DE3687952T2 - Halbleiterbauelement mit Überhitzungsschutzmittel. - Google Patents

Halbleiterbauelement mit Überhitzungsschutzmittel.

Info

Publication number
DE3687952T2
DE3687952T2 DE86116560T DE3687952T DE3687952T2 DE 3687952 T2 DE3687952 T2 DE 3687952T2 DE 86116560 T DE86116560 T DE 86116560T DE 3687952 T DE3687952 T DE 3687952T DE 3687952 T2 DE3687952 T2 DE 3687952T2
Authority
DE
Germany
Prior art keywords
semiconductor component
overheating protection
overheating
protection
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE86116560T
Other languages
English (en)
Other versions
DE3687952D1 (de
Inventor
Yukio Tsuzuki
Masami Yamaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of DE3687952D1 publication Critical patent/DE3687952D1/de
Application granted granted Critical
Publication of DE3687952T2 publication Critical patent/DE3687952T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7804Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7808Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE86116560T 1985-11-29 1986-11-28 Halbleiterbauelement mit Überhitzungsschutzmittel. Expired - Lifetime DE3687952T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27014185 1985-11-29

Publications (2)

Publication Number Publication Date
DE3687952D1 DE3687952D1 (de) 1993-04-15
DE3687952T2 true DE3687952T2 (de) 1993-09-30

Family

ID=17482115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE86116560T Expired - Lifetime DE3687952T2 (de) 1985-11-29 1986-11-28 Halbleiterbauelement mit Überhitzungsschutzmittel.

Country Status (4)

Country Link
US (2) US4760434A (de)
EP (1) EP0224274B1 (de)
JP (1) JPH0693485B2 (de)
DE (1) DE3687952T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010002754B4 (de) 2009-06-29 2022-10-27 Denso Corporation Halbleitervorrichtung

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746604B2 (ja) 1997-12-09 2006-02-15 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US5136348A (en) * 1986-10-08 1992-08-04 Nippondenso Co., Ltd. Structure and manufacturing method for thin-film semiconductor diode device
US4896196A (en) * 1986-11-12 1990-01-23 Siliconix Incorporated Vertical DMOS power transistor with an integral operating condition sensor
US4920388A (en) * 1987-02-17 1990-04-24 Siliconix Incorporated Power transistor with integrated gate resistor
US5241210A (en) * 1987-02-26 1993-08-31 Kabushiki Kaisha Toshiba High breakdown voltage semiconductor device
US4893158A (en) * 1987-06-22 1990-01-09 Nissan Motor Co., Ltd. MOSFET device
JP2521783B2 (ja) * 1987-09-28 1996-08-07 三菱電機株式会社 半導体装置およびその製造方法
DE3844958C2 (de) * 1987-09-28 1999-04-22 Mitsubishi Electric Corp Integrierte Halbleiteranordnung mit Überlastschutz
EP0322860B1 (de) * 1987-12-28 1996-09-11 Fuji Electric Co., Ltd. Halbleiteranordnung mit isoliertem Gate
US5049961A (en) * 1989-01-10 1991-09-17 Ixys Corporation Monolithic temperature sensing device
US5119162A (en) * 1989-02-10 1992-06-02 Texas Instruments Incorporated Integrated power DMOS circuit with protection diode
US5173755A (en) * 1989-05-12 1992-12-22 Western Digital Corporation Capacitively induced electrostatic discharge protection circuit
US5128823A (en) * 1989-06-14 1992-07-07 Nippondenso Co., Ltd. Power semiconductor apparatus
US5025298A (en) * 1989-08-22 1991-06-18 Motorola, Inc. Semiconductor structure with closely coupled substrate temperature sense element
US5100829A (en) * 1989-08-22 1992-03-31 Motorola, Inc. Process for forming a semiconductor structure with closely coupled substrate temperature sense element
FR2655196B1 (fr) * 1989-11-29 1992-04-10 Sgs Thomson Microelectronics Circuit d'isolation dynamique de circuits integres.
JPH03238868A (ja) * 1990-02-15 1991-10-24 Nec Corp 縦型電界効果トランジスタ
US5237194A (en) * 1990-04-27 1993-08-17 Nec Corporation Power semiconductor device
JPH0496267A (ja) * 1990-08-03 1992-03-27 Sharp Corp 半導体集積回路
US5444219A (en) * 1990-09-24 1995-08-22 U.S. Philips Corporation Temperature sensing device and a temperature sensing circuit using such a device
US5798550A (en) * 1990-10-01 1998-08-25 Nippondenso Co. Ltd. Vertical type semiconductor device and gate structure
JP2751612B2 (ja) * 1990-10-01 1998-05-18 株式会社デンソー 縦型パワートランジスタ及びその製造方法
US5079608A (en) * 1990-11-06 1992-01-07 Harris Corporation Power MOSFET transistor circuit with active clamp
US5206778A (en) * 1991-05-16 1993-04-27 International Business Machines Corporation Sense circuit for on-chip thermal shutdown
DE4122653C2 (de) * 1991-07-09 1996-04-11 Daimler Benz Ag Steuerbare Halbleiterschalteinrichtung mit integrierter Strombegrenzung und Übertemperaturabschaltung
US5250834A (en) * 1991-09-19 1993-10-05 International Business Machines Corporation Silicide interconnection with schottky barrier diode isolation
US5266831A (en) * 1991-11-12 1993-11-30 Motorola, Inc. Edge termination structure
JP3337079B2 (ja) * 1991-11-26 2002-10-21 ローム株式会社 電源回路
US5304837A (en) * 1992-01-08 1994-04-19 Siemens Aktiengesellschaft Monolithically integrated temperature sensor for power semiconductor components
US5401997A (en) * 1992-01-22 1995-03-28 Integrated Device Technology, Inc. ESD protection for poly resistor on oxide
JP3168763B2 (ja) * 1992-03-30 2001-05-21 株式会社デンソー 半導体装置及びその製造方法
JP3216206B2 (ja) * 1992-03-30 2001-10-09 株式会社デンソー 半導体装置及びその製造方法
JP3031059B2 (ja) * 1992-05-15 2000-04-10 日産自動車株式会社 負荷短絡保護機能付きmos形パワー素子
GB9215654D0 (en) * 1992-07-23 1992-09-09 Philips Electronics Uk Ltd A semiconductor component
US5461252A (en) * 1992-10-06 1995-10-24 Matsushita Electric Industrial Co., Ltd. Semiconductor device comprising an over-temperature detection element for detecting excessive temperature of amplifiers
DE4236334A1 (de) * 1992-10-28 1994-05-05 Bosch Gmbh Robert Monolithisch integriertes MOS-Endstufenbauteil mit einer Überlast-Schutzeinrichtung
DE4236333A1 (de) * 1992-10-28 1994-05-05 Bosch Gmbh Robert Monolithich integriertes MOS-Endstufenbauteil mit einer Übertemperatur-Schutzeinrichtung
JP2956434B2 (ja) * 1992-10-30 1999-10-04 株式会社デンソー 絶縁分離形半導体装置
US5633526A (en) * 1992-11-01 1997-05-27 Rohm Co., Ltd. Photodiode array and method for manufacturing the same
DE4305038C2 (de) * 1993-02-18 1998-02-05 Siemens Ag MOSFET mit Temperaturschutz
GB9313651D0 (en) * 1993-07-01 1993-08-18 Philips Electronics Uk Ltd A semiconductor device
JP3982842B2 (ja) * 1993-08-18 2007-09-26 株式会社ルネサステクノロジ 半導体装置
JP3125529B2 (ja) * 1993-08-23 2001-01-22 富士電機株式会社 半導体装置
US5497285A (en) * 1993-09-14 1996-03-05 International Rectifier Corporation Power MOSFET with overcurrent and over-temperature protection
US5548205A (en) * 1993-11-24 1996-08-20 National Semiconductor Corporation Method and circuit for control of saturation current in voltage regulators
JPH07161920A (ja) * 1993-12-08 1995-06-23 Nec Corp 半導体集積回路
JP2630242B2 (ja) * 1993-12-28 1997-07-16 日本電気株式会社 温度検出用ダイオード付パワーmosfet
US6092927A (en) * 1994-11-10 2000-07-25 International Rectifier Corp. Temperature detection of power semiconductors performed by a co-packaged analog integrated circuit
US5639163A (en) * 1994-11-14 1997-06-17 International Business Machines Corporation On-chip temperature sensing system
US5517053A (en) * 1995-01-09 1996-05-14 Northrop Grumman Corporation Self stabilizing heater controlled oscillating transistor
GB9513420D0 (en) * 1995-06-30 1995-09-06 Philips Electronics Uk Ltd Power semiconductor devices
DE19534604C1 (de) * 1995-09-18 1996-10-24 Siemens Ag Durch Feldeffekt steuerbares Halbleiterbauelement mit mehreren Temperatursensoren zum Schutz vor Überlastung
EP0773588B1 (de) * 1995-11-10 2002-06-19 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe Integriertes MOS-Bauelement mit einer Gateschutzdiode
JPH09213956A (ja) * 1996-02-07 1997-08-15 Nec Kansai Ltd 半導体装置及びその製造方法
US5949121A (en) * 1996-08-02 1999-09-07 Motorola Inc. Temperature-indicating field effect transistor
JP3521648B2 (ja) * 1996-09-30 2004-04-19 株式会社デンソー 半導体装置の製造方法
US5838187A (en) * 1997-02-10 1998-11-17 Lucent Technologies Inc. Integrated circuit thermal shutdown system utilizing a thermal sensor
SG55452A1 (en) * 1997-02-12 1998-12-21 Int Rectifier Corp Method and circuit to sense the tj of mos-gated power semi conductor devices
US5716880A (en) * 1997-02-20 1998-02-10 Chartered Semiconductor Manufacturing Pte Ltd. Method for forming vertical polysilicon diode compatible with CMOS/BICMOS formation
JP3752796B2 (ja) * 1997-03-26 2006-03-08 日産自動車株式会社 温度検知回路
US6088208A (en) * 1997-03-31 2000-07-11 Matsushita Electronics Corporation Electronic device, electronic switching apparatus including the same, and production method thereof
DE19727229C1 (de) * 1997-06-26 1998-07-23 Siemens Ag Schaltungsanordnung zum Erfassen des Überschreitens einer kritischen Temperatur eines Bauelements
US6268242B1 (en) 1997-12-31 2001-07-31 Richard K. Williams Method of forming vertical mosfet device having voltage clamped gate and self-aligned contact
US6172383B1 (en) 1997-12-31 2001-01-09 Siliconix Incorporated Power MOSFET having voltage-clamped gate
US6015993A (en) * 1998-08-31 2000-01-18 International Business Machines Corporation Semiconductor diode with depleted polysilicon gate structure and method
US6203191B1 (en) 1998-10-28 2001-03-20 Speculative Incorporated Method of junction temperature determination and control utilizing heat flow
JP2000286391A (ja) * 1999-03-31 2000-10-13 Fuji Electric Co Ltd レベルシフタ
JP3650281B2 (ja) * 1999-05-07 2005-05-18 セイコーインスツル株式会社 半導体装置
US6137165A (en) * 1999-06-25 2000-10-24 International Rectifier Corp. Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET
JP3926975B2 (ja) 1999-09-22 2007-06-06 株式会社東芝 スタック型mosトランジスタ保護回路
US6329690B1 (en) * 1999-10-22 2001-12-11 International Business Machines Corporation Method and apparatus to match semiconductor device performance
US6642577B2 (en) * 2000-03-16 2003-11-04 Denso Corporation Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same
JP2002050640A (ja) * 2000-05-22 2002-02-15 Sony Corp 電界効果トランジスタの保護回路及び半導体装置
JP3482948B2 (ja) 2000-07-25 2004-01-06 株式会社デンソー 半導体装置
JP2002208702A (ja) * 2001-01-10 2002-07-26 Mitsubishi Electric Corp パワー半導体装置
JP4620889B2 (ja) * 2001-03-22 2011-01-26 三菱電機株式会社 電力用半導体装置
JP2002313924A (ja) * 2001-04-09 2002-10-25 Seiko Instruments Inc 半導体装置
US6633063B2 (en) * 2001-05-04 2003-10-14 Semiconductor Components Industries Llc Low voltage transient voltage suppressor and method of making
US6906399B2 (en) * 2002-11-04 2005-06-14 Delphi Technologies, Inc. Integrated circuit including semiconductor power device and electrically isolated thermal sensor
EP1424766A1 (de) * 2002-11-29 2004-06-02 STMicroelectronics S.r.l. Spannungschaltregler
US20040150417A1 (en) * 2003-01-30 2004-08-05 Paulos John James Integrated circuit with junction temperature sensing diode
US6841437B1 (en) * 2003-06-20 2005-01-11 Semiconductor Components Industries, L.L.C. Method of forming a vertical power semiconductor device and structure therefor
US7310213B2 (en) * 2003-09-26 2007-12-18 Matsushita Electric Industrial Co., Ltd. Semiconductor device provided with overheat protection circuit and electronic circuit using the same
JP2005167075A (ja) * 2003-12-04 2005-06-23 Denso Corp 半導体装置
JP4765252B2 (ja) * 2004-01-13 2011-09-07 株式会社豊田自動織機 温度検出機能付き半導体装置
DE102005016830A1 (de) * 2004-04-14 2005-11-03 Denso Corp., Kariya Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US7406397B2 (en) * 2004-09-02 2008-07-29 International Business Machines Corporation Self heating monitor for SiGe and SOI CMOS devices
JP4641164B2 (ja) * 2004-09-14 2011-03-02 ルネサスエレクトロニクス株式会社 過熱検出回路
US20060066335A1 (en) * 2004-09-28 2006-03-30 Kang Seung H Semiconductor test device with heating circuit
WO2006068082A1 (ja) * 2004-12-22 2006-06-29 Mitsubishi Denki Kabushiki Kaisha 半導体装置
WO2007006337A1 (en) * 2005-07-13 2007-01-18 Freescale Semiconductor, Inc. A temperature sensing device
JP2007049012A (ja) * 2005-08-11 2007-02-22 Nec Electronics Corp 半導体装置
CN100449901C (zh) * 2005-09-22 2009-01-07 华为技术有限公司 一种防止设备内部燃烧向外蔓延的装置
DE102006013721B4 (de) * 2006-03-24 2011-12-08 Infineon Technologies Ag Halbleiterschaltungsanordnung und zugehöriges Verfahren zur Temperaturerfassung
JP5098214B2 (ja) 2006-04-28 2012-12-12 日産自動車株式会社 半導体装置およびその製造方法
US20080026181A1 (en) * 2006-07-25 2008-01-31 Ravi Rastogi Synergistically-modified surfaces and surface profiles for use with thermal interconnect and interface materials, methods of production and uses thereof
US8476709B2 (en) * 2006-08-24 2013-07-02 Infineon Technologies Ag ESD protection device and method
JP2008244487A (ja) * 2008-04-21 2008-10-09 Renesas Technology Corp 複合型mosfet
TWI381604B (zh) * 2009-05-25 2013-01-01 Pegatron Corp 具有加熱保護電路的電子裝置及其加熱保護方法
ITMI20121599A1 (it) 2012-09-25 2014-03-26 St Microelectronics Srl Dispositivo elettronico comprendente un transistore vtmos ed un diodo termico integrati
US9966584B2 (en) 2013-03-11 2018-05-08 Atieva, Inc. Bus bar for battery packs
US9041454B2 (en) * 2013-03-15 2015-05-26 Atieva, Inc. Bias circuit for a switched capacitor level shifter
US10063071B2 (en) 2013-03-15 2018-08-28 Atieva, Inc. Balance resistor and low pass filter
US10901019B2 (en) 2013-03-15 2021-01-26 Atieva, Inc. Method of connecting cell voltage sensors
US10084214B2 (en) 2013-03-15 2018-09-25 Atieva, Inc. Automatic switchover from cell voltage to interconnect voltage monitoring
DE112014001811T5 (de) * 2013-04-05 2015-12-17 Fuji Electric Co., Ltd. Halbleitervorrichtungs-Ansteuerverfahren
US9048838B2 (en) 2013-10-30 2015-06-02 Infineon Technologies Austria Ag Switching circuit
US9525063B2 (en) 2013-10-30 2016-12-20 Infineon Technologies Austria Ag Switching circuit
US20150116882A1 (en) * 2013-10-31 2015-04-30 Analog Devices, Inc. Apparatus and method for time-delayed thermal overload protection
JP6345930B2 (ja) * 2013-12-26 2018-06-20 ローム株式会社 半導体装置およびその設計方法
DE102014109147A1 (de) * 2014-06-30 2015-12-31 Infineon Technologies Ag Feldeffekthalbleiter-Bauelement sowie Verfahren zu dessen Betrieb und Herstellung
US9768766B2 (en) 2014-07-14 2017-09-19 Infineon Technologies Austria Ag Electronic switching element and integrated sensor
JP6436791B2 (ja) * 2015-01-16 2018-12-12 エイブリック株式会社 半導体装置
US9917578B2 (en) * 2016-02-19 2018-03-13 Infineon Technologies Austria Ag Active gate-source capacitance clamp for normally-off HEMT
US10411006B2 (en) * 2016-05-09 2019-09-10 Infineon Technologies Ag Poly silicon based interface protection
JP6414159B2 (ja) * 2016-07-29 2018-10-31 トヨタ自動車株式会社 半導体装置およびその製造方法
TWI655748B (zh) * 2016-12-16 2019-04-01 通嘉科技股份有限公司 具有熱敏單元的垂直雙擴散金氧半功率元件
JP6922563B2 (ja) * 2017-08-31 2021-08-18 富士電機株式会社 半導体装置
CN108109999A (zh) * 2018-01-16 2018-06-01 上海南麟电子股份有限公司 过温保护电路、半导体器件及其制备方法
JP7135445B2 (ja) * 2018-05-29 2022-09-13 富士電機株式会社 半導体装置
US11579645B2 (en) * 2019-06-21 2023-02-14 Wolfspeed, Inc. Device design for short-circuitry protection circuitry within transistors
US11621206B2 (en) 2020-08-05 2023-04-04 Nxp Usa, Inc. Amplifier with integrated temperature sensor
JP2023032984A (ja) * 2021-08-27 2023-03-09 富士電機株式会社 半導体モジュール

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272183A (en) * 1975-12-12 1977-06-16 Mitsubishi Electric Corp Semiconductor device with protecting device
JPS5359385A (en) * 1976-11-09 1978-05-29 Mitsubishi Electric Corp Production method of semiconductor thermal sensitive element
US4229753A (en) * 1977-08-18 1980-10-21 International Business Machines Corporation Voltage compensation of temperature coefficient of resistance in an integrated circuit resistor
US4198581A (en) * 1977-10-13 1980-04-15 Rca Corporation Temperature compensating comparator
IT1202895B (it) * 1979-02-27 1989-02-15 Ates Componenti Elettron Dispositivo di protezione termica per un componente elettronico a semiconduttore
JPS55140261A (en) * 1979-04-19 1980-11-01 Chiyou Lsi Gijutsu Kenkyu Kumiai Substrate potential generator
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
JPS5913445B2 (ja) * 1980-02-22 1984-03-29 工業技術院長 ホウ酸カルシウムの製造方法
JPS56120153A (en) * 1980-02-28 1981-09-21 Seiko Epson Corp Temperature protector for integrated circuit
JPS5740977A (en) * 1980-08-25 1982-03-06 Nippon Denso Co Ltd Semiconductor device
JPS57113332A (en) * 1980-12-30 1982-07-14 Horiba Ltd Compensating thermopile detector
JPS57141962A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Semiconductor integrated circuit device
JPS57145355A (en) * 1981-03-04 1982-09-08 Nippon Denso Co Ltd Semiconductor device
DE3138535A1 (de) * 1981-09-28 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Temperatursensor mit einem halbleiterkoerper
JPS5884461A (ja) * 1981-11-13 1983-05-20 Hitachi Ltd 絶縁ゲ−ト型半導体装置
JPS58138074A (ja) * 1982-02-12 1983-08-16 Toshiba Corp 入力保護回路
JPS59163528A (ja) * 1983-03-09 1984-09-14 Seiko Epson Corp 温度検出回路
JPS59224172A (ja) * 1983-06-03 1984-12-17 Hitachi Ltd 半導体回路装置における破壊防止回路
JPS6072254A (ja) * 1983-09-28 1985-04-24 Matsushita Electric Ind Co Ltd 半導体装置
DE3532228A1 (de) * 1984-10-02 1986-04-17 Toshiba Ceramics Co., Ltd., Tokio/Tokyo Feuerfeste zusammensetzung
JPH05272183A (ja) * 1992-03-24 1993-10-19 Naka Ind Ltd パネル壁面の構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010002754B4 (de) 2009-06-29 2022-10-27 Denso Corporation Halbleitervorrichtung

Also Published As

Publication number Publication date
EP0224274B1 (de) 1993-03-10
DE3687952D1 (de) 1993-04-15
US4760434A (en) 1988-07-26
US4896199A (en) 1990-01-23
EP0224274A3 (en) 1990-01-17
JPS62229866A (ja) 1987-10-08
JPH0693485B2 (ja) 1994-11-16
EP0224274A2 (de) 1987-06-03

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