DE60042914D1 - Halbleitervorrichtung und verfahren zu ihrer herstellung - Google Patents

Halbleitervorrichtung und verfahren zu ihrer herstellung

Info

Publication number
DE60042914D1
DE60042914D1 DE60042914T DE60042914T DE60042914D1 DE 60042914 D1 DE60042914 D1 DE 60042914D1 DE 60042914 T DE60042914 T DE 60042914T DE 60042914 T DE60042914 T DE 60042914T DE 60042914 D1 DE60042914 D1 DE 60042914D1
Authority
DE
Germany
Prior art keywords
production
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60042914T
Other languages
English (en)
Inventor
Masatoshi Inaba
Takanao Suzuki
Tadanori Ominato
Masahiro Kaizu
Akihito Kurosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Application granted granted Critical
Publication of DE60042914D1 publication Critical patent/DE60042914D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2924/351—Thermal stress
DE60042914T 1999-06-11 2000-06-12 Halbleitervorrichtung und verfahren zu ihrer herstellung Expired - Lifetime DE60042914D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16609099 1999-06-11
PCT/JP2000/003804 WO2000077843A1 (en) 1999-06-11 2000-06-12 Semiconductor package, semiconductor device, electronic device and production method for semiconductor package

Publications (1)

Publication Number Publication Date
DE60042914D1 true DE60042914D1 (de) 2009-10-22

Family

ID=15824818

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60042914T Expired - Lifetime DE60042914D1 (de) 1999-06-11 2000-06-12 Halbleitervorrichtung und verfahren zu ihrer herstellung

Country Status (7)

Country Link
US (1) US6387734B1 (de)
EP (1) EP1107306B1 (de)
JP (1) JP3651596B2 (de)
AU (1) AU5109000A (de)
CA (1) CA2340108C (de)
DE (1) DE60042914D1 (de)
WO (1) WO2000077843A1 (de)

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JP3651596B2 (ja) 2005-05-25
EP1107306B1 (de) 2009-09-09
CA2340108C (en) 2005-03-29
US6387734B1 (en) 2002-05-14
EP1107306A4 (de) 2008-02-27

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