DE3681799D1 - Halbleiter-bearbeitungseinrichtung. - Google Patents

Halbleiter-bearbeitungseinrichtung.

Info

Publication number
DE3681799D1
DE3681799D1 DE8686300282T DE3681799T DE3681799D1 DE 3681799 D1 DE3681799 D1 DE 3681799D1 DE 8686300282 T DE8686300282 T DE 8686300282T DE 3681799 T DE3681799 T DE 3681799T DE 3681799 D1 DE3681799 D1 DE 3681799D1
Authority
DE
Germany
Prior art keywords
machining device
semiconductor machining
semiconductor
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686300282T
Other languages
English (en)
Inventor
Dan Maydan
Sasson R Somekh
Charles Ryan-Harris
Richard A Seilheimer
David Cheng
Edward M Abolnikov
Lance S Reinke
J Christopher Moran
Richard M Catlin
Robert B Lowrence
George W Ridgeway
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE3681799D1 publication Critical patent/DE3681799D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/13—Handlers utilizing parallel links
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
DE8686300282T 1985-01-22 1986-01-16 Halbleiter-bearbeitungseinrichtung. Expired - Lifetime DE3681799D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69372285A 1985-01-22 1985-01-22

Publications (1)

Publication Number Publication Date
DE3681799D1 true DE3681799D1 (de) 1991-11-14

Family

ID=24785830

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686300282T Expired - Lifetime DE3681799D1 (de) 1985-01-22 1986-01-16 Halbleiter-bearbeitungseinrichtung.

Country Status (4)

Country Link
US (1) US4911597A (de)
EP (1) EP0189279B1 (de)
JP (1) JPH0828411B2 (de)
DE (1) DE3681799D1 (de)

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US5898588A (en) * 1995-10-27 1999-04-27 Dainippon Screen Mfg. Co. Method and apparatus for controlling substrate processing apparatus
US5769184A (en) * 1996-09-27 1998-06-23 Brooks Automation, Inc. Coaxial drive elevator
US6024393A (en) * 1996-11-04 2000-02-15 Applied Materials, Inc. Robot blade for handling of semiconductor substrate
US6197117B1 (en) 1997-07-23 2001-03-06 Applied Materials, Inc. Wafer out-of-pocket detector and susceptor leveling tool
US6099596A (en) 1997-07-23 2000-08-08 Applied Materials, Inc. Wafer out-of-pocket detection tool
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
US6328858B1 (en) 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
US6318953B1 (en) * 1999-07-12 2001-11-20 Asyst Technologies, Inc. SMIF-compatible open cassette enclosure
US6184132B1 (en) * 1999-08-03 2001-02-06 International Business Machines Corporation Integrated cobalt silicide process for semiconductor devices
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FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes
US6622286B1 (en) * 2000-06-30 2003-09-16 Lam Research Corporation Integrated electronic hardware for wafer processing control and diagnostic
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
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DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US20040100110A1 (en) * 2002-11-26 2004-05-27 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20070196011A1 (en) * 2004-11-22 2007-08-23 Cox Damon K Integrated vacuum metrology for cluster tool
JP4580845B2 (ja) * 2005-08-24 2010-11-17 パナソニック株式会社 タスク実行装置
US20070187386A1 (en) * 2006-02-10 2007-08-16 Poongsan Microtec Corporation Methods and apparatuses for high pressure gas annealing
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
JP2009022916A (ja) * 2007-07-23 2009-02-05 Covalent Materials Corp 減圧装置
KR101012045B1 (ko) 2007-07-23 2011-01-31 코바렌트 마테리얼 가부시키가이샤 감압 장치 및 이것에 이용하는 무기 재료질 다공체
JP5084608B2 (ja) * 2008-05-27 2012-11-28 コバレントマテリアル株式会社 減圧排気弁
JP5219206B2 (ja) * 2008-11-04 2013-06-26 コバレントマテリアル株式会社 減圧排気弁
EP2415074B1 (de) * 2009-03-30 2018-10-24 ATS Automation Tooling Systems Inc. Systeme und verfahren zur handhabung von wafern
US8459625B1 (en) * 2009-03-31 2013-06-11 Honda Motor Co., Ltd. Device for securing vehicle body to conveyor carrier
JP6511858B2 (ja) 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 搬送室
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
US10895011B2 (en) * 2017-03-14 2021-01-19 Eastman Kodak Company Modular thin film deposition system
PL3422396T3 (pl) 2017-06-28 2021-12-13 Meyer Burger (Germany) Gmbh Urządzenie do transportu substratu, urządzenie do obróbki z płytą mieszczącą dostosowaną do nośnika substratu takiego urządzenia oraz sposób przetwarzania substratu za pomocą takiego urządzenia do transportu substratu oraz układ do obróbki
EP3864691A1 (de) * 2018-10-10 2021-08-18 Evatec AG Vakuumbehandlungsvorrichtung und verfahren zur vakuumbehandlung von substraten
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Also Published As

Publication number Publication date
EP0189279A3 (en) 1987-07-01
JPS61228648A (ja) 1986-10-11
JPH0828411B2 (ja) 1996-03-21
US4911597A (en) 1990-03-27
EP0189279B1 (de) 1991-10-09
EP0189279A2 (de) 1986-07-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee