KR850006779A - 반도체 장치 - Google Patents

반도체 장치

Info

Publication number
KR850006779A
KR850006779A KR1019850001407A KR850001407A KR850006779A KR 850006779 A KR850006779 A KR 850006779A KR 1019850001407 A KR1019850001407 A KR 1019850001407A KR 850001407 A KR850001407 A KR 850001407A KR 850006779 A KR850006779 A KR 850006779A
Authority
KR
South Korea
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
KR1019850001407A
Other languages
English (en)
Other versions
KR900008206B1 (ko
Inventor
시게유끼 야마무라
Original Assignee
후지쓰가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰가부시끼가이샤 filed Critical 후지쓰가부시끼가이샤
Publication of KR850006779A publication Critical patent/KR850006779A/ko
Application granted granted Critical
Publication of KR900008206B1 publication Critical patent/KR900008206B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
KR1019850001407A 1984-03-06 1985-03-06 반도체 장치 KR900008206B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP42605 1984-03-06
JP59042605A JPS60210853A (ja) 1984-03-06 1984-03-06 半導体装置

Publications (2)

Publication Number Publication Date
KR850006779A true KR850006779A (ko) 1985-10-16
KR900008206B1 KR900008206B1 (ko) 1990-11-05

Family

ID=12640670

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850001407A KR900008206B1 (ko) 1984-03-06 1985-03-06 반도체 장치

Country Status (5)

Country Link
US (1) US4713634A (ko)
EP (1) EP0157505B1 (ko)
JP (1) JPS60210853A (ko)
KR (1) KR900008206B1 (ko)
DE (1) DE3584301D1 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922325A (en) * 1987-10-02 1990-05-01 American Telephone And Telegraph Company Multilayer ceramic package with high frequency connections
US5075867A (en) * 1988-12-23 1991-12-24 Bull Hn Information Systems Inc. Method for limiting spurious resonant cavity effects in electronic equipment
EP0380914B1 (en) * 1989-01-09 1994-05-04 Mitsubishi Denki Kabushiki Kaisha Antenna system
US5136271A (en) * 1989-01-09 1992-08-04 Mitsubishi Denki Kabushiki Kaisha Microwave integrated circuit mountings
US4972043A (en) * 1989-01-30 1990-11-20 Ixys Corporation Multi-lead hermetic power package with high packing density
FR2644631B1 (fr) * 1989-03-17 1991-05-31 Labo Electronique Physique Boitier pour circuit integre hyperfrequences
US5109594A (en) * 1990-11-01 1992-05-05 Explosive Fabricators, Inc. Method of making a sealed transition joint
JP2888005B2 (ja) * 1992-01-24 1999-05-10 住友電気工業株式会社 マイクロ波デバイス用パッケージ
US5376909A (en) * 1992-05-29 1994-12-27 Texas Instruments Incorporated Device packaging
US5389904A (en) * 1992-09-11 1995-02-14 Industrial Technology Research Institute, Taiwan, R.O.C. Surface-mountable, frequency selective microwave IC package
DE4331864A1 (de) * 1993-09-20 1995-03-23 Heidelberger Druckmasch Ag Gehäuse für ein elektrisches System zum Steuern oder Regeln von Betriebsvorgängen
US5650760A (en) * 1995-11-13 1997-07-22 Hughes Aircraft Company Microwave enclosure
US5889319A (en) * 1996-07-19 1999-03-30 Ericsson, Inc. RF power package with a dual ground
US5774342A (en) * 1996-09-26 1998-06-30 Delco Electronics Corporation Electronic circuit with integrated terminal pins
US6261872B1 (en) 1997-09-18 2001-07-17 Trw Inc. Method of producing an advanced RF electronic package
FR2776435B1 (fr) * 1998-03-19 2000-04-28 Alsthom Cge Alcatel Amplificateur a grand gain
JP2000058691A (ja) 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
US6441697B1 (en) * 1999-01-27 2002-08-27 Kyocera America, Inc. Ultra-low-loss feedthrough for microwave circuit package
JP3929197B2 (ja) * 1999-03-17 2007-06-13 松下電器産業株式会社 高周波回路素子
JP3438132B2 (ja) * 1999-04-23 2003-08-18 富士通カンタムデバイス株式会社 高周波デバイス用パッケージ
JP3328235B2 (ja) 1999-08-17 2002-09-24 山形日本電気株式会社 半導体装置用セラミックパッケージ
JP2003086723A (ja) * 2001-09-14 2003-03-20 Nec Schott Components Corp 薄型金属パッケージ
US6771147B2 (en) * 2001-12-17 2004-08-03 Remec, Inc. 1-100 GHz microstrip filter
US7227758B2 (en) * 2003-07-21 2007-06-05 Delphi Technologies, Inc. Printed circuit board assembly with integrated connector
JP4817924B2 (ja) * 2006-03-29 2011-11-16 株式会社東芝 半導体パッケージ
US10110185B2 (en) * 2016-09-16 2018-10-23 Kabushiki Kaisha Toshiba Microwave semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2673962A (en) * 1949-01-18 1954-03-30 Bell Telephone Labor Inc Mode suppression in curved waveguide bends
NL7314268A (nl) * 1973-10-17 1975-04-21 Philips Nv Microgolfinrichting in microstripuitvoering.
JPS5310948A (en) * 1976-07-16 1978-01-31 Mitsubishi Electric Corp Microwave integrated circuit device
JPS5366588A (en) * 1976-11-26 1978-06-14 Fujitsu Ltd Mounting structure for microstrip printing board
JPS5368890A (en) * 1976-12-01 1978-06-19 Mitsubishi Electric Corp Suspended line type microwave circuit
JPS596513B2 (ja) * 1978-12-28 1984-02-13 富士通株式会社 マイクロ波装置モジユ−ル
US4480290A (en) * 1979-07-17 1984-10-30 Les Condensateurs Sic Safco Electrolytic capacitor including a composite separator between the anode and the cathode thereof
JPS5640263A (en) * 1979-09-11 1981-04-16 Nec Corp Package for semiconductor element
US4270106A (en) * 1979-11-07 1981-05-26 The United States Of America As Represented By The Secretary Of The Air Force Broadband mode suppressor for microwave integrated circuits
JPS583922A (ja) * 1981-06-29 1983-01-10 Kawasaki Steel Corp 時効性に優れるｔ−３級ぶりき板の製造方法
JPS58190046A (ja) * 1982-04-30 1983-11-05 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
EP0157505A3 (en) 1987-04-15
DE3584301D1 (de) 1991-11-14
US4713634A (en) 1987-12-15
EP0157505B1 (en) 1991-10-09
JPS60210853A (ja) 1985-10-23
KR900008206B1 (ko) 1990-11-05
EP0157505A2 (en) 1985-10-09

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Legal Events

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A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20031023

Year of fee payment: 14

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