DE60131745D1 - Filtervorrichtung und verfahren zu deren herstellung - Google Patents

Filtervorrichtung und verfahren zu deren herstellung

Info

Publication number
DE60131745D1
DE60131745D1 DE60131745T DE60131745T DE60131745D1 DE 60131745 D1 DE60131745 D1 DE 60131745D1 DE 60131745 T DE60131745 T DE 60131745T DE 60131745 T DE60131745 T DE 60131745T DE 60131745 D1 DE60131745 D1 DE 60131745D1
Authority
DE
Germany
Prior art keywords
production
filter device
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60131745T
Other languages
English (en)
Other versions
DE60131745T2 (de
Inventor
Roger W Whatmore
Eiju Komuro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE60131745D1 publication Critical patent/DE60131745D1/de
Publication of DE60131745T2 publication Critical patent/DE60131745T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
    • H03H9/56—Monolithic crystal filters
    • H03H9/564—Monolithic crystal filters implemented with thin-film techniques
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
DE60131745T 2000-07-11 2001-07-11 Filtervorrichtung und verfahren zu deren herstellung Expired - Lifetime DE60131745T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0016861 2000-07-11
GBGB0016861.7A GB0016861D0 (en) 2000-07-11 2000-07-11 Improvements in or relating to filters
PCT/GB2001/003135 WO2002005425A1 (en) 2000-07-11 2001-07-11 Improvements in or relating to filters

Publications (2)

Publication Number Publication Date
DE60131745D1 true DE60131745D1 (de) 2008-01-17
DE60131745T2 DE60131745T2 (de) 2008-04-10

Family

ID=9895324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131745T Expired - Lifetime DE60131745T2 (de) 2000-07-11 2001-07-11 Filtervorrichtung und verfahren zu deren herstellung

Country Status (7)

Country Link
US (1) US20020121337A1 (de)
EP (1) EP1299946B1 (de)
JP (1) JP2004503164A (de)
AU (1) AU2001270800A1 (de)
DE (1) DE60131745T2 (de)
GB (1) GB0016861D0 (de)
WO (1) WO2002005425A1 (de)

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EP1469599B1 (de) * 2003-04-18 2010-11-03 Samsung Electronics Co., Ltd. Dünnschicht-Resonator von Luftspaltbauart, Duplexer mit dem Resonator und deren Herstellungsverfahren
US6924717B2 (en) * 2003-06-30 2005-08-02 Intel Corporation Tapered electrode in an acoustic resonator
KR100558439B1 (ko) 2003-09-15 2006-03-10 삼성전기주식회사 웨이퍼 레벨 패키지의 ｆｂａｒ 소자 및 그 제조 방법
KR100555762B1 (ko) 2003-10-07 2006-03-03 삼성전자주식회사 에어갭형 박막 벌크 음향 공진기 및 그 제조방법, 이를이용한 필터 및 듀플렉서
KR100622955B1 (ko) * 2004-04-06 2006-09-18 삼성전자주식회사 박막 벌크 음향 공진기 및 그 제조방법
GB2431512B (en) 2004-06-25 2008-05-21 Murata Manufacturing Co Piezoelectric device
KR100594716B1 (ko) * 2004-07-27 2006-06-30 삼성전자주식회사 공동부를 구비한 캡 웨이퍼, 이를 이용한 반도체 칩, 및그 제조방법
JP2006109400A (ja) 2004-09-13 2006-04-20 Seiko Epson Corp 電子部品、回路基板、電子機器、電子部品の製造方法
JP2006173557A (ja) * 2004-11-22 2006-06-29 Toshiba Corp 中空型半導体装置とその製造方法
US7248131B2 (en) * 2005-03-14 2007-07-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Monolithic vertical integration of an acoustic resonator and electronic circuitry
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
JP2007019132A (ja) * 2005-07-06 2007-01-25 Seiko Epson Corp 圧電振動装置の製造方法
KR100822469B1 (ko) * 2005-12-07 2008-04-16 삼성전자주식회사 복수개의 소자를 상호 격리시키기 위한 에어캐비티를구비한 시스템 온 칩 구조물, 듀플렉서, 및 그 제조 방법
KR101302132B1 (ko) * 2006-02-06 2013-09-03 삼성전자주식회사 멀티 밴드용 필터 모듈 및 그의 제작 방법
DE102006047698B4 (de) * 2006-10-09 2009-04-09 Epcos Ag Mit akustischen Volumenwellen arbeitender Resonator
US7851333B2 (en) * 2007-03-15 2010-12-14 Infineon Technologies Ag Apparatus comprising a device and method for producing it
KR101411416B1 (ko) * 2007-12-14 2014-06-26 삼성전자주식회사 마이크로 스피커 제조방법 및 이 방법에 의해 제조된마이크로 스피커
JP5168568B2 (ja) * 2008-09-01 2013-03-21 Ｔｄｋ株式会社 薄膜バルク波共振器
KR101708893B1 (ko) * 2010-09-01 2017-03-08 삼성전자주식회사 체적 음향 공진기 구조 및 제조 방법
US10366883B2 (en) 2014-07-30 2019-07-30 Hewlett Packard Enterprise Development Lp Hybrid multilayer device
CN104917476B (zh) * 2015-05-28 2022-04-12 苏州汉天下电子有限公司 一种声波谐振器的制造方法
US10658177B2 (en) 2015-09-03 2020-05-19 Hewlett Packard Enterprise Development Lp Defect-free heterogeneous substrates
CN106877836B (zh) 2015-12-14 2020-12-18 中芯国际集成电路制造(上海)有限公司 一种薄膜体声波谐振器及其制造方法和电子装置
US10586847B2 (en) * 2016-01-15 2020-03-10 Hewlett Packard Enterprise Development Lp Multilayer device
US11088244B2 (en) 2016-03-30 2021-08-10 Hewlett Packard Enterprise Development Lp Devices having substrates with selective airgap regions
KR102444727B1 (ko) 2017-12-22 2022-09-16 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 고주파 프론트엔드 회로 및 통신 장치
JP2019161145A (ja) * 2018-03-16 2019-09-19 三菱マテリアル株式会社 圧電体膜
US10381801B1 (en) 2018-04-26 2019-08-13 Hewlett Packard Enterprise Development Lp Device including structure over airgap
WO2020209152A1 (ja) * 2019-04-08 2020-10-15 株式会社村田製作所 弾性波デバイスおよびそれを備えたフィルタ装置
CN112039455B (zh) * 2019-07-19 2023-09-29 中芯集成电路（宁波）有限公司上海分公司 体声波谐振器的封装方法及封装结构
CN112039456A (zh) * 2019-07-19 2020-12-04 中芯集成电路（宁波）有限公司 体声波谐振器的封装方法及封装结构
CN112039459B (zh) * 2019-07-19 2024-03-08 中芯集成电路（宁波）有限公司上海分公司 体声波谐振器的封装方法及封装结构
CN110828950B (zh) * 2019-10-18 2022-05-10 天津大学 一种多工器

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US3453458A (en) * 1965-04-19 1969-07-01 Clevite Corp Resonator supporting structure
US5747857A (en) * 1991-03-13 1998-05-05 Matsushita Electric Industrial Co., Ltd. Electronic components having high-frequency elements and methods of manufacture therefor
US5185589A (en) * 1991-05-17 1993-02-09 Westinghouse Electric Corp. Microwave film bulk acoustic resonator and manifolded filter bank
US5448014A (en) * 1993-01-27 1995-09-05 Trw Inc. Mass simultaneous sealing and electrical connection of electronic devices
US5386142A (en) * 1993-05-07 1995-01-31 Kulite Semiconductor Products, Inc. Semiconductor structures having environmentally isolated elements and method for making the same
JPH06350371A (ja) * 1993-06-10 1994-12-22 Matsushita Electric Ind Co Ltd 圧電デバイスの製造方法
US5701645A (en) * 1994-04-06 1997-12-30 Motorola, Inc. Acoustic wave device manufacturing method
US5891751A (en) * 1995-06-02 1999-04-06 Kulite Semiconductor Products, Inc . Hermetically sealed transducers and methods for producing the same
US5882465A (en) * 1997-06-18 1999-03-16 Caliper Technologies Corp. Method of manufacturing microfluidic devices
JP2000186931A (ja) * 1998-12-21 2000-07-04 Murata Mfg Co Ltd 小型電子部品及びその製造方法並びに該小型電子部品に用いるビアホールの成形方法
FR2788176B1 (fr) * 1998-12-30 2001-05-25 Thomson Csf Dispositif a ondes acoustiques guidees dans une fine couche de materiau piezo-electrique collee par une colle moleculaire sur un substrat porteur et procede de fabrication
US6182342B1 (en) * 1999-04-02 2001-02-06 Andersen Laboratories, Inc. Method of encapsulating a saw device

Also Published As

Publication number Publication date
US20020121337A1 (en) 2002-09-05
DE60131745T2 (de) 2008-04-10
GB0016861D0 (en) 2000-08-30
EP1299946B1 (de) 2007-12-05
WO2002005425A1 (en) 2002-01-17
EP1299946A1 (de) 2003-04-09
JP2004503164A (ja) 2004-01-29
AU2001270800A1 (en) 2002-01-21

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