IT9022552A0 - Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato. - Google Patents

Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato.

Info

Publication number
IT9022552A0
IT9022552A0 IT9022552A IT2255290A IT9022552A0 IT 9022552 A0 IT9022552 A0 IT 9022552A0 IT 9022552 A IT9022552 A IT 9022552A IT 2255290 A IT2255290 A IT 2255290A IT 9022552 A0 IT9022552 A0 IT 9022552A0
Authority
IT
Italy
Prior art keywords
mold
manufacture
heat sink
integrated circuits
plastic containers
Prior art date
Application number
IT9022552A
Other languages
English (en)
Other versions
IT1246743B (it
IT9022552A1 (it
Inventor
Camillo Perego
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT02255290A priority Critical patent/IT1246743B/it
Publication of IT9022552A0 publication Critical patent/IT9022552A0/it
Priority to DE69117919T priority patent/DE69117919T2/de
Priority to EP91121515A priority patent/EP0496078B1/en
Priority to US07/813,910 priority patent/US5252052A/en
Priority to JP3347346A priority patent/JPH04333245A/ja
Publication of IT9022552A1 publication Critical patent/IT9022552A1/it
Application granted granted Critical
Publication of IT1246743B publication Critical patent/IT1246743B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
IT02255290A 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato. IT1246743B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
DE69117919T DE69117919T2 (de) 1990-12-28 1991-12-16 Form zur Herstellung von Kunststoffpackungen für integrierte Schaltungen, die eine Wärmesenke enthalten
EP91121515A EP0496078B1 (en) 1990-12-28 1991-12-16 A mold for manufacturing plastics integrated circuits incorporating a heat sink
US07/813,910 US5252052A (en) 1990-12-28 1991-12-23 Mold for manufacturing plastic integrated circuits incorporating a heat sink
JP3347346A JPH04333245A (ja) 1990-12-28 1991-12-27 プラスチック集積回路パッケージを製造するための金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.

Publications (3)

Publication Number Publication Date
IT9022552A0 true IT9022552A0 (it) 1990-12-28
IT9022552A1 IT9022552A1 (it) 1992-06-29
IT1246743B IT1246743B (it) 1994-11-26

Family

ID=11197754

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02255290A IT1246743B (it) 1990-12-28 1990-12-28 Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.

Country Status (5)

Country Link
US (1) US5252052A (it)
EP (1) EP0496078B1 (it)
JP (1) JPH04333245A (it)
DE (1) DE69117919T2 (it)
IT (1) IT1246743B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004047059A1 (de) 2004-09-28 2006-04-20 Osram Opto Semiconductors Gmbh Leiterrahmen für ein elektronisches Bauelement und Verfahren zu dessen Herstellung
JP5180495B2 (ja) * 2007-03-14 2013-04-10 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3238286A (en) * 1962-03-01 1966-03-01 Hermetic Coil Co Inc Method for manufacturing an electrical coil
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
US4453903A (en) * 1981-04-15 1984-06-12 North American Philips Corporation Insert molding gate design for encapsulating electronic ceramics with thermoplastic materials
JPS57191011A (en) * 1981-05-22 1982-11-24 Hitachi Ltd Mold
JPS60182142A (ja) * 1984-02-28 1985-09-17 Toshiba Corp 半導体装置の樹脂封止用金型
JPS6132434A (ja) * 1984-07-24 1986-02-15 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
JPS61170038A (ja) * 1985-01-23 1986-07-31 Toshiba Corp 樹脂封止用金型
JPS6215827A (ja) * 1985-07-12 1987-01-24 Matsushita Electric Ind Co Ltd 封止金型装置
EP0221851B1 (de) * 1985-11-06 1991-12-27 Ego Kunststoffwerk Ag Verfahren und Vorrichtung zur Herstellung eines flexiblen Gliederbandes
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
JP2631990B2 (ja) * 1988-01-21 1997-07-16 トーワ株式会社 電子部品の樹脂封止成形用金型
US5108955A (en) * 1988-10-27 1992-04-28 Citizen Watch Co., Ltd. Method of making a resin encapsulated pin grid array with integral heatsink
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
JPH02306639A (ja) * 1989-05-22 1990-12-20 Toshiba Corp 半導体装置の樹脂封入方法
US5135694A (en) * 1989-11-10 1992-08-04 Seiko Epson Corporation Electronic device wristband
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation

Also Published As

Publication number Publication date
JPH04333245A (ja) 1992-11-20
DE69117919T2 (de) 1996-09-26
IT1246743B (it) 1994-11-26
EP0496078B1 (en) 1996-03-13
EP0496078A1 (en) 1992-07-29
IT9022552A1 (it) 1992-06-29
US5252052A (en) 1993-10-12
DE69117919D1 (de) 1996-04-18

Similar Documents

Publication Publication Date Title
ES2020563B3 (es) Mejoras en la fabricacion de articulos de plastico moldeado.
DE59103615D1 (de) Thermoplastische Formmasse.
DE69127587D1 (de) In Kunststoff eingeformte Halbleiteranordnung
DE69004245D1 (de) Semi-thermoplastische Formmasse mit thermostabilem Formerinnerungsvermögen.
DE69103682D1 (de) Kühlhaltendes Serviertablett.
DE69114675D1 (de) Polyolefin harzzusammensetzung.
IT8321937A0 (it) Procedimento di fabbricazione di un articolo in forma, mediante iniezione-stampaggio, e articolo cosi' ottenuto.
DE69018635D1 (de) Thermoplastische harzzusammensetzung.
DE59003419D1 (de) Recycling-Kunststofformmasse.
DE69229090D1 (de) Integrierte Halbleiterschaltungsanordnung mit Möglichkeit, die Produktspezifikation zu ändern
DE69109737D1 (de) Mehrschichtige geformte Gegenstände.
ITTO910929A1 (it) Procedimento per la fabbricazione di circuiti integrati in tecnologia mos.
ITTO930896A0 (it) Macchina per la fabbricazione di oggetti di materiale plastico mediante termoformatura.
DE69111528D1 (de) Integrierter Halbleiterschaltkreis.
IT8121117A0 (it) Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento.
DE69203057D1 (de) Packung mit Wärmesenke.
DE69101599D1 (de) 2,9-Dichlorochinacridon in Plättchenform.
DE59102255D1 (de) Entgasungsextruder.
DE69416910D1 (de) Wärmesenke für Plastikpackung
DE69113583D1 (de) Thermoplastische harzzusammensetzung.
ITBO980659A0 (it) Stampo per la fabbricazione di articoli in materiale plastico .
IT8468090A1 (it) Procedimento per la fabbricazione di bottiglie, particolarmente bottiglie di materia plastica, mediante stampaggio per iniezione e soffiatura.
IT9022552A0 (it) Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato.
DE69107648D1 (de) Thermoplastische Harzzusammensetzung.
IT1243817B (it) Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato

Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227