IT1239644B - Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza - Google Patents

Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza

Info

Publication number
IT1239644B
IT1239644B IT19445A IT1944590A IT1239644B IT 1239644 B IT1239644 B IT 1239644B IT 19445 A IT19445 A IT 19445A IT 1944590 A IT1944590 A IT 1944590A IT 1239644 B IT1239644 B IT 1239644B
Authority
IT
Italy
Prior art keywords
supply
containers
power devices
integrated power
structure supplied
Prior art date
Application number
IT19445A
Other languages
English (en)
Other versions
IT9019445A1 (it
IT9019445A0 (it
Inventor
Giuseppe Marchisi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT19445A priority Critical patent/IT1239644B/it
Publication of IT9019445A0 publication Critical patent/IT9019445A0/it
Priority to US07/656,386 priority patent/US5113240A/en
Priority to DE69113079T priority patent/DE69113079T2/de
Priority to EP91102322A priority patent/EP0443508B1/en
Priority to JP3027259A priority patent/JP3014471B2/ja
Publication of IT9019445A1 publication Critical patent/IT9019445A1/it
Application granted granted Critical
Publication of IT1239644B publication Critical patent/IT1239644B/it
Priority to US08/674,661 priority patent/USRE37707E1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IT19445A 1990-02-22 1990-02-22 Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza IT1239644B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT19445A IT1239644B (it) 1990-02-22 1990-02-22 Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US07/656,386 US5113240A (en) 1990-02-22 1991-02-19 Leadframe with heat dissipator connected to s-shaped fingers
DE69113079T DE69113079T2 (de) 1990-02-22 1991-02-19 Leiterrahmen für Packungen von integrierten Leistungsanordnungen.
EP91102322A EP0443508B1 (en) 1990-02-22 1991-02-19 Leadframe for packages of integrated power devices
JP3027259A JP3014471B2 (ja) 1990-02-22 1991-02-21 電力集積回路パッケージ、それに用いられるリードフレーム、その中間体、および、電力集積回路パッケージの製造方法
US08/674,661 USRE37707E1 (en) 1990-02-22 1996-07-02 Leadframe with heat dissipator connected to S-shaped fingers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT19445A IT1239644B (it) 1990-02-22 1990-02-22 Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza

Publications (3)

Publication Number Publication Date
IT9019445A0 IT9019445A0 (it) 1990-02-22
IT9019445A1 IT9019445A1 (it) 1991-08-22
IT1239644B true IT1239644B (it) 1993-11-11

Family

ID=11158057

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19445A IT1239644B (it) 1990-02-22 1990-02-22 Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza

Country Status (5)

Country Link
US (1) US5113240A (it)
EP (1) EP0443508B1 (it)
JP (1) JP3014471B2 (it)
DE (1) DE69113079T2 (it)
IT (1) IT1239644B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1246743B (it) * 1990-12-28 1994-11-26 Sgs Thomson Microelectronics Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
IT1249388B (it) * 1991-04-26 1995-02-23 Cons Ric Microelettronica Dispositivo a semiconduttore incapsulato in resina e completamente isolato per alte tensioni
JPH0582685A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE9403575L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
JPH1065085A (ja) * 1996-06-28 1998-03-06 Siemens Ag パワーパッケージ内で使用するためのリードフレーム
KR100195513B1 (ko) * 1996-10-04 1999-06-15 윤종용 반도체 칩 패키지
US6159764A (en) * 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US5955777A (en) * 1997-07-02 1999-09-21 Micron Technology, Inc. Lead frame assemblies with voltage reference plane and IC packages including same
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
DE10247610A1 (de) * 2002-10-11 2004-04-29 Micronas Gmbh Elektronisches Bauelement mit einem Systemträger
US20040113240A1 (en) * 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
DE102004047059A1 (de) * 2004-09-28 2006-04-20 Osram Opto Semiconductors Gmbh Leiterrahmen für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
RU172797U1 (ru) * 2017-04-05 2017-07-24 Закрытое акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Выводная рамка мощной интегральной микросхемы

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
NL6903229A (it) * 1969-03-01 1970-09-03
JPS5266376A (en) * 1975-11-29 1977-06-01 Hitachi Ltd Device and manufacture of resin body type semiconductor
JPS54124678A (en) * 1978-03-20 1979-09-27 Nec Corp Lead frame
JPS6153752A (ja) * 1984-08-24 1986-03-17 Hitachi Ltd リ−ドフレ−ム
IT1185410B (it) * 1985-10-10 1987-11-12 Sgs Microelettronica Spa Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato
JPH0815193B2 (ja) * 1986-08-12 1996-02-14 新光電気工業株式会社 半導体装置及びこれに用いるリードフレーム
JPH0828443B2 (ja) * 1987-09-26 1996-03-21 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US5113240A (en) 1992-05-12
JPH04215464A (ja) 1992-08-06
DE69113079T2 (de) 1996-05-15
DE69113079D1 (de) 1995-10-26
IT9019445A1 (it) 1991-08-22
EP0443508A1 (en) 1991-08-28
EP0443508B1 (en) 1995-09-20
IT9019445A0 (it) 1990-02-22
JP3014471B2 (ja) 2000-02-28

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970227