DE69917111D1 (de) Festkörper-Bildaufnahmevorrichtung und Verfahren zu ihrer Herstellung
DE69932862D1 (de) Bildaufzeichnungsgerät und -verfahren
DE60043039D1 (de) Bildaufzeichnungsvorrichtung
DE60034814D1 (de) Bildwiederauffindungsystem und -verfahren
DE60026950D1 (de) Bilderzeugungsgerät
DE60201368D1 (de) Bildaufnahmegerät und Verfahren zu dessen Herstellung
DE69837238D1 (de) Festkörper-Bildaufnahmevorrichtung und Verfahren zu ihrer Ansteuerung
DE60131745D1 (de) Filtervorrichtung und verfahren zu deren herstellung
DE60007280D1 (de) Bildempfangsmaterial und verfahren zu ihrer herstellung und verwendung
DE60034208D1 (de) Bilderzeugungsgerät
DE60015425D1 (de) Bilderzeugungsgerät
DE60041231D1 (de) Bilderzeugungsgerät
DE60024801D1 (de) Polyurethanharnstofffasern und verfahren zu ihrer herstellung
DE60037287D1 (de) Piezoelektrisches/elektrostriktives Bauelement und Verfahren zu seiner Herstellung
DE60144157D1 (de) Elektrochemische einrichtung und verfahren zu ihrer herstellung
DE60021321D1 (de) Bilderzeugungsverfahren und Gerät
DE60026777D1 (de) Optische Koppelvorrichtung und Verfahren zu deren Herstellung
DE60127883D1 (de) Festkörperbildaufnahmevorrichtung und Ansteuermethode dafür
DE60017473D1 (de) Bilderzeugungsgerät
DE60033594D1 (de) Bilderzeugungsgerät

Legal Events

Date Code Title Description
8364 No opposition during term of opposition