US20040113240A1 - An electronic component with a leadframe - Google Patents

An electronic component with a leadframe Download PDF

Info

Publication number
US20040113240A1
US20040113240A1 US10685308 US68530803A US2004113240A1 US 20040113240 A1 US20040113240 A1 US 20040113240A1 US 10685308 US10685308 US 10685308 US 68530803 A US68530803 A US 68530803A US 2004113240 A1 US2004113240 A1 US 2004113240A1
Authority
US
Grant status
Application
Patent type
Prior art keywords
platform
electronic component
housing
leadframe
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10685308
Inventor
Wolfgang Hauser
Viktor Heitzler
Christian Joos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK-Micronas GmbH
Original Assignee
TDK-Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494Connecting portions
    • H01L2224/4943Connecting portions the connecting portions being staggered
    • H01L2224/49433Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0103Zinc [Zn]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

The invention relates to an electronic component (1) including a leadframe (2), composed of a platform (5), and possibly at least one electrical connecting piece (6′, 6″), wherein at least one electronic member (3) is located on the platform (5), and including a housing (4) that encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided to support the platform (5) during the fabrication process for the housing (4), and wherein at least a section of the at least one support region (7) projects from the housing (4).

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to the field of semiconductors, and in particular to semiconductor packaging. [0001]
  • In general, an electronic component includes a leadframe composed of at least one platform and possibly at least one electronic connector, at least one electronic member, and a housing. The at least one electronic member here is located on the platform. In addition, the electronic member and platform are generally completely enclosed by the housing. [0002]
  • The housing of the electronic component is generally fabricated by a molding process, the so-called molding procedure. In the molding procedure, the part of the leadframe to be molded, specifically, the platform, together with the electronic member disposed on the platform, projects unprotected into the cavity of the mold, the so-called molding die. During molding, the molding compound is introduced under high injection pressures into the cavity of the mold. In addition, a nonuniform distribution of pressure exerted by the molding compound is present in the cavity during the molding procedure. The result is that the section of the leadframe projecting into the cavity may be bent during molding. The consequence of this is that the electrical and magnetic properties of the electronic member may be altered in an undesirable manner. For example, the sensitivity of a Hall sensor may be degraded by the tilting of the platform on which the sensor element is located. [0003]
  • Therefore, there is a need for an electronic component, or a method for fabricating an electronic component, in which the above-described tilting risk for the leadframe is prevented. [0004]
  • SUMMARY OF THE INVENTION
  • An electronic component includes a leadframe, composed of a platform and preferably at least one electrical connecting piece. The electronic component has at least one electronic member which is located on the platform. The electronic component also includes a housing that encloses the electronic member and the platform. In the electronic component, there is at least one support region on the platform to support the platform during the fabrication process creating the housing, and at least a section of the at least one support region projecting from the housing of the electronic component. [0005]
  • The region of the leadframe (i.e., the platform projecting exposed into the cavity of the molding die during the molding procedure) is supported by a molding die. As a result, molding compound is not accumulated during the molding procedure in the section of the support region supported by the molding die—with the result that at least a section of the support region projects from the housing. [0006]
  • In one embodiment, at least one support region is designed as a lobe element molded onto the platform. In another embodiment, the at least one lobe element is molded onto the platform forming a single piece, allowing the platform and lobe element to be inexpensively fabricated as a stamped piece. [0007]
  • Since at least a section of the lobe element or support region projects from the housing, at least a section of the lobe element or support region is directly exposed to ambient moisture. In order to prevent any penetration of ambient moisture into the housing in the transition zone between the platform and the lobe element or support region, and thus into the housing, a notch-like depression is provided along the transition zone. [0008]
  • In another preferred embodiment, the at least one connecting piece is molded onto the platform forming a single piece, thereby forming the connecting piece and platform as one integrated unit. Here at least a section of the connecting piece is guided outside the housing. As a result, during the molding procedure the leadframe may receive additional support by the connecting piece. [0009]
  • The electronic component may include three or more connecting pieces that run parallel and on one side of the housing. A embodiment of this design is, for example, a Hall sensor. [0010]
  • A thin anticorrosive film may extend over at least a section of the lobe element. For example, the support region may be covered by a thin film of the housing plastic. The thin film may, for example, be created during fabrication of the housing by generating a small cavity between the support region and the mold, the cavity being filled by the plastic when the plastic is injected. [0011]
  • The leadframe may be fabricated by a metal or metal alloy. At least a section of the surface of the leadframe may be coated, and in particular, coated with an alloy containing tin or tin-lead. [0012]
  • During molding the support region of the leadframe projecting into the cavity of the mold, that is, at least one region of the platform, is supported by the mold. At least one pin-like element be provided in the upper and lower shell of the mold, with the result that the support region is jammed between the pin elements of the upper and lower shells of the mold during the molding procedure. The pin elements may be configured as integral components of the sidewall of the mold shells, of the molding die, or mold. [0013]
  • These and other objects, features and advantages of the present invention will become more apparent in light of the following detailed description of preferred embodiments thereof, as illustrated in the accompanying drawings.[0014]
  • BRIEF DESCRIPTION OF THE DRAWING
  • FIG. 1 is a schematic drawing of a top view an electronic component; [0015]
  • FIG. 2 is a side view of the electronic component; [0016]
  • FIG. 3 is a perspective view of the electronic component; and [0017]
  • FIG. 4 shows the electronic component during fabrication of the housing in a sectional view along A-A in FIG. 1.[0018]
  • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 is a top view of an electronic component [0019] 1 that includes a leadframe 2, an electronic member 3 and a housing 4. The electronic component 1 includes a leadframe made of a metal alloy. The housing 4 is made of a plastic such as epoxy resin. In this example, the electronic member 3 of electronic component 1 is configured as a Hall sensor.
  • The leadframe [0020] 2 includes a platform 5 and three parallel connecting pieces 6′, 6″. In this example, the connecting piece 6′ is molded onto the platform 5 as one piece. Connecting pieces 6″ project into the housing 4 of the electronic component 1, without directly contacting platform 5. The electronic member 3 is located on the platform 5. Electronic contact between the electronic member 3 and the connecting pieces 6′ and 6″ is provided by bonds 21 within the housing 4. The electrical connection of the electronic member 3 to the region outside the housing 4 is provided by the connecting pieces 6′ and 6″. Additionally, two opposing lobe elements 7 are molded onto the platform 5, forming one piece. The housing 4 has holes 8 in the region of each lobe element 7, the holes being identified as support holes. The section 9 shown dark in FIG. 1 represents the overlap zone between each lobe element 7 and each support hole 9, that is, each lobe element 7 in overlap zone 9 projects beyond housing 4. Also provided in the transitional zone between the platform 5 and the lobe element 7 is one notch-shaped depression 10, which prevent ambient moisture in the region of support holes 8 from penetrating into the housing 4.
  • FIG. 2 is a side view of the electronic component [0021] 1 described in FIG. 1, where within the housing 4 only the platform 5 and lobe element 7 are shown. The support hole 11 located on the bottom side of housing 4. The support hole 11 is located opposite support hole 8. The effect of the support hole 11 is that a section of the bottom side of the lobe element 7 projects from the housing 4. The effect of the support hole 8 is that, as already described in FIG. 1, the top side of the lobe element 7 projects from the housing 4. The platform 5 is supported by the lobe element 7 on both sides against mold 12 (shown in FIG. 4) in the region of support holes 8 and 11, thereby preventing tipping of the platform 5 during the molding procedure.
  • FIG. 3 is a perspective view the providing a clearer understanding of electronic component [0022] 1. FIG. 4 shows electronic component 1 during fabrication of housing 4 in a sectional view along axis A-A in FIG. 1. Molding die 12 is clearly recognizable, composed of an upper mold shell 13 and a lower mold shell 14. During the molding procedure, mold shells 13 and 14 are brought into contact along parting plane 18 such that a closed cavity is formed by molding die 12, composed of cavity halves 15 and 16. A channel 17 to fill cavity halves 15 and 16 with the molding compound is shown, simply as an example, in lower mold shell 14. It is also evident that opposing lobe elements 7 molded on forming a single piece with platform 5 are supported in the region of parting plane 18 by upper mold shell 13 and lower mold shell 14. Recesses 19 are provided in upper mold shell 13, and recesses 20 are provided in lower mold shell 14 to accommodate each lobe element 7, with recesses 19 and 20 forming a matching space for each accommodated lobe element 7 in the state in which mold shells 13 and 14 are pressed together.
  • Although the present invention has been shown and described with respect to several preferred embodiments thereof, various changes, omissions and additions to the form and detail thereof, may be made therein, without departing from the spirit and scope of the invention.[0023]

Claims (12)

    What is claimed is:
  1. 1. Electronic component (1) including a leadframe (2), a platform (5) on which a electronic member (3) is located, and including a housing (4) which encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided on the platform (5) to support the platform during the fabrication process for the housing, and that a section of the at least one support region (7) projects from the housing (4).
  2. 2. Electronic component according to claim 1, wherein the at least one support region (7) is in the form of a lobe element (7) molded onto the platform (5).
  3. 3. Electronic component according to claim 2 wherein a plurality of lobe elements (7) are molded onto the platform (5).
  4. 4. The electronic component of claim 3, wherein at least one lobe element (7) is molded onto the platform (5), forming a single piece.
  5. 5. The electronic component of claim 4, wherein at least one notch-shaped depression (10) is provided along the transition zone between the support region or lobe element (7) and the platform (5).
  6. 6. The electronic component of claim 5, wherein that a connecting piece (6′) is molded onto the platform (5).
  7. 7. The electronic component of claim 6, that at least one connecting piece (6′) is molded onto the platform (5) forming a single piece.
  8. 8. The electronic component of claim 7, wherein at least three connecting pieces (6′, 6″) are provided which run in parallel and are guided on one side of the housing (4) out of said housing.
  9. 9. The electronic component of claim 8, wherein the leadframe (2) is fabricated out of a metal or a metal alloy.
  10. 10. The electronic component of claim 9, wherein a thin anticorrosive film extends along at least a section of the lobe element (7).
  11. 11. The electronic component of claim 10, wherein at least a section of the surface of the leadframe (2) is coated, and in particular, coated with an alloy which contains Zn or Zn—Pb.
  12. 12. A method of fabricating an electronic component (1) including a leadframe (2) on which at least one electronic member (3) is located, and including a housing (4) which may be fabricated by a molding process using a mold (12),
    characterized in
    that at least one support surface (7) is provided on the leadframe (2) which rests against the mold (12) during the molding process.
US10685308 2002-10-11 2003-10-14 An electronic component with a leadframe Abandoned US20040113240A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DEDE10247610 2002-10-11
DE2002147610 DE10247610A1 (en) 2002-10-11 2002-10-11 Electronic component having a lead frame
US41851202 true 2002-10-15 2002-10-15
US10685308 US20040113240A1 (en) 2002-10-11 2003-10-14 An electronic component with a leadframe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10685308 US20040113240A1 (en) 2002-10-11 2003-10-14 An electronic component with a leadframe
US14880072 US9620391B2 (en) 2002-10-11 2015-10-09 Electronic component with a leadframe

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14880072 Continuation US9620391B2 (en) 2002-10-11 2015-10-09 Electronic component with a leadframe

Publications (1)

Publication Number Publication Date
US20040113240A1 true true US20040113240A1 (en) 2004-06-17

Family

ID=32511957

Family Applications (2)

Application Number Title Priority Date Filing Date
US10685308 Abandoned US20040113240A1 (en) 2002-10-11 2003-10-14 An electronic component with a leadframe
US14880072 Active US9620391B2 (en) 2002-10-11 2015-10-09 Electronic component with a leadframe

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14880072 Active US9620391B2 (en) 2002-10-11 2015-10-09 Electronic component with a leadframe

Country Status (1)

Country Link
US (2) US20040113240A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017108364A1 (en) 2016-06-13 2017-12-14 Denso Corporation magnetic sensor

Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
US4113474A (en) * 1974-09-12 1978-09-12 Toyo Valve Company, Ltd. Copper alloys of excellent corrosion resistance, moldability and workability
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS6195536A (en) * 1984-10-16 1986-05-14 Sanken Electric Co Ltd Manufacture of resin-sealed type semiconductor device
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US4855807A (en) * 1986-12-26 1989-08-08 Kabushiki Kaisha Toshiba Semiconductor device
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
US5113240A (en) * 1990-02-22 1992-05-12 Sgs-Thomson Microelectronics S.R.L. Leadframe with heat dissipator connected to s-shaped fingers
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
US5247202A (en) * 1991-10-09 1993-09-21 Landis & Gyr Betriebs Ag Plurality of arrangements each including an ic magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5294829A (en) * 1990-01-26 1994-03-15 Sgs-Thomson Microelectronics, Inc. IC package having direct attach backup battery
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5427938A (en) * 1993-01-25 1995-06-27 Sharp Kabushiki Kaisha Method of manufacturing a resin-sealed semiconductor device
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
US5498902A (en) * 1993-08-25 1996-03-12 Seiko Epson Corporation Semiconductor device and its manufacturing method
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5578871A (en) * 1994-10-18 1996-11-26 Fierkens; Richard H. J. Integrated circuit package and method of making the same
US5610800A (en) * 1994-08-31 1997-03-11 Sgs-Thomson Microelectronics, Inc. Substrate mounting of circuit components with a low profile
US5623162A (en) * 1994-10-27 1997-04-22 Nec Corporation Lead frame having cut-out wing leads
US5841187A (en) * 1994-06-22 1998-11-24 Omron Corporation Molded electronic component
US6043111A (en) * 1996-07-30 2000-03-28 Nec Corporation Small size semiconductor package
US6049120A (en) * 1997-01-14 2000-04-11 Mitsubishi Denki Kabushiki Kaisha Thermal-stress-resistant semiconductor sensor
US6150715A (en) * 1997-08-05 2000-11-21 Nec Corporation Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
US6197615B1 (en) * 1997-04-04 2001-03-06 Samsung Electronics Co., Ltd. Method of producing lead frame having uneven surfaces
US6203931B1 (en) * 1999-02-05 2001-03-20 Industrial Technology Research Institute Lead frame material and process for manufacturing the same
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6258624B1 (en) * 2000-01-10 2001-07-10 Micron Technology, Inc. Semiconductor package having downset leadframe for reducing package bow
US6262480B1 (en) * 1996-06-28 2001-07-17 Sgs-Thomson Microelectronics S.R.L. Package for electronic device having a fully insulated dissipator
US20010010949A1 (en) * 1996-12-26 2001-08-02 Yoshinori Miyaki Plastic molded type semiconductor device and fabrication process thereof
US20010033011A1 (en) * 1998-07-30 2001-10-25 Chien-Ping Huang Semiconductor package having a die pad with downward-extended tabs
US20020033523A1 (en) * 2000-07-27 2002-03-21 Stmicroelectronics S.R.L. Lead-frame for semiconductor devices
US20020041911A1 (en) * 2000-10-06 2002-04-11 Nec Corporation Resin encapsulation mold
US20020048846A1 (en) * 1998-12-11 2002-04-25 Corisis David J. Die paddle clamping method for wire bond enhancement
US20020121680A1 (en) * 2001-03-05 2002-09-05 Samsung Electronics Co., Ltd. Ultra-thin semiconductor package device and method for manufacturing the same
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US6498394B1 (en) * 1995-07-10 2002-12-24 Ose Usa IC packages with diamond substrate thermal conductor
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
US20030127711A1 (en) * 2002-01-09 2003-07-10 Matsushita Electric Industrial Co., Ltd. Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
US6664647B2 (en) * 2000-08-18 2003-12-16 Hitachi Ltd Semiconductor device and a method of manufacturing the same
US6684496B2 (en) * 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
US7049685B2 (en) * 2000-08-24 2006-05-23 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567146A (en) 1978-11-14 1980-05-21 Mitsubishi Electric Corp Method for manufacturing semiconductor device
JPS58154252A (en) 1982-03-10 1983-09-13 Hitachi Ltd Lead frame
JPH0527261B2 (en) 1983-12-16 1993-04-20 Hitachi Ltd
JPS6132434A (en) 1984-07-24 1986-02-15 Sanken Electric Co Ltd Manufacture of resin molded semiconductor device
JPS61140157A (en) 1984-12-12 1986-06-27 Nec Corp Resin-sealed semiconductor device
JPH0554695B2 (en) 1984-12-19 1993-08-13 Hitachi Ltd
JPS63187656A (en) 1987-01-30 1988-08-03 Furukawa Electric Co Ltd:The Semiconductor device
JPH0199245A (en) 1987-10-12 1989-04-18 Mitsubishi Electric Corp Ic package
JPH0548955B2 (en) 1987-12-16 1993-07-22 Sanken Electric Co Ltd
JPH01196153A (en) 1988-02-01 1989-08-07 Oki Electric Ind Co Ltd Resin-sealed semiconductor device
JPH0233957A (en) 1988-07-22 1990-02-05 Nec Kyushu Ltd Lead frame for semiconductor device
JPH02177710A (en) 1988-12-28 1990-07-10 Matsushima Kogyo Co Ltd Piezoelectric oscillator
JPH0358452A (en) 1989-07-26 1991-03-13 Nec Kyushu Ltd Resin-sealed semiconductor device
JP2759523B2 (en) 1989-10-18 1998-05-28 株式会社三井ハイテック A method of manufacturing a semiconductor device
JP2890662B2 (en) 1990-04-25 1999-05-17 ソニー株式会社 Production process and a lead frame for use therein resin-encapsulated semiconductor device
DK0508615T3 (en) 1991-04-10 1998-02-02 Caddock Electronics Inc Resistance foil type
JPH0547979A (en) 1991-08-21 1993-02-26 Nec Corp Resin-sealed semiconductor device
JPH0595056A (en) 1991-10-01 1993-04-16 Seiko Epson Corp Semiconductor device
DE69216377T2 (en) 1991-12-20 1997-04-24 Sgs Thomson Microelectronics Shape and method for manufacturing plastic packages for integrated circuits containing a free metallic heat sink for the inspection of the solder joint
JPH05183082A (en) 1992-01-07 1993-07-23 Hitachi Cable Ltd Lead frame for minitransistor
US5703356A (en) 1992-10-05 1997-12-30 Logitech, Inc. Pointing device utilizing a photodetector array
JP4025958B2 (en) 2000-05-17 2007-12-26 サンケン電気株式会社 Ho - current detection device provided with Le element

Patent Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US4113474A (en) * 1974-09-12 1978-09-12 Toyo Valve Company, Ltd. Copper alloys of excellent corrosion resistance, moldability and workability
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
JPS6195536A (en) * 1984-10-16 1986-05-14 Sanken Electric Co Ltd Manufacture of resin-sealed type semiconductor device
US4855807A (en) * 1986-12-26 1989-08-08 Kabushiki Kaisha Toshiba Semiconductor device
US4954307A (en) * 1987-12-31 1990-09-04 Sanken Electric Co., Ltd. Method for manufacturing plastic encapsulated electronic semiconductor devices
US5208467A (en) * 1988-07-28 1993-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a film-covered packaged component
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
US5294829A (en) * 1990-01-26 1994-03-15 Sgs-Thomson Microelectronics, Inc. IC package having direct attach backup battery
US5113240A (en) * 1990-02-22 1992-05-12 Sgs-Thomson Microelectronics S.R.L. Leadframe with heat dissipator connected to s-shaped fingers
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5247202A (en) * 1991-10-09 1993-09-21 Landis & Gyr Betriebs Ag Plurality of arrangements each including an ic magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5427938A (en) * 1993-01-25 1995-06-27 Sharp Kabushiki Kaisha Method of manufacturing a resin-sealed semiconductor device
US5458158A (en) * 1993-03-30 1995-10-17 Toyo Communication Equipment Co., Ltd. Lead cutting apparatus and an anticorrosive coat structure of lead
US5498902A (en) * 1993-08-25 1996-03-12 Seiko Epson Corporation Semiconductor device and its manufacturing method
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US5841187A (en) * 1994-06-22 1998-11-24 Omron Corporation Molded electronic component
US5610800A (en) * 1994-08-31 1997-03-11 Sgs-Thomson Microelectronics, Inc. Substrate mounting of circuit components with a low profile
US5578871A (en) * 1994-10-18 1996-11-26 Fierkens; Richard H. J. Integrated circuit package and method of making the same
US5623162A (en) * 1994-10-27 1997-04-22 Nec Corporation Lead frame having cut-out wing leads
US6498394B1 (en) * 1995-07-10 2002-12-24 Ose Usa IC packages with diamond substrate thermal conductor
US6262480B1 (en) * 1996-06-28 2001-07-17 Sgs-Thomson Microelectronics S.R.L. Package for electronic device having a fully insulated dissipator
US6043111A (en) * 1996-07-30 2000-03-28 Nec Corporation Small size semiconductor package
US20010010949A1 (en) * 1996-12-26 2001-08-02 Yoshinori Miyaki Plastic molded type semiconductor device and fabrication process thereof
US6049120A (en) * 1997-01-14 2000-04-11 Mitsubishi Denki Kabushiki Kaisha Thermal-stress-resistant semiconductor sensor
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
US6197615B1 (en) * 1997-04-04 2001-03-06 Samsung Electronics Co., Ltd. Method of producing lead frame having uneven surfaces
US6150715A (en) * 1997-08-05 2000-11-21 Nec Corporation Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
US6684496B2 (en) * 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US6639306B2 (en) * 1998-07-30 2003-10-28 Siliconware Precision Industries, Co., Ltd. Semiconductor package having a die pad with downward-extended tabs
US20010033011A1 (en) * 1998-07-30 2001-10-25 Chien-Ping Huang Semiconductor package having a die pad with downward-extended tabs
US20020048846A1 (en) * 1998-12-11 2002-04-25 Corisis David J. Die paddle clamping method for wire bond enhancement
US6203931B1 (en) * 1999-02-05 2001-03-20 Industrial Technology Research Institute Lead frame material and process for manufacturing the same
US6258624B1 (en) * 2000-01-10 2001-07-10 Micron Technology, Inc. Semiconductor package having downset leadframe for reducing package bow
US20020033523A1 (en) * 2000-07-27 2002-03-21 Stmicroelectronics S.R.L. Lead-frame for semiconductor devices
US6664647B2 (en) * 2000-08-18 2003-12-16 Hitachi Ltd Semiconductor device and a method of manufacturing the same
US7049685B2 (en) * 2000-08-24 2006-05-23 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20020041911A1 (en) * 2000-10-06 2002-04-11 Nec Corporation Resin encapsulation mold
US20020121680A1 (en) * 2001-03-05 2002-09-05 Samsung Electronics Co., Ltd. Ultra-thin semiconductor package device and method for manufacturing the same
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030127711A1 (en) * 2002-01-09 2003-07-10 Matsushita Electric Industrial Co., Ltd. Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017108364A1 (en) 2016-06-13 2017-12-14 Denso Corporation magnetic sensor
US9929077B2 (en) 2016-06-13 2018-03-27 Denso Corporation Magnetic sensor

Also Published As

Publication number Publication date Type
US20160035594A1 (en) 2016-02-04 application
US9620391B2 (en) 2017-04-11 grant

Similar Documents

Publication Publication Date Title
US6589820B1 (en) Method and apparatus for packaging a microelectronic die
US5728600A (en) Circuit encapsulation process
US5091341A (en) Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
US20060261453A1 (en) Semiconductor package and stack arrangement thereof
US4766520A (en) Injection molded circuit housing
US6395585B2 (en) Method for housing sensors in a package
US6170996B1 (en) Optical module encapsulated with resin and manufacturing method therefor
US5108955A (en) Method of making a resin encapsulated pin grid array with integral heatsink
US5289039A (en) Resin encapsulated semiconductor device
US5973388A (en) Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe
US6396139B1 (en) Semiconductor package structure with exposed die pad
US6518659B1 (en) Stackable package having a cavity and a lid for an electronic device
US5686698A (en) Package for electrical components having a molded structure with a port extending into the molded structure
US5909037A (en) Bi-level injection molded leadframe
US6617680B2 (en) Chip carrier, semiconductor package and fabricating method thereof
US6813154B2 (en) Reversible heat sink packaging assembly for an integrated circuit
US6653724B1 (en) Chip on board package for optical mice and lens cover for the same
US6390854B2 (en) Resin shield circuit device
US5665296A (en) Molding technique for molding plastic packages
US5192682A (en) Manufacturing method for thin semiconductor device assemblies
US20090244876A1 (en) Multi-cavity electromagnetic shielding device
US5179039A (en) Method of making a resin encapsulated pin grid array with integral heatsink
JP2005197369A (en) Optical semiconductor device
US6439058B1 (en) Semiconductor sensor
JP2005294736A (en) Manufacturing method for semiconductor light emitting device

Legal Events

Date Code Title Description
AS Assignment

Owner name: MICRONAS GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HAUSER, WOLFGANG;JOOS, CHRISTIAN;HEITZLER,VIKTOR;REEL/FRAME:014942/0935

Effective date: 20031110