JP2008085188A - 絶縁ゲート型半導体装置 - Google Patents
絶縁ゲート型半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 72
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 40
- 239000012535 impurity Substances 0.000 abstract description 56
- 230000015556 catabolic process Effects 0.000 abstract description 38
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 20
- 229920005591 polysilicon Polymers 0.000 abstract description 20
- 230000005684 electric field Effects 0.000 abstract description 6
- 230000002040 relaxant effect Effects 0.000 abstract description 2
- 108091006146 Channels Proteins 0.000 description 67
- 239000010410 layer Substances 0.000 description 27
- 210000000746 body region Anatomy 0.000 description 22
- 239000011229 interlayer Substances 0.000 description 22
- 239000002184 metal Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7808—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】 ゲートパッド電極の下方にもトランジスタセルと連続するチャネル領域を配置する。ゲートパッド電極の下方に位置するチャネル領域をソース電位で固定する。これにより、ゲートパッド電極下方全面にp+型不純物領域を設けなくても、所定のドレイン−ソース間逆方向耐圧を確保することができる。また、ゲートパッド電極下方のストライプ状のポリシリコンに保護ダイオードを形成する。
【選択図】 図4
Description
1a n+型シリコン半導体基板
1b n−型エピタキシャル層
4 チャネル領域
7 トレンチ
11 ゲート絶縁膜
12d 保護ダイオード
121、122、123、124 pn接合ダイオード
13 ゲート電極
13a ゲート引き出し電極
14 ボディ領域
15 ソース領域
16 層間絶縁膜
17 ソース電極
18 ゲートパッド電極
18a ゲート配線
21 動作領域
22 ガードリング
29 p+型不純物領域
31 半導体基板
31a n+型シリコン半導体基板
31b n−型エピタキシャル層
34 チャネル領域
41 ゲート絶縁膜
43 ゲート電極
45 ソース領域
46 層間絶縁膜
47 ソース電極
48 ゲートパッド電極
49 p+型不純物領域
51 動作領域
CH コンタクトホール
Claims (7)
- 一導電型半導体基板と、
該一導電型半導体基板の一主面においてストライプ状に設けられたゲート電極と、
前記ゲート電極に沿って前記一主面にストライプ状に設けられた逆導電型のチャネル領域と、
前記ゲート電極と前記チャネル領域間に設けられた第1絶縁膜と、
前記ゲート電極に沿って前記一主面の前記チャネル領域にストライプ状に設けられた一導電型のソース領域と、
前記ゲート電極上に設けられた第2絶縁膜と、
一部の前記チャネル領域上に前記第2絶縁膜を介して設けられたゲートパッド電極と、
該ゲートパッド電極下方に前記第2絶縁膜を介して設けられたストライプ状のpn接合ダイオードと、
を具備することを特徴とする絶縁ゲート型半導体装置。 - 前記第2絶縁膜に設けたコンタクトホールと、
前記第2絶縁膜上に設けられ、前記コンタクトホールを介して前記ソース領域および前記チャネル領域とコンタクトするソース電極と、を具備することを特徴とする請求項1に記載の絶縁ゲート型半導体装置。 - 前記一導電型半導体基板の周囲に設けられ前記ゲート電極および前記ゲートパッド電極に接続するゲート引き出し電極と、前記ゲート引き出し電極下方の前記基板表面に設けられ前記チャネル領域と接続する高濃度逆導電型領域とを有することを特徴とする請求項1に記載の絶縁ゲート型半導体装置。
- 前記ゲートパッド電極の下方に配置される前記チャネル領域は、前記ゲートパッド電極に隣接して設けられた前記ソース電極と電気的に接続することを特徴とする請求項2に記載の絶縁ゲート型半導体装置。
- 前記pn接合ダイオードの一端にはゲート電位が印加され、該pn接合ダイオードの他端にはソース電位が印加されることを特徴とする請求項1に記載の絶縁ゲート型半導体装置。
- 複数の前記pn接合ダイオードを並列接続し、前記ゲート電極と前記ソース電極間の保護ダイオードを構成することを特徴とする請求項2に記載の絶縁ゲート型半導体装置。
- 前記pn接合ダイオードは、前記ゲート電極と同等の幅を有することを特徴とする請求項1に記載の絶縁ゲート型半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006265386A JP2008085188A (ja) | 2006-09-28 | 2006-09-28 | 絶縁ゲート型半導体装置 |
US11/860,689 US7732869B2 (en) | 2006-09-28 | 2007-09-25 | Insulated-gate semiconductor device |
CN200710161277A CN100576542C (zh) | 2006-09-28 | 2007-09-25 | 绝缘栅型半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006265386A JP2008085188A (ja) | 2006-09-28 | 2006-09-28 | 絶縁ゲート型半導体装置 |
Publications (1)
Publication Number | Publication Date |
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JP2008085188A true JP2008085188A (ja) | 2008-04-10 |
Family
ID=39256204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006265386A Pending JP2008085188A (ja) | 2006-09-28 | 2006-09-28 | 絶縁ゲート型半導体装置 |
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US (1) | US7732869B2 (ja) |
JP (1) | JP2008085188A (ja) |
CN (1) | CN100576542C (ja) |
Cited By (6)
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JP2009043953A (ja) * | 2007-08-09 | 2009-02-26 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
JP2013084979A (ja) * | 2012-12-27 | 2013-05-09 | Fuji Electric Co Ltd | 半導体装置 |
WO2015107742A1 (ja) * | 2014-01-16 | 2015-07-23 | 富士電機株式会社 | 半導体装置 |
JP2018110165A (ja) * | 2016-12-28 | 2018-07-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
WO2020208761A1 (ja) * | 2019-04-11 | 2020-10-15 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
DE112021003165T5 (de) | 2020-06-04 | 2023-04-13 | Mitsubishi Electric Corporation | Halbleitereinheit und leistungswandlereinheit |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008085188A (ja) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP5511124B2 (ja) * | 2006-09-28 | 2014-06-04 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 絶縁ゲート型半導体装置 |
JP5337470B2 (ja) * | 2008-04-21 | 2013-11-06 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 絶縁ゲート型半導体装置 |
US8278683B2 (en) * | 2008-08-06 | 2012-10-02 | Texas Instruments Incorporated | Lateral insulated gate bipolar transistor |
JP5525736B2 (ja) * | 2009-02-18 | 2014-06-18 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置及びその製造方法 |
WO2011105397A1 (ja) | 2010-02-25 | 2011-09-01 | 国立大学法人北海道大学 | 半導体装置及び半導体装置の製造方法 |
JP2013201287A (ja) * | 2012-03-26 | 2013-10-03 | Toshiba Corp | パワー半導体装置 |
JP5990437B2 (ja) * | 2012-09-10 | 2016-09-14 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US9006798B2 (en) * | 2013-05-03 | 2015-04-14 | Infineon Technologies Ag | Semiconductor device including trench transistor cell array and manufacturing method |
DE102014005879B4 (de) * | 2014-04-16 | 2021-12-16 | Infineon Technologies Ag | Vertikale Halbleitervorrichtung |
JP6523887B2 (ja) * | 2015-09-11 | 2019-06-05 | 株式会社東芝 | 半導体装置 |
US9614041B1 (en) * | 2015-09-11 | 2017-04-04 | Nxp Usa, Inc. | Multi-gate semiconductor devices with improved hot-carrier injection immunity |
US10411006B2 (en) * | 2016-05-09 | 2019-09-10 | Infineon Technologies Ag | Poly silicon based interface protection |
JP2019160877A (ja) * | 2018-03-08 | 2019-09-19 | トヨタ自動車株式会社 | 半導体装置 |
JP7000240B2 (ja) * | 2018-04-18 | 2022-01-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP7371335B2 (ja) * | 2019-03-13 | 2023-10-31 | 富士電機株式会社 | 半導体装置 |
US11164813B2 (en) * | 2019-04-11 | 2021-11-02 | Cree, Inc. | Transistor semiconductor die with increased active area |
CN113035714A (zh) * | 2019-12-25 | 2021-06-25 | 华润微电子(重庆)有限公司 | 一种沟槽型功率器件及其制作方法 |
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JP2009043953A (ja) * | 2007-08-09 | 2009-02-26 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
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JPWO2015107742A1 (ja) * | 2014-01-16 | 2017-03-23 | 富士電機株式会社 | 半導体装置 |
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JP2018110165A (ja) * | 2016-12-28 | 2018-07-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
WO2020208761A1 (ja) * | 2019-04-11 | 2020-10-15 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
JPWO2020208761A1 (ja) * | 2019-04-11 | 2021-04-30 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
CN113646895A (zh) * | 2019-04-11 | 2021-11-12 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
US11842895B2 (en) | 2019-04-11 | 2023-12-12 | Mitsubishi Electric Corporation | Semiconductor device and power conversion device |
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Also Published As
Publication number | Publication date |
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US20080079079A1 (en) | 2008-04-03 |
CN100576542C (zh) | 2009-12-30 |
CN101154663A (zh) | 2008-04-02 |
US7732869B2 (en) | 2010-06-08 |
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