KR890005864A - 반도체 장치 - Google Patents

반도체 장치

Info

Publication number
KR890005864A
KR890005864A KR1019880012330A KR880012330A KR890005864A KR 890005864 A KR890005864 A KR 890005864A KR 1019880012330 A KR1019880012330 A KR 1019880012330A KR 880012330 A KR880012330 A KR 880012330A KR 890005864 A KR890005864 A KR 890005864A
Authority
KR
South Korea
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
KR1019880012330A
Other languages
English (en)
Other versions
KR920004640B1 (ko
Inventor
히로미치 사와야
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR890005864A publication Critical patent/KR890005864A/ko
Application granted granted Critical
Publication of KR920004640B1 publication Critical patent/KR920004640B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019880012330A 1987-09-26 1988-09-23 반도체 장치 KR920004640B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-241366 1987-09-26
JP62241366A JPH0828443B2 (ja) 1987-09-26 1987-09-26 半導体装置

Publications (2)

Publication Number Publication Date
KR890005864A true KR890005864A (ko) 1989-05-17
KR920004640B1 KR920004640B1 (ko) 1992-06-12

Family

ID=17073222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880012330A KR920004640B1 (ko) 1987-09-26 1988-09-23 반도체 장치

Country Status (3)

Country Link
US (1) US4963975A (ko)
JP (1) JPH0828443B2 (ko)
KR (1) KR920004640B1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE37707E1 (en) 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
IT1252575B (it) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura
JP3330459B2 (ja) * 1994-07-04 2002-09-30 三菱電機株式会社 磁気記録再生装置
DE19621766A1 (de) * 1996-05-30 1997-12-04 Siemens Ag Halbleiteranordnung mit Kunststoffgehäuse und Wärmeverteiler
US6075286A (en) * 1997-06-02 2000-06-13 International Rectifier Corporation Stress clip design
JP5623622B2 (ja) * 2011-03-09 2014-11-12 パナソニック株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51118376A (en) * 1975-04-11 1976-10-18 Hitachi Ltd Semiconductor unit
JPS558913U (ko) * 1978-07-03 1980-01-21
JPS6018939A (ja) * 1983-07-13 1985-01-31 Hitachi Micro Comput Eng Ltd 樹脂封止型半導体装置
US4791472A (en) * 1985-09-23 1988-12-13 Hitachi, Ltd. Lead frame and semiconductor device using the same

Also Published As

Publication number Publication date
JPS6484651A (en) 1989-03-29
US4963975A (en) 1990-10-16
KR920004640B1 (ko) 1992-06-12
JPH0828443B2 (ja) 1996-03-21

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030530

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee