IT1246743B - Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato. - Google Patents

Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.

Info

Publication number
IT1246743B
IT1246743B IT02255290A IT2255290A IT1246743B IT 1246743 B IT1246743 B IT 1246743B IT 02255290 A IT02255290 A IT 02255290A IT 2255290 A IT2255290 A IT 2255290A IT 1246743 B IT1246743 B IT 1246743B
Authority
IT
Italy
Prior art keywords
mold
built
manufacture
integrated circuits
plastic containers
Prior art date
Application number
IT02255290A
Other languages
English (en)
Other versions
IT9022552A1 (it
IT9022552A0 (it
Inventor
Camillo Perego
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT02255290A priority Critical patent/IT1246743B/it
Publication of IT9022552A0 publication Critical patent/IT9022552A0/it
Priority to EP91121515A priority patent/EP0496078B1/en
Priority to DE69117919T priority patent/DE69117919T2/de
Priority to US07/813,910 priority patent/US5252052A/en
Priority to JP3347346A priority patent/JPH04333245A/ja
Publication of IT9022552A1 publication Critical patent/IT9022552A1/it
Application granted granted Critical
Publication of IT1246743B publication Critical patent/IT1246743B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
IT02255290A 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato. IT1246743B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
EP91121515A EP0496078B1 (en) 1990-12-28 1991-12-16 A mold for manufacturing plastics integrated circuits incorporating a heat sink
DE69117919T DE69117919T2 (de) 1990-12-28 1991-12-16 Form zur Herstellung von Kunststoffpackungen für integrierte Schaltungen, die eine Wärmesenke enthalten
US07/813,910 US5252052A (en) 1990-12-28 1991-12-23 Mold for manufacturing plastic integrated circuits incorporating a heat sink
JP3347346A JPH04333245A (ja) 1990-12-28 1991-12-27 プラスチック集積回路パッケージを製造するための金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.

Publications (3)

Publication Number Publication Date
IT9022552A0 IT9022552A0 (it) 1990-12-28
IT9022552A1 IT9022552A1 (it) 1992-06-29
IT1246743B true IT1246743B (it) 1994-11-26

Family

ID=11197754

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.

Country Status (5)

Country Link
US (1) US5252052A (it)
EP (1) EP0496078B1 (it)
JP (1) JPH04333245A (it)
DE (1) DE69117919T2 (it)
IT (1) IT1246743B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004047059A1 (de) * 2004-09-28 2006-04-20 Osram Opto Semiconductors Gmbh Leiterrahmen für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
JP5180495B2 (ja) * 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3238286A (en) * 1962-03-01 1966-03-01 Hermetic Coil Co Inc Method for manufacturing an electrical coil
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
US4453903A (en) * 1981-04-15 1984-06-12 North American Philips Corporation Insert molding gate design for encapsulating electronic ceramics with thermoplastic materials
JPS57191011A (en) * 1981-05-22 1982-11-24 Hitachi Ltd Mold
JPS60182142A (ja) * 1984-02-28 1985-09-17 Toshiba Corp 半導体装置の樹脂封止用金型
JPS6132434A (ja) * 1984-07-24 1986-02-15 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
JPS61170038A (ja) * 1985-01-23 1986-07-31 Toshiba Corp 樹脂封止用金型
JPS6215827A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Ind Co Ltd 封止金型装置
ES2028792T3 (es) * 1985-11-06 1992-07-16 Ego Kunststoffwerk Ag Procedimiento y dispositivo para la fabricacion de una cinta articulada flexible y cinta articulada fabricada segun este procedimiento.
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
JP2631990B2 (ja) * 1988-01-21 1997-07-16 トーワ株式会社 電子部品の樹脂封止成形用金型
US5108955A (en) * 1988-10-27 1992-04-28 Citizen Watch Co., Ltd. Method of making a resin encapsulated pin grid array with integral heatsink
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
JPH02306639A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 半導体装置の樹脂封入方法
US5135694A (en) * 1989-11-10 1992-08-04 Seiko Epson Corporation Electronic device wristband
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation

Also Published As

Publication number Publication date
DE69117919T2 (de) 1996-09-26
IT9022552A1 (it) 1992-06-29
JPH04333245A (ja) 1992-11-20
EP0496078B1 (en) 1996-03-13
US5252052A (en) 1993-10-12
EP0496078A1 (en) 1992-07-29
IT9022552A0 (it) 1990-12-28
DE69117919D1 (de) 1996-04-18

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227