DE3855533T2 - Halbleiteranordnung mit isoliertem Gate - Google Patents

Halbleiteranordnung mit isoliertem Gate

Info

Publication number
DE3855533T2
DE3855533T2 DE3855533T DE3855533T DE3855533T2 DE 3855533 T2 DE3855533 T2 DE 3855533T2 DE 3855533 T DE3855533 T DE 3855533T DE 3855533 T DE3855533 T DE 3855533T DE 3855533 T2 DE3855533 T2 DE 3855533T2
Authority
DE
Germany
Prior art keywords
semiconductor device
insulated gate
gate semiconductor
insulated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3855533T
Other languages
English (en)
Other versions
DE3855533D1 (de
Inventor
Tatsuhiko C O Fuji El Fujihira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1987199984U external-priority patent/JPH01104052U/ja
Priority claimed from JP63110105A external-priority patent/JPH07105495B2/ja
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of DE3855533D1 publication Critical patent/DE3855533D1/de
Publication of DE3855533T2 publication Critical patent/DE3855533T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7804Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7806Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a Schottky barrier diode
DE3855533T 1987-12-28 1988-12-27 Halbleiteranordnung mit isoliertem Gate Expired - Fee Related DE3855533T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1987199984U JPH01104052U (de) 1987-12-28 1987-12-28
JP63110105A JPH07105495B2 (ja) 1988-05-06 1988-05-06 絶縁ゲート型半導体装置

Publications (2)

Publication Number Publication Date
DE3855533D1 DE3855533D1 (de) 1996-10-17
DE3855533T2 true DE3855533T2 (de) 1997-01-23

Family

ID=26449783

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3855533T Expired - Fee Related DE3855533T2 (de) 1987-12-28 1988-12-27 Halbleiteranordnung mit isoliertem Gate

Country Status (4)

Country Link
US (1) US5012313A (de)
EP (1) EP0322860B1 (de)
KR (1) KR910009041B1 (de)
DE (1) DE3855533T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185069A (ja) * 1988-12-02 1990-07-19 Motorola Inc 高エネルギー阻止能力及び温度補償された阻止電圧を具備する半導体デバイス
JPH03238868A (ja) * 1990-02-15 1991-10-24 Nec Corp 縦型電界効果トランジスタ
US5536958A (en) * 1995-05-02 1996-07-16 Motorola, Inc. Semiconductor device having high voltage protection capability
KR19990024644A (ko) * 1997-09-04 1999-04-06 윤종용 정전기 파괴 현상을 방지하는 트랜지스터 접속 구조
USRE39556E1 (en) * 1997-11-20 2007-04-10 Relion, Inc. Fuel cell and method for controlling same
DE69930715T2 (de) * 1999-01-25 2007-03-29 Stmicroelectronics S.R.L., Agrate Brianza Elektronische Halbleiterleistung mit integrierter Diode
JP4917709B2 (ja) * 2000-03-06 2012-04-18 ローム株式会社 半導体装置
JP2002208702A (ja) * 2001-01-10 2002-07-26 Mitsubishi Electric Corp パワー半導体装置
JP5511124B2 (ja) * 2006-09-28 2014-06-04 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置
JP2008085188A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 絶縁ゲート型半導体装置
JP5337470B2 (ja) * 2008-04-21 2013-11-06 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3728591A (en) * 1971-09-03 1973-04-17 Rca Corp Gate protective device for insulated gate field-effect transistors
US3964084A (en) * 1974-06-12 1976-06-15 Bell Telephone Laboratories, Incorporated Schottky barrier diode contacts
US3987216A (en) * 1975-12-31 1976-10-19 International Business Machines Corporation Method of forming schottky barrier junctions having improved barrier height
JPS5591173A (en) * 1978-12-28 1980-07-10 Mitsubishi Electric Corp Semiconductor integrated circuit device
FR2490860B1 (fr) * 1980-09-24 1986-11-28 Nippon Telegraph & Telephone Dispositif semi-conducteur de memorisation programmable a lecture seule, de type a jonction en court-circuit
JPS57141962A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Semiconductor integrated circuit device
NL8103376A (nl) * 1981-07-16 1983-02-16 Philips Nv Weergeefinrichting.
JPS5825264A (ja) * 1981-08-07 1983-02-15 Hitachi Ltd 絶縁ゲート型半導体装置
JPS5884461A (ja) * 1981-11-13 1983-05-20 Hitachi Ltd 絶縁ゲ−ト型半導体装置
JPS5887873A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 絶縁ゲ−ト形半導体装置
JPS59161836A (ja) * 1983-03-04 1984-09-12 Sanyo Electric Co Ltd 半導体装置
JPS61292965A (ja) * 1985-06-21 1986-12-23 Hitachi Ltd 半導体集積回路装置
JPH0693485B2 (ja) * 1985-11-29 1994-11-16 日本電装株式会社 半導体装置
US4709253A (en) * 1986-05-02 1987-11-24 Amp Incorporated Surface mountable diode

Also Published As

Publication number Publication date
EP0322860A3 (de) 1990-10-17
EP0322860B1 (de) 1996-09-11
KR910009041B1 (ko) 1991-10-28
KR890011117A (ko) 1989-08-12
US5012313A (en) 1991-04-30
EP0322860A2 (de) 1989-07-05
DE3855533D1 (de) 1996-10-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee