AU2001270800A1 - Improvements in or relating to filters - Google Patents

Improvements in or relating to filters

Info

Publication number
AU2001270800A1
AU2001270800A1 AU2001270800A AU7080001A AU2001270800A1 AU 2001270800 A1 AU2001270800 A1 AU 2001270800A1 AU 2001270800 A AU2001270800 A AU 2001270800A AU 7080001 A AU7080001 A AU 7080001A AU 2001270800 A1 AU2001270800 A1 AU 2001270800A1
Authority
AU
Australia
Prior art keywords
filters
relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001270800A
Inventor
Eiju Komuro
Roger W. Whatmore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cranfield University
Original Assignee
Cranfield University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cranfield University filed Critical Cranfield University
Publication of AU2001270800A1 publication Critical patent/AU2001270800A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/56—Monolithic crystal filters
    • H03H9/564—Monolithic crystal filters implemented with thin-film techniques
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AU2001270800A 2000-07-11 2001-07-11 Improvements in or relating to filters Abandoned AU2001270800A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0016861 2000-07-11
GBGB0016861.7A GB0016861D0 (en) 2000-07-11 2000-07-11 Improvements in or relating to filters
PCT/GB2001/003135 WO2002005425A1 (en) 2000-07-11 2001-07-11 Improvements in or relating to filters

Publications (1)

Publication Number Publication Date
AU2001270800A1 true AU2001270800A1 (en) 2002-01-21

Family

ID=9895324

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001270800A Abandoned AU2001270800A1 (en) 2000-07-11 2001-07-11 Improvements in or relating to filters

Country Status (7)

Country Link
US (1) US20020121337A1 (en)
EP (1) EP1299946B1 (en)
JP (1) JP2004503164A (en)
AU (1) AU2001270800A1 (en)
DE (1) DE60131745T2 (en)
GB (1) GB0016861D0 (en)
WO (1) WO2002005425A1 (en)

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US6894383B2 (en) * 2003-03-31 2005-05-17 Intel Corporation Reduced substrate micro-electro-mechanical systems (MEMS) device and system for producing the same
EP1469599B1 (en) * 2003-04-18 2010-11-03 Samsung Electronics Co., Ltd. Air gap type FBAR, duplexer using the FBAR, and fabricating methods thereof
US6924717B2 (en) * 2003-06-30 2005-08-02 Intel Corporation Tapered electrode in an acoustic resonator
KR100558439B1 (en) * 2003-09-15 2006-03-10 삼성전기주식회사 FBAR of Wafer Level Pakage and manufacturing method thereof
KR100555762B1 (en) 2003-10-07 2006-03-03 삼성전자주식회사 Air-gap type ???? fabrication method and FBAR fabricated by the same, filter and duPlexer using the FBAR.
KR100622955B1 (en) * 2004-04-06 2006-09-18 삼성전자주식회사 Film bulk acoustic resonator and the method thereof
JPWO2006001125A1 (en) 2004-06-25 2008-04-17 株式会社村田製作所 Piezoelectric device
KR100594716B1 (en) * 2004-07-27 2006-06-30 삼성전자주식회사 Cap wafer comprising cavity, semiconductor chip comprising the cap wafer, and method thereof
JP2006109400A (en) 2004-09-13 2006-04-20 Seiko Epson Corp Electronic component, circuit board, electronic apparatus, and method for manufacturing the electronic component
JP2006173557A (en) * 2004-11-22 2006-06-29 Toshiba Corp Hollow type semiconductor apparatus and its manufacture
US7248131B2 (en) * 2005-03-14 2007-07-24 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Monolithic vertical integration of an acoustic resonator and electronic circuitry
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
JP2007019132A (en) * 2005-07-06 2007-01-25 Seiko Epson Corp Method of manufacturing piezoelectric vibrating device
KR100822469B1 (en) * 2005-12-07 2008-04-16 삼성전자주식회사 System on chip structure comprising air cavity for isolating elements, duplexer and duplexer fabrication method thereof
KR101302132B1 (en) * 2006-02-06 2013-09-03 삼성전자주식회사 Filter module providing function related to multi band and method thereof
DE102006047698B4 (en) * 2006-10-09 2009-04-09 Epcos Ag Resonant bulk acoustic wave resonator
US7851333B2 (en) * 2007-03-15 2010-12-14 Infineon Technologies Ag Apparatus comprising a device and method for producing it
KR101411416B1 (en) * 2007-12-14 2014-06-26 삼성전자주식회사 Micro speaker manufacturing method and micro speaker
JP5168568B2 (en) * 2008-09-01 2013-03-21 Ｔｄｋ株式会社 Thin film bulk wave resonator
KR101708893B1 (en) * 2010-09-01 2017-03-08 삼성전자주식회사 Bulk acoustic wave resonator structure and manufacturing method thereof
US10366883B2 (en) 2014-07-30 2019-07-30 Hewlett Packard Enterprise Development Lp Hybrid multilayer device
CN104917476B (en) * 2015-05-28 2022-04-12 苏州汉天下电子有限公司 Method for manufacturing acoustic wave resonator
WO2017039674A1 (en) 2015-09-03 2017-03-09 Hewlett Packard Enterprise Development Lp Defect free heterogeneous substrates
CN106877836B (en) * 2015-12-14 2020-12-18 中芯国际集成电路制造(上海)有限公司 Film bulk acoustic resonator, manufacturing method thereof and electronic device
WO2017123245A1 (en) * 2016-01-15 2017-07-20 Hewlett Packard Enterprise Development Lp Multilayer device
WO2017171737A1 (en) 2016-03-30 2017-10-05 Hewlett Packard Enterprise Development Lp Devices having substrates with selective airgap regions
KR102444727B1 (en) 2017-12-22 2022-09-16 가부시키가이샤 무라타 세이사쿠쇼 Acoustic wave devices, high-frequency front-end circuits and communication devices
JP2019161145A (en) * 2018-03-16 2019-09-19 三菱マテリアル株式会社 Piezoelectric film
US10381801B1 (en) 2018-04-26 2019-08-13 Hewlett Packard Enterprise Development Lp Device including structure over airgap
WO2020209152A1 (en) * 2019-04-08 2020-10-15 株式会社村田製作所 Acoustic wave device and filter device comprising same
CN112039459B (en) * 2019-07-19 2024-03-08 中芯集成电路（宁波）有限公司上海分公司 Packaging method and packaging structure of bulk acoustic wave resonator
CN112039456B (en) * 2019-07-19 2024-06-28 中芯集成电路（宁波）有限公司 Packaging method and packaging structure of bulk acoustic wave resonator
CN112039455B (en) * 2019-07-19 2023-09-29 中芯集成电路（宁波）有限公司上海分公司 Packaging method and packaging structure of bulk acoustic wave resonator
CN112039458B (en) * 2019-07-19 2023-11-24 中芯集成电路（宁波）有限公司上海分公司 Packaging method and packaging structure of bulk acoustic wave resonator
CN110828950B (en) * 2019-10-18 2022-05-10 天津大学 Multiplexer

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US3453458A (en) * 1965-04-19 1969-07-01 Clevite Corp Resonator supporting structure
US5747857A (en) * 1991-03-13 1998-05-05 Matsushita Electric Industrial Co., Ltd. Electronic components having high-frequency elements and methods of manufacture therefor
US5185589A (en) * 1991-05-17 1993-02-09 Westinghouse Electric Corp. Microwave film bulk acoustic resonator and manifolded filter bank
US5448014A (en) * 1993-01-27 1995-09-05 Trw Inc. Mass simultaneous sealing and electrical connection of electronic devices
US5386142A (en) * 1993-05-07 1995-01-31 Kulite Semiconductor Products, Inc. Semiconductor structures having environmentally isolated elements and method for making the same
JPH06350371A (en) * 1993-06-10 1994-12-22 Matsushita Electric Ind Co Ltd Manufacture of piezoelectric device
US5701645A (en) * 1994-04-06 1997-12-30 Motorola, Inc. Acoustic wave device manufacturing method
US5891751A (en) * 1995-06-02 1999-04-06 Kulite Semiconductor Products, Inc . Hermetically sealed transducers and methods for producing the same
US5882465A (en) * 1997-06-18 1999-03-16 Caliper Technologies Corp. Method of manufacturing microfluidic devices
JP2000186931A (en) * 1998-12-21 2000-07-04 Murata Mfg Co Ltd Small-sized electronic component and its manufacture, and via hole forming method for the small-sized electronic component
FR2788176B1 (en) * 1998-12-30 2001-05-25 Thomson Csf GUIDED ACOUSTIC WAVE DEVICE IN A THIN LAYER OF PIEZOELECTRIC MATERIAL ADHESED BY A MOLECULAR ADHESIVE ONTO A CARRIER SUBSTRATE AND MANUFACTURING METHOD
US6182342B1 (en) * 1999-04-02 2001-02-06 Andersen Laboratories, Inc. Method of encapsulating a saw device

Also Published As

Publication number Publication date
EP1299946B1 (en) 2007-12-05
DE60131745T2 (en) 2008-04-10
JP2004503164A (en) 2004-01-29
DE60131745D1 (en) 2008-01-17
US20020121337A1 (en) 2002-09-05
EP1299946A1 (en) 2003-04-09
GB0016861D0 (en) 2000-08-30
WO2002005425A1 (en) 2002-01-17

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