DE3687952D1 - Halbleiterbauelement mit ueberhitzungsschutzmittel. - Google Patents

Halbleiterbauelement mit ueberhitzungsschutzmittel.

Info

Publication number
DE3687952D1
DE3687952D1 DE8686116560T DE3687952T DE3687952D1 DE 3687952 D1 DE3687952 D1 DE 3687952D1 DE 8686116560 T DE8686116560 T DE 8686116560T DE 3687952 T DE3687952 T DE 3687952T DE 3687952 D1 DE3687952 D1 DE 3687952D1
Authority
DE
Germany
Prior art keywords
semiconductor component
overheating protector
overheating
protector
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686116560T
Other languages
English (en)
Other versions
DE3687952T2 (de
Inventor
Yukio Tsuzuki
Masami Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of DE3687952D1 publication Critical patent/DE3687952D1/de
Application granted granted Critical
Publication of DE3687952T2 publication Critical patent/DE3687952T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7804Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7808Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE86116560T 1985-11-29 1986-11-28 Halbleiterbauelement mit Überhitzungsschutzmittel. Expired - Lifetime DE3687952T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27014185 1985-11-29

Publications (2)

Publication Number Publication Date
DE3687952D1 true DE3687952D1 (de) 1993-04-15
DE3687952T2 DE3687952T2 (de) 1993-09-30

Family

ID=17482115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86116560T Expired - Lifetime DE3687952T2 (de) 1985-11-29 1986-11-28 Halbleiterbauelement mit Überhitzungsschutzmittel.

Country Status (4)

Country Link
US (2) US4760434A (de)
EP (1) EP0224274B1 (de)
JP (1) JPH0693485B2 (de)
DE (1) DE3687952T2 (de)

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JPS57113332A (en) * 1980-12-30 1982-07-14 Horiba Ltd Compensating thermopile detector
JPS57141962A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Semiconductor integrated circuit device
JPS57145355A (en) * 1981-03-04 1982-09-08 Nippon Denso Co Ltd Semiconductor device
DE3138535A1 (de) * 1981-09-28 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Temperatursensor mit einem halbleiterkoerper
JPS5884461A (ja) * 1981-11-13 1983-05-20 Hitachi Ltd 絶縁ゲ−ト型半導体装置
JPS58138074A (ja) * 1982-02-12 1983-08-16 Toshiba Corp 入力保護回路
JPS59163528A (ja) * 1983-03-09 1984-09-14 Seiko Epson Corp 温度検出回路
JPS59224172A (ja) * 1983-06-03 1984-12-17 Hitachi Ltd 半導体回路装置における破壊防止回路
JPS6072254A (ja) * 1983-09-28 1985-04-24 Matsushita Electric Ind Co Ltd 半導体装置
DE3532228A1 (de) * 1984-10-02 1986-04-17 Toshiba Ceramics Co., Ltd., Tokio/Tokyo Feuerfeste zusammensetzung
JPH05272183A (ja) * 1992-03-24 1993-10-19 Naka Ind Ltd パネル壁面の構造

Also Published As

Publication number Publication date
EP0224274B1 (de) 1993-03-10
US4896199A (en) 1990-01-23
EP0224274A3 (en) 1990-01-17
JPS62229866A (ja) 1987-10-08
JPH0693485B2 (ja) 1994-11-16
EP0224274A2 (de) 1987-06-03
DE3687952T2 (de) 1993-09-30
US4760434A (en) 1988-07-26

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