IT1243817B - Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato - Google Patents

Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato

Info

Publication number
IT1243817B
IT1243817B IT02168190A IT2168190A IT1243817B IT 1243817 B IT1243817 B IT 1243817B IT 02168190 A IT02168190 A IT 02168190A IT 2168190 A IT2168190 A IT 2168190A IT 1243817 B IT1243817 B IT 1243817B
Authority
IT
Italy
Prior art keywords
built
manufacture
integrated circuits
plastic containers
thermal dissipator
Prior art date
Application number
IT02168190A
Other languages
English (en)
Other versions
IT9021681A1 (it
IT9021681A0 (it
Inventor
Giuseppe Marchisi
Francois Lamourelle
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT02168190A priority Critical patent/IT1243817B/it
Publication of IT9021681A0 publication Critical patent/IT9021681A0/it
Priority to EP91115533A priority patent/EP0480197A1/en
Publication of IT9021681A1 publication Critical patent/IT9021681A1/it
Application granted granted Critical
Publication of IT1243817B publication Critical patent/IT1243817B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT02168190A 1990-10-09 1990-10-09 Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato IT1243817B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT02168190A IT1243817B (it) 1990-10-09 1990-10-09 Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
EP91115533A EP0480197A1 (en) 1990-10-09 1991-09-13 A method for manufacturing plastics IC packages incorporating a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT02168190A IT1243817B (it) 1990-10-09 1990-10-09 Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato

Publications (3)

Publication Number Publication Date
IT9021681A0 IT9021681A0 (it) 1990-10-09
IT9021681A1 IT9021681A1 (it) 1992-04-09
IT1243817B true IT1243817B (it) 1994-06-28

Family

ID=11185311

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02168190A IT1243817B (it) 1990-10-09 1990-10-09 Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato

Country Status (2)

Country Link
EP (1) EP0480197A1 (it)
IT (1) IT1243817B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530577B4 (de) * 1995-08-19 2005-03-10 Conti Temic Microelectronic Gehäuse für mikroelektronische Bauelemente und Verfahren zu seiner Herstellung
DE10232788B4 (de) * 2001-07-18 2010-01-14 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip auf einem Systemträger, Systemträger und Verfahren zur Herstellung eines elektronischen Bauteils

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
FI76220C (fi) * 1984-09-17 1988-09-09 Elkotrade Ag Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter.
FR2609821B1 (fr) * 1987-01-16 1989-03-31 Flonic Sa Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
US4881885A (en) * 1988-04-15 1989-11-21 International Business Machines Corporation Dam for lead encapsulation

Also Published As

Publication number Publication date
IT9021681A1 (it) 1992-04-09
EP0480197A1 (en) 1992-04-15
IT9021681A0 (it) 1990-10-09

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