GB2248346B - Multiple layer semiconductor circuit module - Google Patents

Multiple layer semiconductor circuit module

Info

Publication number
GB2248346B
GB2248346B GB9118724A GB9118724A GB2248346B GB 2248346 B GB2248346 B GB 2248346B GB 9118724 A GB9118724 A GB 9118724A GB 9118724 A GB9118724 A GB 9118724A GB 2248346 B GB2248346 B GB 2248346B
Authority
GB
United Kingdom
Prior art keywords
circuit module
semiconductor circuit
multiple layer
layer semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9118724A
Other versions
GB9118724D0 (en
GB2248346A (en
Inventor
Yasuharu Nakajima
Akira Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9118724D0 publication Critical patent/GB9118724D0/en
Publication of GB2248346A publication Critical patent/GB2248346A/en
Application granted granted Critical
Publication of GB2248346B publication Critical patent/GB2248346B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
GB9118724A 1990-09-03 1991-09-02 Multiple layer semiconductor circuit module Expired - Fee Related GB2248346B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2234097A JP3058898B2 (en) 1990-09-03 1990-09-03 Semiconductor device and evaluation method thereof

Publications (3)

Publication Number Publication Date
GB9118724D0 GB9118724D0 (en) 1991-10-16
GB2248346A GB2248346A (en) 1992-04-01
GB2248346B true GB2248346B (en) 1995-01-04

Family

ID=16965577

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9118724A Expired - Fee Related GB2248346B (en) 1990-09-03 1991-09-02 Multiple layer semiconductor circuit module

Country Status (4)

Country Link
US (1) US5160907A (en)
JP (1) JP3058898B2 (en)
FR (1) FR2666452A1 (en)
GB (1) GB2248346B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5309122A (en) * 1992-10-28 1994-05-03 Ball Corporation Multiple-layer microstrip assembly with inter-layer connections
US5376759A (en) * 1993-06-24 1994-12-27 Northern Telecom Limited Multiple layer printed circuit board
KR0160542B1 (en) * 1994-12-15 1999-02-01 정선종 Substrate for monolithic microwave integrated circuits and formation method of the same
US5805431A (en) * 1996-01-17 1998-09-08 Synergy Microwave Corporation Surface Mountable transformer
JP3405545B2 (en) * 1996-10-31 2003-05-12 サーノフ コーポレイション Integrated electronic circuit
JPH10241996A (en) * 1997-02-26 1998-09-11 Ngk Spark Plug Co Ltd Laminated circuit
US6061228A (en) * 1998-04-28 2000-05-09 Harris Corporation Multi-chip module having an integral capacitor element
US7015869B2 (en) * 2002-11-18 2006-03-21 Visteon Global Technologies, Inc. High frequency antenna disposed on the surface of a three dimensional substrate
JP5618662B2 (en) * 2010-07-15 2014-11-05 三菱電機株式会社 Method for measuring characteristics of semiconductor element and method for manufacturing semiconductor device
US9627310B2 (en) * 2012-04-11 2017-04-18 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device with self-aligned interconnects

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1445268A (en) * 1974-06-19 1976-08-11 Uralsky Politekhn Inst Multilayer electric circuit structures and methods of fabricating the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110712A (en) * 1975-05-14 1978-08-29 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Microstrip circuit having coplanar waveguide port
US4500905A (en) * 1981-09-30 1985-02-19 Tokyo Shibaura Denki Kabushiki Kaisha Stacked semiconductor device with sloping sides
JPS58103149A (en) * 1981-12-15 1983-06-20 Matsushita Electric Works Ltd Semiconductor device
US4770640A (en) * 1983-06-24 1988-09-13 Walter Howard F Electrical interconnection device for integrated circuits
JPS60114004A (en) * 1983-11-25 1985-06-20 Murata Mfg Co Ltd Dielectric coaxial resonator
JPS6118164A (en) * 1984-07-04 1986-01-27 Mitsubishi Electric Corp Semiconductor device
JPS61288455A (en) * 1985-06-17 1986-12-18 Fujitsu Ltd Manufacture of multilayer semiconductor device
US4706166A (en) * 1986-04-25 1987-11-10 Irvine Sensors Corporation High-density electronic modules--process and product
JPS6350102A (en) * 1986-08-20 1988-03-03 Fujitsu Ltd Dielectric resonator
US4967171A (en) * 1987-08-07 1990-10-30 Mitsubishi Danki Kabushiki Kaisha Microwave integrated circuit
US4906953A (en) * 1988-09-08 1990-03-06 Varian Associates, Inc. Broadband microstrip to coplanar waveguide transition by anisotropic etching of gallium arsenide
US5093639A (en) * 1990-09-20 1992-03-03 The United States Of America As Represented By The Secretary Of The Air Force Electromagnetic stripline coupler apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1445268A (en) * 1974-06-19 1976-08-11 Uralsky Politekhn Inst Multilayer electric circuit structures and methods of fabricating the same

Also Published As

Publication number Publication date
GB9118724D0 (en) 1991-10-16
JPH04113648A (en) 1992-04-15
GB2248346A (en) 1992-04-01
US5160907A (en) 1992-11-03
FR2666452A1 (en) 1992-03-06
JP3058898B2 (en) 2000-07-04

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19950815

PCNP Patent ceased through non-payment of renewal fee